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L. Bosisio

Publications and source records attributed to L. Bosisio.

14 recordsLinked to original sources

Radiation damage study of Belle II silicon strip sensors with 90 MeV electron irradiation

The silicon strip sensors of the Belle II silicon vertex detector were irradiated with 90 MeV electron beams up to an equivalent 1-MeV-neutron fluence of $3.0\times 10^{13}~{\rm n}_{\rm eq}/{\rm cm^2}$. We measure changes in sensor properties induced by radiation damage in the semiconductor bulk. Electrons around this energy are a major source of beam-induced background during Belle II operation. We discuss observed changes in full depletion voltage, sensor leakage current, noise, and charge collection. The sensor bulk type inverts at an equivalent 1-MeV-neutron fluence of $6.0\times 10^{12}~{\rm n}_{\rm eq}/{\rm cm^2}$. The leakage current increases proportionally to the radiation dose. We determine a damage constant of $3.9 \times 10^{-17}$ A/cm at 17 C$^\circ$ immediately after irradiation, which drops significantly to approximately 40% of the initial value in 200 hours, then stabilizes to approximately 30% of the initial value in 1000 hours. We measure sensor noise and signal charge for a sensor irradiated with the equivalent 1-MeV-neutron fluence of $3.0\times 10^{13}~{\rm n}_{\rm eq}/{\rm cm^2}$. Noise increases by approximately 44% after irradiation, while signal charge does not change significantly when a sufficiently high bias voltage is applied.

physics.ins-det

Calibration of diamond detectors for dosimetry in beam-loss monitoring

Artificially-grown diamond crystals have unique properties that make them suitable as solid-state particle detectors and dosimeters in high-radiation environments. We have been using sensors based on single-crystal diamond grown by chemical vapour deposition for dosimetry and beam-loss monitoring at the SuperKEKB collider. Here we describe the assembly and the suite of test and calibration procedures adopted to characterise the diamond-based detectors of this monitoring system. We report the results obtained on 28 detectors and assess the stability and uniformity of response of these devices.

physics.ins-det

Performance of the diamond-based beam-loss monitor system of Belle II

We designed, constructed and have been operating a system based on single-crystal synthetic diamond sensors, to monitor the beam losses at the interaction region of the SuperKEKB asymmetric-energy electron-positron collider. The system records the radiation dose-rates in positions close to the inner detectors of the Belle II experiment, and protects both the detector and accelerator components against destructive beam losses, by participating in the beam-abort system. It also provides complementary information for the dedicated studies of beam-related backgrounds. We describe the performance of the system during the commissioning of the accelerator and during the first physics data taking.

physics.ins-det

Performance of Thin Planar \textit{n-on-p} silicon pixels after HL-LHC radiation fluences

The tracking detector of ATLAS, one of the experiments at the Large Hadron Collider (LHC), will be upgraded in 2024-2026 to cope with the challenging environment conditions of the High Luminosity LHC (HL-LHC). The LPNHE, in collaboration with FBK and INFN, has produced 130~$μ$m thick $n-on-p$ silicon pixel sensors which can withstand the expected large particle fluences at HL- LHC, while delivering data at high rate with excellent hit efficiency. Such sensors were tested on beam before and after irradiation both at CERN-SPS and at DESY, and their performances are presented in this paper. Beam test data indicate that these detectors are suited for all the layers where planar sensors are foreseen in the future ATLAS tracker: hit-efficiency is greater than 97\% for fluences $Φ\lesssim 7\times10^{15}\rm{n_{eq}/cm^2}$ and module power consumption is within the specified limits. Moreover, at a fluence $Φ= 1.3\times10^{16}\rm{n_{eq}/cm^2}$, hit-efficiency is still as high as 88\% and charge collection efficiency is about 30\%.

physics.ins-det

First Measurements of Beam Backgrounds at SuperKEKB

The high design luminosity of the SuperKEKB electron-positron collider is expected to result in challenging levels of beam-induced backgrounds in the interaction region. Properly simulating and mitigating these backgrounds is critical to the success of the Belle~II experiment. We report on measurements performed with a suite of dedicated beam background detectors, collectively known as BEAST II, during the so-called Phase 1 commissioning run of SuperKEKB in 2016, which involved operation of both the high energy ring (HER) of 7 GeV electrons as well as the low energy ring (LER) of 4 GeV positrons. We describe the BEAST II detector systems, the simulation of beam backgrounds, and the measurements performed. The measurements include standard ones of dose rates versus accelerator conditions, and more novel investigations, such as bunch-by-bunch measurements of injection backgrounds and measurements sensitive to the energy spectrum and angular distribution of fast neutrons. We observe beam-gas, Touschek, beam-dust, and injection backgrounds. We do not observe significant synchrotron radiation, as expected. Measured LER beam-gas backgrounds and Touschek backgrounds in both rings are slightly elevated, on average three times larger than the levels predicted by simulation. HER beam-gas backgrounds are on on average two orders of magnitude larger than predicted. Systematic uncertainties and channel-to-channel variations are large, so that these excesses constitute only 1-2 sigma level effects. Neutron background rates are higher than predicted and should be studied further. We will measure the remaining beam background processes, due to colliding beams, in the imminent commissioning Phase 2. These backgrounds are expected to be the most critical for Belle II, to the point of necessitating replacement of detector components during the Phase 3 (full-luminosity) operation of SuperKEB.

