arXiv subjects

K. Heijhoff

Publications and source records attributed to K. Heijhoff.

11 recordsLinked to original sources

arXiv2026

Testbeam characterization of a 3D silicon sensor read out by Timepix4

Testbeam results from a $300\,\mu\mathrm{m}$-thick 3D silicon sensor bump-bonded to a Timepix4 ASIC, are presented. The hit detection efficiency, spatial resolution, and timing performance of the 3D sensor are studied for several track angles, bias voltages and charge thresholds. The time measurements are corrected for Timepix4 clock-frequency variations and timewalk, while for the spatial studies, nonlinear charge-sharing corrections are determined. At perpendicular incidence, the time resolution of the 3D detector is equal to $245\,\mathrm{ps}$ with a $97\%$ hit detection efficiency. An optimal angle of $8^\circ$ with respect to the beam direction of the 3D detector was found, in which the time resolution improves by $6\%$ compared to normal incidence, while the hit detection efficiency reaches above $99\%$ and the spatial resolution is approximately $7\,\mu\mathrm{m}$. Intrapixel studies show that a time resolution of $153\,\mathrm{ps}$ at the most probable value of the signal charge can be achieved for hits between the electrodes at normal incidence, while the timing performance of these best-performing regions deteriorate upon sensor rotation. The timing properties at different depths of the 3D sensor have been investigated with tracks at grazing-angle incidence, revealing a dependence of the time resolution along the sensor depth.

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arXiv2025

Embedding the Timepix4 in Micro-Pattern Gaseous Detectors

The combination of Micro-Pattern Gaseous Detectors (MPGDs) and pixel charge readout enables specific experimental opportunities. Using the Timepix4 for the readout is advantageous because of its size (around 7 cm^2 active area) and its Through Silicon Vias. The latter enables to connect to the Timepix4 from the back side. Thus, it can be tiled on four sides, allowing it to cover large areas without loss of active area. Here, the first results of reading out MPGDs with the Timepix4 are presented. Measurements with a Gas Electron Multiplier (GEM) detector show that event selection based on geometrical parameters of the interaction is possible, X-ray imaging studies can be performed, as well as energy and time-resolved measurements. In parallel, the embedding of a Timepix4 into a micro-resistive Well (uRWell) amplification structure is explored. The first mechanical tests have been successful. The status of the electrical functionality is presented, as well as simulation studies on the signal induction in such a device.

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arXiv2024

Towards MPGDs with embedded pixel ASICs

Combining gaseous detectors with a high-granularity pixelated charge readout enables experimental applications which otherwise could not be achieved. This includes high-resolution tracking of low-energetic particles, requiring ultra-low material budget, X-ray polarimetry at low energies ($\lessapprox$ 2 keV) or rare-event searches which profit from event selection based on geometrical parameters. In this article, the idea of embedding a pixel ASIC - specifically the Timepix4 - into a micro-pattern gaseous amplification stage is illustrated. Furthermore, the first results of reading out a triple-GEM detector with the Timepix4 (GEMPix4) are shown, including the first X-ray images taken with a Timepix4 utilising Through Silicon Vias (TSVs). Lastly, a new readout concept is presented, called the 'Silicon Readout Board', extending the use of pixel ASICs to read out gaseous detectors to a wider range of HEP applications.

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arXiv2022

Timing performance of the Timepix4 front-end

A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to-digital converter (TDC) and measure the time-bin sizes by precisely controlling the test-pulse arrival time in steps of 10 ps. The results indicate that the TDC can achieve a time resolution of 60 ps, provided that a calibration is performed to compensate for frequency variation in the voltage controlled oscillators of the pixel TDCs. The internal clock distribution system of Timepix4 was used to control the arrival time of internally generated analog test pulses in steps of about 20 ps. The analog test pulse mechanism injects a controlled amount of charge directly into the analog front-end (AFE) of the pixel, and was used to measure the time resolution as a function of signal charge, independently of the TDC. It was shown that for the default configuration, the AFE time resolution in the hole-collecting mode is limited to 105 ps. However, this can be improved up to about 60 ps by increasing the preamplifier bias-current at the cost of increased power dissipation. For the electron-collecting mode, an AFE time resolution of 47 ps was measured for a bare Timepix4 device at a signal charge of 21 ke. It was observed that additional input capacitance from a bonded sensor reduces this figure to 62 ps.

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arXiv2021

Charge and temporal characterisation of silicon sensors using a two-photon absorption laser

First measurements are presented from a newly commissioned two-photon absorption (TPA) setup at Nikhef. The characterisation of the various components of the system is discussed. Two planar silicon sensors, one being electron collecting and one hole collecting, are characterised with detailed measurements of the charge collection and time resolution. The TPA spot is determined to have a radius of 0.975(11) $\mu\text{m}$ and length of 23.8 $\mu\text{m}$ in silicon. The trigger time resolution of the system is shown to be maximally 30.4 ps. For both sensors, uniform charge collection is observed over the pixels, and the pixel side metallisation is imaged directly using the TPA technique. The best time resolution for a single pixel is found to be 600 ps and 560 ps for the electron and hole collecting sensors respectively, and is dominated by ASIC contributions. Further scans at different depths in the sensor and positions within the pixels have been performed and show a uniform response. It is concluded that the TPA setup is a powerful tool to investigate the charge collection and temporal properties of silicon sensors.

