arXiv subjects

Julie Segal

Publications and source records attributed to Julie Segal.

5 recordsLinked to original sources

arXiv2026

Towards 6D Tracking: A Study Of Using Fast-Timing For Measuring Track Position, Time, And Angles

Next-generation particle tracking detectors will incorporate precision timing capabilities with resolutions approaching tens of picoseconds. Using Technology Computer-Aided Design (TCAD) simulations of Low-Gain Avalanche Diode (LGAD) detectors, we demonstrate that tilted particle tracks traversing multiple pixels exhibit systematic timing variations of hundreds of picoseconds between adjacent pixels. We derive an analytical linear model relating inter-pixel timing differences to incident track angles, enabling single-layer angular reconstruction with a precision of a few degrees for tracks which traverse at least three pixels. Stochastic energy loss fluctuations (Landau fluctuations) impose a fundamental limit on both angular resolution and reconstruction efficiency. Comparison with neural network approaches demonstrates that the linear model achieves near-optimal angular resolution, indicating that the physics of charge collection geometry, rather than algorithmic sophistication, dominates the achievable angular resolution.

physics.ins-det↗

arXiv2026

Active Edge Silicon Sensors Fabricated With Edge Ion Implantation and Microwave Annealing for Dopant Activation

Silicon detectors typically require an insensitive area around their periphery to accommodate guard rings, which help maintain the electric field uniformity around edge pixels and isolate the high leakage current from the physical edges of the detector. Minimization of this insensitive region is desirable for applications in high-energy physics, X-ray experiments, and medical imaging. Existing active edge technology offers a solution for reduction or total elimination of the insensitive region, via a continuation of the highly doped backside up the sidewalls of the device. However, current methods for realizing this technology are complex and expensive. We propose a new technique that simplifies the fabrication of highly doped edges using side ion implantation and microwave annealing. Tests demonstrating the feasibility of this proposed process were performed on a set of sensors, and current versus bias voltage measurements probing the edge effects were performed before and after the edge implantation and annealing. To aid in interpretation of the results, TCAD simulations of the test devices were performed. Significant improvement in the edge leakage current is observed, indicating the promise of this simplified process for fabrication of active edge sensors.

physics.ins-det↗

arXiv2024

Skipper-in-CMOS: Non-Destructive Readout with Sub-Electron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the non-destructive readout capability of Skipper Charge Coupled Devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode in a CMOS imaging process, while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a 15 x 15 um^2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor's commercial 180 nm CMOS Image Sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep sub-electron noise of 0.15rms e-, demonstrating the charge transfer operation from the pinned photodiode and the single photon counting operation when the sensor is exposed to light. The article also discusses new testing strategies employed for its operation and characterization.

astro-ph.IM↗

arXiv2022

Monolithic Active Pixel Sensors on CMOS technologies

Collider detectors have taken advantage of the resolution and accuracy of silicon detectors for at least four decades. Future colliders will need large areas of silicon sensors for low mass trackers and sampling calorimetry. Monolithic Active Pixel Sensors (MAPS), in which Si diodes and readout circuitry are combined in the same pixels, and can be fabricated in some of standard CMOS processes, are a promising technology for high-granularity and light detectors. In this paper we review 1) the requirements on MAPS for trackers and electromagnetic calorimeters (ECal) at future colliders experiments, 2) the ongoing efforts towards dedicated MAPS for the Electron-Ion Collider (EIC) at BNL, for which the EIC Silicon Consortium was already instantiated, and 3) space-born applications for MeV $γ$-ray experiments with MAPS based trackers (AstroPix).

physics.ins-det↗

arXiv2018

Quantum Sensing for High Energy Physics

Report of the first workshop to identify approaches and techniques in the domain of quantum sensing that can be utilized by future High Energy Physics applications to further the scientific goals of High Energy Physics.

hep-ex↗