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Lars Döpper

Publications and source records attributed to Lars Döpper.

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MADHAT: A Sensor Prototype for the ALICE 3 Outer Tracker

The ALICE collaboration plans a completely new tracking detector based on silicon MAPS technology manufactured in the 65 nm production node as part of the ALICE~3 upgrade during Long Shutdown 4 of the LHC. The size of the whole active area is planned to be 50 m$^2$, with the Outer Tracker spanning 45 m$^2$. To reach the material budget target of less than 1% $X_0$ per layer, open questions like cooling solutions, mechanical structures and electronics have to be answered. A simple sensor prototype MADHAT (Mechanical Assessment Design for Heat And Thermal solutions), mechanically identical to the final sensor, but with integrated heating elements and temperature probes, was developed to study the temperature distribution in the final detector assembly and to assess different mechanical designs of the circuit board that houses the sensor. Furthermore, it will be used to practice the industrialization of the whole mass-production, including the assembly of FPCs with external companies. In this paper, we present the design of the MADHAT, a prototype readout module and show the results of first measurements.

physics.ins-det

Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: the monolithic stitched sensor (MOSS)

This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026-2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 $\times$ 25.9 cm, thinned to 50 $\mu$m. The chip architecture, in-pixel front-end, laboratory and in-beam characterisation, susceptibility to single-event effects, and series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development.

physics.ins-det