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arXiv2021

Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam

Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar sensor on Timepix3. It is shown that for a perpendicularly incident beam the time resolution of both detectors is dominated by the Timepix3 front-end. The 3D detector is dominated by the time-to-digital conversion whereas the analog front-end jitter also gives a significant contribution for the thin planar detector. The 3D detector reaches an overall time resolution of 567(6)ps compared to 683(8)ps for the thin planar detector. For a grazing angle beam, however, the thin planar detector achieves a better time resolution because it has a lower pixel capacitance, and therefore suffers less from jitter in the analog front-end for the low charge signals that mainly occur in this type of measurement. Finally, it is also shown that the 3D and thin planar detector can achieve time resolutions for large clusters of about 100ps and 250ps, respectively, by combining many single hit measurements.

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arXiv2020

Charge collection properties of prototype sensors for the LHCb VELO upgrade

An extensive sensor testing campaign is presented, dedicated to measuring the charge collection properties of prototype candidates for the Vertex Locator (VELO) detector for the upgraded LHCb experiment. The charge collection is measured with sensors exposed to fluences of up to $8 \times 10^{15}~1~\mathrm{\,Me\kern -0.1em V}~ \mathrm{ \,n_{eq}}~{\mathrm{ \,cm}}^{-2}$, as well as with nonirradiated prototypes. The results are discussed, including the influence of different levels of irradiation and bias voltage on the charge collection properties. Charge multiplication is observed on some sensors that were nonuniformly irradiated with 24 GeV protons, to the highest fluence levels. An analysis of the charge collection near the guard ring region is also presented, revealing significant differences between the sensor prototypes. All tested sensor variants succeed in collecting the minimum required charge of 6000 electrons after the exposure to the maximum fluence.

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arXiv2020

Timing performance of the LHCb VELO Timepix3 Telescope

We performed a detailed study of the timing performance of the LHCb VELO Timepix3 Telescope with a 180 GeV/c mixed hadron beam at the CERN SPS. A twofold method was developed to improve the resolution of single-plane time measurements, resulting in a more precise overall track time measurement. The first step uses spatial information of reconstructed tracks in combination with the measured signal charge in the sensor to correct for a mixture of different effects: variations in charge carrier drift time; variations in signal induction, which are the result of a non-uniform weighting field in the pixels; and lastly, timewalk in the analog front-end. The second step corrects for systematic timing offsets in Timepix3 that vary from -2 ns to 2 ns. By applying this method, we improved the track time resolution from 438$\,\pm\,$16 ps to 276$\,\pm\,$4 ps.

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arXiv2019

Performance of a GridPix TPC readout based on the Timepix3 chip

With the ultimate goal of developing a pixel-based readout for a TPC at the ILC, a GridPix readout system consisting of one Timepix3 chip with an integrated amplification grid was embedded in a prototype detector. The performance was studied in a testbeam with 2.5 GeV electrons at the ELSA accelerator in Bonn. The error on the track position measurement both in the drift direction and in the readout plane is dominated by diffusion. Systematic uncertainties are limited to below 10 $\mu$m. The GridPix can detect single ionization electrons with high efficiency, which allows for energy loss measurements and particle identification. From a truncated sum, an energy loss (dE/dx) resolution of 4.1% is found for an effective track length of 1 m. Using the same type of chips, a Quad module was developed that can be tiled to cover a TPC readout plane at the ILC. Simulation studies show that a pixel readout can improve the momentum resolution of a TPC at the ILC by about 20%.

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arXiv2019

Timewalk correction for the Timepix3 chip obtained with real particle data

In this work we have developed a prototype gaseous pixel detector by combining a micromegas grid with a Timepix3 chip for the readout. The micromegas foil supported by a matrix of pillars about 50 $\mathrm{\mu m}$ high was manually placed on top the chip. By placing a cathode foil above the chip an ionization detector was created with a drift gap of 13.5 mm. The Timepix3 chip, thanks to the simultaneous measurement of the time-of-arrival (ToA) and charge via time-over-threshold (ToT) allows corrections to remaining timewalk effects, improving further the position resolution along the drift direction. We present the timewalk correction for Timepix3 chip obtained with real data from a particle beam and its impact on the tracking performance. The results obtained show an significant improvement on the position resolution for single-hits and tracks along the drift direction compared to previous experiments.

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arXiv2018

Performance of a GridPix detector based on the Timepix3 chip

A GridPix readout for a TPC based on the Timepix3 chip is developed for future applications at a linear collider. The GridPix detector consists of a gaseous drift volume read out by a single Timepix3 chip with an integrated amplification grid. Its performance is studied in a test beam with 2.5 GeV electrons. The GridPix detector detects single ionization electrons with high efficiency. The Timepix3 chip allowed for high sample rates and time walk corrections. Diffusion is found to be the dominating error on the track position measurement both in the pixel plane and in the drift direction, and systematic distortions in the pixel plane are below 10 $\mu$m. Using a truncated sum, an energy loss (dE/dx) resolution of 4.1% is found for an effective track length of 1 m.

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