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Laura Parellada Monreal

Publications and source records attributed to Laura Parellada Monreal.

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Characterization of FBK NUV-HD-Cryo SiPMs near LHe temperature

Five FBK ``NUV-HD-Cryo'' SiPMs have been characterized at 7 K and 10 K, with 405 nm and 530 nm LED light, respectively. The dark count rate (DCR) was measured to be $\sim$ 1 Hz for the $\sim$ 100 mm$^2$-size SiPMs, or 0.01 Hz/mm$^2$, which is $\sim$ 7 orders lower than the DCR at room temperature (RT). Given the very low DCR at these cryogenic temperatures, we measured the SiPMs' I-V curves with such a method: illuminated the SiPMs with weak light, which differs from the conventional measurements at RT. Then, we measured the photo-detection efficiency (PDE), after-pulse (AP), and cross-talk (CT) with a bias voltage ranging from overvoltage (OV) 5 to 11 V. At the OV interval (5 to 11 V), the PDE was between 20\% - 45\%, and the AP and CT were both between $\sim$ 5\% and $\sim$ 20\%. With an OV higher than 10 V, the PDE would be $\ge$ 40\%, and the AP and CT are $\sim$ 20\%. Combining all of the measurements, we are confident that the SiPMs can be equipped as the photosensors on liquid helium detectors, including but not limited to the time projection chambers, which we have proposed in hunting for low-mass dark matter directly and beyond.

physics.ins-det

New developments in 3D-trench electrode sensors

Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D sensors represent a viable solution, since they provide excellent radiation tolerance and very good temporal resolution. In particular, owing to the uniform electric field and weighting field distributions, 3D-trench electrode sensors from the INFN TIMESPOT project have shown a temporal resolution of $\sim$10 ps after irradiation fluences up to 1$\times$10$^{17}$ 1-Mev n$_{eq}$/cm$^2$. In spite of the excellent performance of these sensors, 3D-trench pixel technology is not yet fully established and the fabrication yield is not yet adequate for the production of large size pixel sensors. To improve the potential of the 3D-trench concept for large-area sensors, a new batch of sensors was designed at the University of Trento and fabricated at FBK, as part of the AIDA Innova project. Besides introducing some process improvements, this batch includes two different sensor variants: the standard one with continuous ohmic trenches, and a modified one with dashed ohmic trenches. On-wafer electrical test results show that most of the sensors have low leakage current and high breakdown voltage. Moreover, the fabrication yield for the new design variant is higher than that of the standard design.

physics.ins-det