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Junghwa Kim

Publications and source records attributed to Junghwa Kim.

3 recordsLinked to original sources

Microstructural and preliminary optical and microwave characterization of erbium doped CaMoO$_4$ thin films

This work explores erbium-doped calcium molybdate (CaMoO$_4$) thin films grown on silicon and yttria stabilized zirconia (YSZ) substrates, as a potential solid state system for C-band (utilizing the $\sim$1.5 $\mu$m Er$^{3+}$ 4f-4f transition) quantum emitters for quantum network applications. Through molecular beam epitaxial growth experiments and electron microscopy, X-ray diffraction and reflection electron diffraction studies, we identify an incorporation limited deposition regime that enables a 1:1 Ca:Mo ratio in the growing film leading to single phase CaMoO$_4$ formation that can be in-situ doped with Er (typically 2-100 ppm). We further show that growth on silicon substrates is single phase but polycrystalline in morphology; while growth on YSZ substrates leads to high-quality epitaxial single crystalline CaMoO$_4$ films. We perform preliminary optical and microwave characterization on the suspected $Y_1 - Z_1$ transition of 2 ppm, 200 nm epitaxial CaMoO$_4$ annealed thin films and extract an optical inhomogeneous linewidth of 9.1(1) GHz, an optical excited state lifetime of 6.7(2) ms, a spectral diffusion-limited homogeneous linewidth of 6.7(4) MHz, and an EPR linewidth of 1.10(2) GHz.

cond-mat.mtrl-sci

Quantifying Implantation Induced Damage and Point Defects with Multislice Electron Ptychography

Here, we use multislice electron ptychography to quantify damage introduced by ion implantation of Er into 4H-SiC. Comparing reconstructed volumes from experiment (each 2,000 nm$^{3}$) along the implantation direction, the crystal damage is quantified and compared to pristine SiC. Using simulations, we establish that the implantation-induced static displacements limit both Er dopant and silicon vacancy detection. The corresponding damage in the experiment is found to occur up a depth of 100 nm and significantly deeper than expected from implantation simulations, ignoring crystallography. Beyond this depth, we show that silicon vacancies can be identified within the sampled volume and used to measure their local strain. Overall, these results underscore the power of multislice electron ptychography to quantify the impacts of implantation and as a tool to help guide electronic device process optimization.

cond-mat.mtrl-sci

Sensitivity of Multislice Electron Ptychography to Point Defects: A Case Study in SiC

Here, we evaluate multislice electron ptychography as a tool to carry out depth-resolved atomic resolution characterization of point defects, using silicon carbide as a case study. Through multislice electron scattering simulations and multislice ptychographic reconstructions, we investigate the phase contrast arising from individual silicon vacancies, antisite defects, and a wide range of substitutional transition metal dopants (V\textsubscript{Si} to W\textsubscript{Si}) and potential detectability. Simulating defect types, positions, and microscope conditions, we show that isolated point defects can be located within a unit cell along the sample's depth. The influence of electron energy, dose, defocus, and convergence semi-angle is also explored to determine their role in governing defect contrast. These results guide experiments aiming to analyze point defects with multislice electron ptychography.

cond-mat.mtrl-sci