physics.ins-det

The s-CVD Radiation Monitoring and Beam Abort System of the Belle-II Vertex Detector

The Belle-II VerteX Detector (VXD) is a 6 layers silicon tracker device that will cope with an unprecedented luminosity of 8 x 10^35 cm-2 s-1 achievable by the new SuperKEKB e+e- collider, now under commissioning at the KEK laboratory (Tsukuba, Japan). A radiation monitoring and beam abort system has been developed based on single-crystal s-CVD diamond sensors. The sensors will be placed in 20 key positions in the vicinity of the interaction region. The severe space limitations require a remote readout of the sensors. In this contribution we present the system design, along with the sensor characterisation procedure. We present also the preliminary results with the prototype system during the first SuperKEKB commissioning phase in February-June 2016.

physics.ins-det

Performance of Irradiated Thin Edgeless N-on-P Planar Pixel Sensors for ATLAS Upgrades

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector. The paper reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless planar pixel sensors, making use of the active trench concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, a complete overview of the electrical characterization of several irradiated samples will be discussed. Some comments about detector modules being assembled will be made and eventually some plans will be outlined.

physics.ins-det

Electrical Characterization of a Thin Edgeless N-on-p Planar Pixel Sensors For ATLAS Upgrades

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector. The paper reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless planar pixel sensors, making use of the active trench concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, and presenting some sensors' simulation results, a complete overview of the electrical characterization of the produced devices will be given.

physics.ins-det

Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade

In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the significant radiation hardness of this option and the reduced cost. The large area necessary to instrument the outer layers will demand to tile the sensors, a solution for which the inefficient region at the border of each sensor needs to be reduced to the minimum size. This paper reports on a joint R&D project by the ATLAS LPNHE Paris group and FBK Trento on a novel n-in-p edgeless planar pixel design, based on the deep-trench process available at FTK.

physics.ins-det

Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of $1 \times 10^{15} {\rm n_{eq}}/{\rm cm}^2$ comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb$^{-1}$) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.

physics.ins-det

Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade

In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the "active edge" concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.

physics.ins-det

Characterization of 3D-DDTC detectors on p-type substrates

We report on the electrical and functional characterization of 3D Double-side, Double-Type-Column (3D- DDTC) detectors fabricated on p-type substrates. Results relevant to detectors in the diode, strip and pixel configurations are presented, and demonstrate a clear improvement in the charge collection performance compared to the first prototypes of these detectors.

physics.ins-det

Measurement of the Charge Collection Efficiency after Heavy Non-Uniform Irradiation in BaBar Silicon Detectors

We have investigated the depletion voltage changes, the leakage current increase and the charge collection efficiency of a silicon microstrip detector identical to those used in the inner layers of the BaBar Silicon Vertex Tracker (SVT) after heavy non-uniform irradiation. A full SVT module with the front-end electronics connected has been irradiated with a 0.9 GeV electron beam up to a peak fluence of 3.5 x 10^14 e^-/cm^2, well beyond the level causing substrate type inversion. We irradiated one of the two sensors composing the module with a non-uniform profile with sigma=1.4 mm that simulates the conditions encountered in the BaBar experiment by the modules intersecting the horizontal machine plane. The position dependence of the charge collection properties and the depletion voltage have been investigated in detail using a 1060 nm LED and an innovative measuring technique based only on the digital output of the chip.

physics.ins-det

Study of the Radiation Hardness of Irradiated AToM Front-End Chips of the BaBar Silicon Vertex Tracker

The radiation hardness of the AToM chips of the BaBar Silicon Vertex Tracker has been investigated by means of irradiations with photons from a 60Co source and 0.9 GeV electrons. The increase in noise and the decrease in gain of the amplifier have been measured as a function of the applied capacitive load and the absorbed dose. Different beam intensities have been used to study the effect of different dose rates to the AToM radiation damage. The chip digital functionalities have been tested up to a dose of 5.5 Mrads for the 60Co photons and 9 Mrads for the 0.9 GeV electrons. In addition a pedestal shift for the irradiated channels has been observed in the test with electrons but is not present in the irradiation with photons. This effect reproduces qualitatively the behavior observed since 2002 in the front-end electronics of the installed BaBar Silicon Vertex Tracker. After some investigation of the chip layout, this peculiar behavior could be associated to radiation damage in a well-identified component of the AToM. The results of the radiation tests are presented and used to extrapolate the performance and lifetime of the installed detector in the next few years.

physics.ins-det