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Lihong Ao

Publications and source records attributed to Lihong Ao.

2 recordsLinked to original sources

Phase field model of Coulomb explosion damage in solid induced by ultrashort laser

Much experimental evidence reveals that Coulomb explosion governs non-thermal material removal under femtosecond or even shorter laser pulses, and non-thermal laser damage has been a topic widely discussed. Nevertheless, there is still no continuum mechanical model capable of describing the evolution of such damage. In this study, we develop a model that characterizes solid damage through a phase field variable governed by Allen-Cahn dynamics. The parameter of the model is defined by a conceptual mechanism: during Coulomb explosion, electron pressure surpasses the interatomic barrier potential, dissociates material from the solid surface as small equivalent particles and resulting in localized damage. The numerical simulation validates the model's availability and demonstrate its ability to predict damage morphology under varying laser conditions. This work advances the understanding of non-thermal ablation and provides a tool for optimizing ultrafast laser processing.

physics.optics

Through-chip microchannels for three-dimensional integrated circuits cooling

Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with water circulating inside to provide direct cooling to each layer. TCMCs are organized in a square array where the pitch and radius of the microchannels are explored. Our computational fluid dynamics (CFD) simulations show that a pitch 10 μm and a radius 1 μm optimize the cooling performance to support a power higher than 10^4 W/cm2 while the maximum temperature rise remains below 60 K with a water inlet temperature of 300 K. We show that the cooling properties do not change with the number of layers for a given chip thickness which provides flexibility to the functional design of the chip. Though manufacturing may be challenging, TCMCs offer a new way for chip cooling that could provide a leap forward in the performance of multilayer 3D ICs and high-power electronics.

physics.flu-dyn