arXiv subjects

Kaiyuan Lin

Publications and source records attributed to Kaiyuan Lin.

8 recordsLinked to original sources

arXiv2026

OmniCAD: A Large-Scale Benchmark for 3D Spatial Reasoning in Robotics Assemblies

Recent vision-language models (VLMs) show strong capabilities in robotic perception and spatial reasoning, yet their ability to reason about complex mechanical assemblies remains underexplored. We introduce OmniCAD, a large-scale benchmark for assembly-aware 3D spatial reasoning across diverse industrial systems, including robotic mechanisms, automotive components, aerospace structures, and agricultural machinery. OmniCAD contains 25k mechanical assemblies, with an average of 12 parts per assembly and 21 types of mate relationships. Each assembly includes a human-verified ground-truth 3D model and renderings from 20 viewpoints. The benchmark evaluates three capabilities: (1) component-level 3D spatial reasoning, requiring prediction of part positions and orientations; (2) part-to-part relational reasoning, requiring identification of mating relationships and assembly constraints; and (3) tool-augmented agentic reasoning, where models iteratively select viewpoints, inspect visual evidence, and refine predictions. Experiments show that current VLMs struggle with industrial assembly reasoning, often producing inaccurate poses, invalid mating relationships, part interpenetration, and degraded performance as assembly complexity increases. We will open-source the benchmark, evaluation code, and tool interfaces to support research on accurate, physically valid, and scalable 3D assembly reasoning.

cs.CV↗

arXiv2026

OmniMech: All-in-one Multimodal Mechanical Benchmark for 3D Reconstruction

Recent vision-language models (VLMs) can generate executable CAD programs from images, but existing methods mainly target coarse, general-purpose 3D objects and rarely address the fine-grained geometry and millimeter-level tolerances required in industrial mechanical design. We introduce OmniMech, the first million-scale benchmark for evaluating VLMs on executable CAD generation from industrial manufacturing data. OmniMech contains more than 251,000 fully dimensioned and toleranced 2D orthographic drawings, paired with native CAD models, multi-view renderings, mesh, STEP and B-rep representations, and rich semantic annotations. The benchmark includes four tasks: (1) parametric CAD program synthesis from engineering drawings; (2) diagram-to-3D reasoning for geometrically and structurally consistent reconstruction; (3) annotation-grounded reasoning over dimensions, symbols, feature callouts, and manufacturing constraints; and (4) tool-augmented agentic reasoning using visualization, measurement, CAD execution, and verification tools. Experiments show that current VLMs and CAD-specialized models still struggle with executable program synthesis, fine-grained 3D reconstruction, and reliable enforcement of dimensions and tolerances. We will release the benchmark data, evaluation code, and tool interfaces to support future research.

cs.CV↗

arXiv2026

OmniRouting: A Semantic-Coupled Multimodal Benchmark for Constraint-Aware Spatial Reasoning in PCB Routing

Recent large language models (LLMs) have demonstrated remarkable progress in constraint-aware navigation, maze reasoning, and graph reasoning. However, their ability to reason about complex routing problems under strict geometric, topological, and electrical constraints remains largely unexplored, despite routing being one of the most challenging and critical stages of electronic design automation (EDA). To bridge this gap, we introduce OmniRouting, the first large-scale benchmark designed to evaluate LLMs on printed-circuit-board (PCB) routing reasoning under real-world industrial design-rule, manufacturability, and connectivity constraints. OmniRouting contains 1,681 industrial-grade schematic-coupled PCB designs, including board geometries, routable component placements by human engineers, footprints, pad locations, netlists, stackup information, and routing constraints. The benchmark comprises four tasks: (1) geometric routing reasoning, generating physically valid copper traces, vias, and layer assignments to connect circuit nets within constrained board regions; (2) design-rule-aware routing reasoning, producing routable layouts that satisfy clearance, trace-width, via, obstacle-avoidance, and board-boundary constraints; (3) electrical functionality reasoning, preserving schematic-specified connectivity while reasoning over net names and functional roles to produce electrically correct routing; and (4) tool-augmented agentic routing, leveraging external tools for tasks (1)-(3). Our results reveal substantial limitations of current LMMs in PCB routing, including weak path-planning capabilities, poor adherence to design-rule constraints, and inconsistent preservation of electrical functionality. We will open-source all benchmark data, evaluation code, and tool interfaces to facilitate future research.

cs.CV↗

arXiv2026

OmniLayout: A Schematic-Coupled Multimodal Benchmark for Constraint-Aware Geometric Reasoning in PCB Layout

Recent large language models (LLMs) have demonstrated remarkable progress in 3D spatial reasoning, spatial grounding, and fine-grained geometric understanding. However, their ability to reason about densely packed object placement under strict spatial and functional constraints remains largely unexplored, despite being a fundamental challenge in practical electronic design automation (EDA) workflows. To bridge this gap, we introduce OmniLayout, the first benchmark designed to evaluate LLMs on printed-circuit-board (PCB) layout placement reasoning under real-world geometric, routing, and connectivity constraints. OmniLayout contains 1,681 industrial-grade schematic-coupled PCB layouts and includes four tasks: (1) geometric reasoning for IC physical placement, with 77.24K placement instances constrained within PCB board boundaries; (2) routability-aware placement reasoning, generating physically valid component placements; (3) electrical functionality, preserving schematic-specified connectivity and electronic functional correctness; and (4) tool-augmented agentic reasoning for invoking external tools to accomplish tasks (1)-(3). Our results reveal substantial limitations of current LLMs in PCB layout placement, including weak geometric reasoning, poor routability optimization, and inconsistent preservation of electrical functionality.

