arXiv subjects

Klaara Viisanen

Publications and source records attributed to Klaara Viisanen.

4 recordsLinked to original sources

arXiv2025

Native-oxide-passivated trilayer junctions for superconducting qubits

Superconducting qubits in today's quantum processing units are typically fabricated with angle-evaporated aluminum--aluminum-oxide--aluminum Josephson junctions. However, there is an urgent need to overcome the limited reproducibility of this approach when scaling up the number of qubits and junctions. Fabrication methods based on subtractive patterning of superconductor--insulator--superconductor trilayers, used for more classical large-scale Josephson junction circuits, could provide the solution but they in turn often suffer from lossy dielectrics incompatible with high qubit coherence. In this work, we utilize native aluminum oxide as a sidewall passivation layer for junctions based on aluminum--aluminum-oxide--niobium trilayers, and use such junctions in qubits. We design the fabrication process such that the few-nanometer-thin native oxide is not exposed to oxide removal steps that could increase its defect density or hinder its ability to prevent shorting between the leads of the junction. With these junctions, we design and fabricate transmon-like qubits and measure time-averaged coherence times up to 30 $μ$s at a qubit frequency of 5 GHz, corresponding to a qubit quality factor of one million. Our process uses subtractive patterning and optical lithography on wafer scale, enabling high throughput in patterning. This approach provides a scalable path toward fabrication of superconducting qubits on industry-standard platforms.

quant-ph↗

arXiv2024

Terahertz detection with graphene FETs: photothermoelectric and resistive self-mixing contributions to the detector response

Field-effect transistors coupled to integrated antennas (TeraFETs) are photodetectors being actively developed for the THz frequency range ($\sim$ 100 GHz - 10 THz). Among them, Graphene TeraFETs (G-TeraFETs) have demonstrated distinctive photoresponse features compared to those made from elementary semiconductors. For instance, previous studies have shown that G-TeraFETs exhibit a THz response that comprises two components: the resistive self-mixing (RSM) and photothermoelectric effect (PTE). The RSM and PTE arise from carrier density oscillations and carrier heating, respectively. In this work, we confirm that the photoresponse can be considered a combination of RSM and PTE, with PTE being the dominant rectification mechanism at higher frequencies. For our CVD G-TeraFETs with asymmetric antenna coupling, the PTE response dominates over the RSM at frequencies above 100 GHz. We find that relative contribution of RSM and PTE to the photoresponse is strongly frequency dependent. Electromagnetic wave simulations show that this behavior is due to the relative change in the total dissipated power between the gated and ungated channel regions of the G-TeraFET as the frequency increases. The simulations also indicate that the channel length over which the PTE contributes to the photoresponse below the gate electrode is approximately the same as the electronic cooling length. Finally, we identify a PTE contribution that can be attributed to the contact doping effect in graphene close to the metal contacts. Our detectors achieve a minimum optical noise-equivalent power of 101 (114) pW/$\sqrt{Hz}$ for asymmetric (symmetric) THz antenna coupling conditions at 400 GHz. This work demonstrates how the PTE response can be used to optimize the THz responsivity of G-TeraFETs.

cond-mat.mes-hall↗

arXiv2023

Thermal resistance in superconducting flip-chip assemblies

Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunities and challenges to the thermal management of low temperature devices. In this work, we investigate sub-1 K inter-chip thermal resistance of a flip-chip bonded assembly, where two silicon chips are interconnected by compression bonding via indium bumps. The total thermal contact area between the chips is 0.306 mm$^2$ and we find that the temperature dependence of the inter-chip thermal resistance follows the power law of $αT^{-3}$, with $α= 7.7-15.4$ K$^4$$μ$m$^2$/nW. The $T^{-3}$ relation indicates phononic interfacial thermal resistance, which is supported by the vanishing contribution of the electrons to the thermal conduction, due to the superconducting interconnections. Such a thermal resistance value can introduce a thermalization bottleneck in particular at cryogenic temperatures. This can be detrimental for some applications, yet it can also be harnessed. We provide an example of both cases by estimating the parasitic overheating of a cryogenic flip-chip assembly operated under various heat loads as well as simulate the performance of solid-state junction microrefrigerators utilizing the observed thermal isolation.

physics.app-ph↗

arXiv2022

Propagating Quantum Microwaves: Towards Applications in Communication and Sensing

The field of propagating quantum microwaves has started to receive considerable attention in the past few years. Motivated at first by the lack of an efficient microwave-to-optical platform that could solve the issue of secure communication between remote superconducting chips, current efforts are starting to reach other areas, from quantum communications to sensing. Here, we attempt at giving a state-of-the-art view of the two, pointing at some of the technical and theoretical challenges we need to address, and while providing some novel ideas and directions for future research. Hence, the goal of this paper is to provide a bigger picture, and -- we hope -- to inspire new ideas in quantum communications and sensing: from open-air microwave quantum key distribution to direct detection of dark matter, we expect that the recent efforts and results in quantum microwaves will soon attract a wider audience, not only in the academic community, but also in an industrial environment.

quant-ph↗