arXiv subjects

Kestutis Grigoras

Publications and source records attributed to Kestutis Grigoras.

10 recordsLinked to original sources

arXiv2026

SC-1 Etching of Niobium and Titanium Nitride Thin Films

Dry etching techniques, ubiquitous in microelectronics fabrication, often result in challenging levels of undesired collateral plasma-induced damage. In this work, we demonstrate a wet etching alternative for the patterning of niobium (Nb) and titanium nitride (TiN) thin films using the Standard Cleaning 1 (SC-1) solution. We characterize the etching process through its time-evolution dynamics, supported by scanning-electron and atomic force microscopy assessment of the etched film morphology. The results suggest etch dynamics that are linked to native oxides and film microstructure. Overall, the manageable etch rates, the safe operation and the high material selectivity are attractive for practical use in microelectronics fabrication.

cond-mat.mtrl-sci↗

arXiv2023

Experimentally verified, fast analytic and numerical design of superconducting resonators in flip-chip architectures

In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator's parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method's validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.

quant-ph↗

arXiv2022

Transmon qubit readout fidelity at the threshold for quantum error correction without a quantum-limited amplifier

High-fidelity and rapid readout of a qubit state is key to quantum computing and communication, and it is a prerequisite for quantum error correction. We present a readout scheme for superconducting qubits that combines two microwave techniques: applying a shelving technique to the qubit that effectively increases the energy-relaxation time, and a two-tone excitation of the readout resonator to distinguish among qubit populations in higher energy levels. Using a machine-learning algorithm to post-process the two-tone measurement results further improves the qubit-state assignment fidelity. We perform single-shot frequency-multiplexed qubit readout, with a 140ns readout time, and demonstrate 99.5% assignment fidelity for two-state readout and 96.9% for three-state readout - without using a quantum-limited amplifier.

quant-ph↗

arXiv2022

Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor

We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\,μs$, single-qubit gate fidelities exceeding $99.9\%$, and two-qubit gate fidelities above $98.6\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

quant-ph↗

arXiv2021

Microkelvin electronics on a pulse-tube cryostat with a gate Coulomb blockade thermometer

Access to lower temperatures has consistently enabled scientific breakthroughs. Pushing the limits of \emph{on-chip} temperatures deep into the microkelvin regime would open the door to unprecedented quantum coherence, novel quantum states of matter, and also the discovery of unexpected phenomena. Adiabatic demagnetization is the workhorse of microkelvin cooling, requiring a dilution refrigerator precooling stage. Pulse-tube dilution refrigerators have grown enormously in popularity due to their vast experimental space and independence of helium, but their unavoidable vibrations are making microkelvin cooling very difficult. On-chip thermometry in this unexplored territory is also not a trivial task due to extreme sensitivity to noise. Here, we present a pulse-tube compatible microkelvin sample holder with on-board cooling and microwave filtering and introduce a new type of temperature sensor, the gate Coulomb blockade thermometer (gCBT), working deep into the microkelvin regime. Using on- and off-chip cooling, we demonstrate electronic temperatures as low as 224$\pm$7$μ$K, remaining below 300$μ$K for 27 hours, thus providing sufficient time for measurements. Finally, we give an outlook for cooling below 50$μ$K for a new generation of microkelvin transport experiments.

cond-mat.mes-hall↗

arXiv2021

Nano-thermoelectric infrared bolometers

Infrared (IR) radiation detectors are used in numerous applications from thermal imaging to spectroscopic gas sensing. Obtaining high speed and sensitivity, low-power operation and cost-effectiveness with a single technology remains to be a challenge in the field of IR sensors. By combining nano-thermoelectric transduction and nanomembrane photonic absorbers, we demonstrate uncooled IR bolometer technology that is material-compatible with large-scale CMOS fabrication and provides fast and high sensitivity response to long-wavelength IR (LWIR) around 10 $μ$m. The fast operation speed stems from the low heat capacity metal layer grid absorber connecting the sub-100 nm-thick n- and p-type Si nano-thermoelectric support beams, which convert the radiation induced temperature rise into voltage. The nano-thermoelectric transducer-support approach benefits from enhanced phonon surface scattering in the beams leading to reduction in thermal conductivity, which enhances the sensitivity. We demonstrate different size nano-thermoelectric bolometric photodetector pixels with LWIR responsitivities, specific detectivities and time constants in the ranges 179-2930 V/W, 0.15-3.1$\cdot10^{8}$ cmHz$^{1/2}$/W and 66-3600 $μ$s, respectively. We benchmark the technology against different LWIR detector solutions and show how nano-thermoelectric detector technology can reach the fundamental sensitivity limits posed by phonon and photon thermal fluctuation noise.