cs.CV↗

arXiv2026

OmniSch: A Multimodal PCB Schematic Benchmark For Structured Diagram Visual Reasoning

Recent large multimodal models (LMMs) have made rapid progress in visual grounding, document understanding, and diagram reasoning tasks. However, their ability to convert Printed Circuit Board (PCB) schematic diagrams into machine-readable spatially weighted netlist graphs, jointly capturing component attributes, connectivity, and geometry, remains largely underexplored, despite such graph representations are the backbone of practical electronic design automation (EDA) workflows. To bridge this gap, we introduce OmniSch, the first comprehensive benchmark designed to assess LMMs on schematic understanding and spatial netlist graph construction. OmniSch contains 1,854 real-world schematic diagrams and includes four tasks: (1) visual grounding for schematic entities, with 109.9K grounded instances aligning 423.4K diagram semantic labels to their visual regions; (2) diagram-to-graph reasoning, understanding topological relationship among diagram elements; (3) geometric reasoning, constructing layout-dependent weights for each connection; and (4) tool-augmented agentic reasoning for visual search, invoking external tools to accomplish (1)-(3). Our results reveal substantial gaps of current LMMs in interpreting schematic engineering artifacts, including unreliable fine-grained grounding, brittle layout-to-graph parsing, inconsistent global connectivity reasoning and inefficient visual exploration.

cs.CV↗

arXiv2025

A Large Language Model Powered Integrated Circuit Footprint Geometry Understanding

Printed-Circuit-board (PCB) footprint geometry labeling of integrated circuits (IC) is essential in defining the physical interface between components and the PCB layout, requiring exceptional visual perception proficiency. However, due to the unstructured footprint drawing and abstract diagram annotations, automated parsing and accurate footprint geometry modeling remain highly challenging. Despite its importance, no methods currently exist for automated package geometry labeling directly from IC mechanical drawings. In this paper, we first investigate the visual perception performance of Large Multimodal Models (LMMs) when solving IC footprint geometry understanding. Our findings reveal that current LMMs severely suffer from inaccurate geometric perception, which hinders their performance in solving the footprint geometry labeling problem. To address these limitations, we propose LLM4-IC8K, a novel framework that treats IC mechanical drawings as images and leverages LLMs for structured geometric interpretation. To mimic the step-by-step reasoning approach used by human engineers, LLM4-IC8K addresses three sub-tasks: perceiving the number of pins, computing the center coordinates of each pin, and estimating the dimensions of individual pins. We present a two-stage framework that first trains LMMs on synthetically generated IC footprint diagrams to learn fundamental geometric reasoning and then fine-tunes them on real-world datasheet drawings to enhance robustness and accuracy in practical scenarios. To support this, we introduce ICGeo8K, a multi-modal dataset with 8,608 labeled samples, including 4138 hand-crafted IC footprint samples and 4470 synthetically generated samples. Extensive experiments demonstrate that our model outperforms state-of-the-art LMMs on the proposed benchmark.

cs.CV↗

arXiv2024

DTPPO: Dual-Transformer Encoder-based Proximal Policy Optimization for Multi-UAV Navigation in Unseen Complex Environments

Existing multi-agent deep reinforcement learning (MADRL) methods for multi-UAV navigation face challenges in generalization, particularly when applied to unseen complex environments. To address these limitations, we propose a Dual-Transformer Encoder-based Proximal Policy Optimization (DTPPO) method. DTPPO enhances multi-UAV collaboration through a Spatial Transformer, which models inter-agent dynamics, and a Temporal Transformer, which captures temporal dependencies to improve generalization across diverse environments. This architecture allows UAVs to navigate new, unseen environments without retraining. Extensive simulations demonstrate that DTPPO outperforms current MADRL methods in terms of transferability, obstacle avoidance, and navigation efficiency across environments with varying obstacle densities. The results confirm DTPPO's effectiveness as a robust solution for multi-UAV navigation in both known and unseen scenarios.

cs.MA↗

arXiv2022

TeleSHift: Telexisting TUI for Physical Collaboration & Interaction

Current workflow on co-editing and simultaneous presentation of 3-D shapes is confined to on-screen manipulation, which causes loss of perceived information when presenting perceptual concepts or complex shapes between members. Thus, we create TeleSHift, a 3-D tangible user interface (TUI) with a telexisting communication framework for group-based collaboration and demonstration. In this work, we present a larger-scaled proof-of-concept prototype providing hands-on operation for shape-based interactions including multi-sided collaboration and one-to-many presentation. In contrast to previous works, we further extend the use of TUIs to support cooperative tasks with telexistence while enabling the linkage of manipulable bits to provide a better user experience and interactivity.

cs.HC↗