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Liudmila Starodubtceva

Publications and source records attributed to Liudmila Starodubtceva.

2 recordsLinked to original sources

Improved Heat Dissipation in CsPbBr${_3}$-hBN Heterostructures

Metal halide perovskite semiconductors are promising materials for optoelectronic and photonic devices, including solar cells and next-generation coherent light sources. However, their low thermal conductivity limits the practical operation of devices under high excitation levels. Integrating thermally conductive, large band-gap two-dimensional (2D) materials into perovskite devices could suppress heat accumulation, while preserving their optical properties. Here, we show that planar hot-pressed (PHP) cesium lead bromide (CsPbBr${_3}$) thin films capped with few-layer 2D hexagonal boron nitride (hBN) are less affected by laser-induced heating under high-power continuous-wave excitation than uncapped perovskite samples. A large-scale semidry transfer method was developed to integrate 2D hBN onto PHP CsPbBr${_3}$ thin films. The process is chemically and thermally compatible with perovskites. Microscopic and spectroscopic analyses show that the hBN capping layer does not alter the morphology and optical properties of the perovskite thin film. The PHP CsPbBr${_3}$-hBN heterostructure exhibits a thermal conductivity of 3 W/(m * K), approximately seven times higher than that of the bare perovskite films of 0.45 W/(m * K). Heat diffusion simulations confirm enhanced heat dissipation in the heterostructure relative to bare perovskite films. Our experiments demonstrate an effective approach to enhancing heat dissipation in perovskite devices using transparent, thermally conductive 2D materials.

cond-mat.mtrl-sci↗

Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration

Metal-halide perovskites (MHPs) have exciting optoelectronic properties and are under investigation for various applications, such as photovoltaics, light-emitting diodes, and lasers. An essential step towards exploiting the full potential of this class of materials is their large-scale, on-chip integration with high-resolution, top-down patterning. The development of such patterning methods for perovskite films is challenging because of their intrinsic ionic nature and adverse reactions with the solvents used in standard lithography processes. Here, we introduce a versatile and precise method comprising photolithography and reactive ion etching (RIE) processes that can be tuned to accommodate different perovskite compositions and morphologies. Our method utilizes conventional photoresists at reduced temperatures to create micron-sized features down to 1 $μ$m, providing high reproducibility from chip to chip. The patterning technique is validated through atomic force microscopy (AFM), X-ray diffraction (XRD), optical spectroscopy, and scanning electron microscopy (SEM). It enables the scalable and high-throughput on-chip monolithic integration of MHPs.

cond-mat.mtrl-sci↗