physics.app-ph↗

arXiv2020

Properties of Nanocrystalline Silicon Probed by Optomechanics

Nanocrystalline materials exhibit properties that can differ substantially from those of their single crystal counterparts. As such, they provide ways to enhance and optimise their functionality for devices and applications. Here we report on the optical, mechanical and thermal properties of nanocrystalline silicon probed by means of optomechanical nanobeams to extract information of the dynamics of optical absorption, mechanical losses, heat generation and dissipation. The optomechanical nanobeams are fabricated using nanocrystalline films prepared by annealing amorphous silicon layers at different temperatures. The resulting crystallite sizes and the stress in the films can be controlled by the annealing temperature and time and, consequently, the properties of the films can be tuned relatively freely, as demonstrated here by means of electron microscopy and Raman scattering. We show that the nanocrystallite size and the volume fraction of the grain boundaries play a key role in the dissipation rates through non-linear optical and thermal processes. Promising optical (13000) and mechanical (1700) quality factors were found in the optomechanical cavity realised in the nanocrystalline Si resulting from annealing at 950 C. The enhanced absorption and recombination rates via the intra-gap states and the reduced thermal conductivity boost the potential to exploit these non-linear effects in applications, including NEMS, phonon lasing and chaos-based devices.

physics.app-ph↗

arXiv2018

Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples

A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the bidirectional 3-omega method. The platform is composed of glass substrates on which sensor structures and a very thin dielectric nanolaminate passivation layer are fabricated. Using through-glass vias for contacting the sensors from the chip back side leaves the top side of the platform free for deposition, manipulation and optical inspection of the sample during 3-omega measurements. The thin passivation layer, which is deposited by atomic layer deposition on the platform surface, provides superior chemical resistance and allows for the measurement of electrically conductive samples, while maintaining the conditions for a simple thermal analysis. We demonstrate the measurement of thermal conductivities of borosilicate glass, pure water, glycerol, 2-propanol, PDMS, cured epoxy, and heat-sink compounds. The results compare well with both literature values and values obtained with the steady-state divided bar method. Small sample volumes (~0.02 mm$^2$) suffice for accurate measurements using the platform, allowing rapid temperature-dependent measurements of thermal properties, which can be useful for the development, optimization and quality testing of many materials, such as liquids, gels, pastes and solids.

physics.ins-det↗

arXiv2017

Thermoelectric bolometers based on ultra-thin heavily doped single-crystal silicon membranes

We present ultra-thin silicon membrane thermocouple bolometers suitable for fast and sensitive detection of low levels of thermal power and infrared radiation at room temperature. The devices are based on 40 nm-thick strain tuned single crystalline silicon membranes shaped into heater/absorber area and narrow n- and p-doped beams, which operate as the thermocouple. The electro-thermal characterization of the devices reveal noise equivalent power of 13 pW/rtHz and thermal time constant of 2.5 ms. The high sensitivity of the devices is due to the high Seebeck coefficient of 0.39 mV/K and reduction of thermal conductivity of the Si beams from the bulk value. The bolometers operate in the Johnson-Nyquist noise limit of the thermocouple, and the performance improvement towards the operation close to the temperature fluctuation limit is discussed.

cond-mat.mes-hall↗

arXiv2016

Conformal Titanium Nitride in a Porous Silicon Matrix: a Nanomaterial for In-Chip Supercapacitors

Today's supercapacitor energy storages are typically discrete devices aimed for printed boards and power applications. The development of autonomous sensor networks and wearable electronics and the miniaturisation of mobile devices would benefit substantially from solutions in which the energy storage is integrated with the active device. Nanostructures based on porous silicon (PS) provide a route towards integration due to the very high inherent surface area to volume ratio and compatibility with microelectronics fabrication processes. Unfortunately, pristine PS has limited wettability and poor chemical stability in electrolytes and the high resistance of the PS matrix severely limits the power efficiency. In this work, we demonstrate that excellent wettability and electro-chemical properties in aqueous and organic electrolytes can be obtained by coating the PS matrix with an ultra-thin layer of titanium nitride by atomic layer deposition. Our approach leads to very high specific capacitance (15 F/cm$^3$), energy density (1.3 mWh/cm$^3$), power density (up to 214 W/cm$^3$) and excellent stability (more than 13,000 cycles). Furthermore, we show that the PS-TiN nanomaterial can be integrated inside a silicon chip monolithically by combining MEMS and nanofabrication techniques. This leads to realisation of in-chip supercapacitor, i.e., it opens a new way to exploit the otherwise inactive volume of a silicon chip to store energy.

cond-mat.mtrl-sci↗