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Kunzhe Dai

Publications and source records attributed to Kunzhe Dai.

4 recordsLinked to original sources

Encoding Circuit Satisfiability in Rydberg Atom Arrays

Rydberg atom arrays natively encode the maximum-weight independent set (MWIS) problem through the blockade mechanism, so the Boolean circuit satisfiability problem (Circuit-SAT) can be brought onto the platform once it is reduced to MWIS. The conventional encoding of Circuit-SAT in the Rydberg atom array proceeds through conjunctive normal form (CNF) and incurs a substantial atom overhead. We introduce CAMERA (Circuit-SAT Atom-efficient MWIS Encoding for Rydberg Arrays), a method that provides MWIS encodings of Circuit-SAT instances on the king subgraph geometry of the array. CAMERA represents each logic gate as a compact weighted gadget and assembles the gadgets with a placement and routing compiler inspired by very large scale integration (VLSI) design. On random multi-gate benchmarks, the direct encoding route lowers the atom cost relative to the CNF route by an average factor of $22.4 \pm 1.8$. To demonstrate that the encoding extends from individual weighted gadgets to multi-gate arithmetic blocks, we compile a full adder and a multiplier, verifying each against its complete truth table by exact classical ground state calculations. We further showcase solving a representative Circuit-SAT instance end-to-end, from gate level compilation through a closed-system tensor-network simulation of a hardware-compatible annealing protocol on the encoded 30-atom instance to readout of a satisfying assignment. These results establish a complete encoding and simulation workflow as a proof of principle, and a concrete route toward solving a broader family of combinatorial problems on Rydberg atom arrays.

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Demonstration of Hopf-link semimetal bands with superconducting circuits

Hopf-link semimetals exhibit exotic gapless band structures with fascinating topological properties, which have never been observed in nature. Here we demonstrate nodal lines with topological form of Hopf-link chains in artificial semimetal-bands. Driving superconducting quantum circuits with elaborately designed microwave fields, we mapped the momentum space of a lattice to a parameter space of the Hamiltonian for a Hopf-link semimetal. By measuring the energy spectrum, we directly imaged nodal lines in cubic lattices. By tuning the driving fields, we adjusted various parameters of Hamiltonian. Important topological features, such as link-unlink topological transitions and the robustness of the Hopf-link chain structure were investigated. Moreover, we extracted the linking number by detecting the Berry phase associated with different loops encircling nodal lines. This topological invariant clearly reveals the nontrivial topology of the Hopf-link semimetal. Our results provide knowledge for developing new materials and quantum devices.

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Quantum simulation of general semi-classical Rabi model beyond strong driving regime

We propose a scheme to simulate the interaction between a two-level system and a classical light field. Under the transversal driving of two microwave tones, the system Hamiltonian is identical to that of the general semi-classical Rabi model. We experimentally realize this Hamiltonian with a superconducting transmon qubit. By tuning the strength, phase and frequency of the two microwave driving fields, we simulate the quantum dynamics from weak to extremely strong driving regime. The resulting evolutions gradually deviate from the normal sinusoidal Rabi oscillations with increasing driving strength, in accordance with the predictions of the general semi-classical Rabi model far beyond the weak driving limit. Our scheme provides an effective approach to investigate the extremely strong interaction between a two-level system and a classical light field. Such strong interactions are usually inaccessible in experiments.

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Extensible 3D architecture for superconducting quantum computing

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.

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