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Luiz Felipe Aguinsky

Publications and source records attributed to Luiz Felipe Aguinsky.

2 recordsLinked to original sources

Elemental Germanium Phase-Change Memory

Phase-change memory (PCM) is a mature technology for fast, scalable, non-volatile data storage, with applications spanning embedded memory, as well as in-memory and neuromorphic computing. PCM predominantly relies on chalcogenide alloys, with $\mathrm{Ge_2Sb_2Te_5}$ (GST) as the industry standard. Yet in these alloys, the individual Ge, Sb, and Te atoms redistribute upon cycling, causing stochastic operation and ultimately device failure. To address this issue, elemental antimony was proposed as a PCM material, but it exhibits a metastable amorphous state that prevents reliable data retention. Moreover, tellurium and antimony can contaminate complementary metal-oxide-semiconductor (CMOS) production lines or act as unintended dopants, restricting manufacturing of PCM to dedicated fabs. Here we introduce elemental germanium (Ge) as a CMOS-native phase-change material that overcomes these fundamental limitations. In a vertical PCM cell architecture, Ge enables sub-nanosecond crystallization (240 ps, 40 times faster than GST), non-volatile data storage with excellent thermal stability ($>$110 °C for 10 years vs. $\sim$87 °C for GST), and a resistance drift coefficient approximately 60% lower than in GST. These results establish pure Ge, a standard semiconductor, as an alternative to chalcogenide phase-change materials, achieving superior performance in key metrics and enabling phase-change memory to be fabricated in standard semiconductor facilities.

cond-mat.mtrl-sci

Modeling Incomplete Conformality during Atomic Layer Deposition in High Aspect Ratio Structures

Atomic layer deposition allows for precise control over film thickness and conformality. It is a critical enabler of high aspect ratio structures, such as 3D NAND memory, since its self-limiting behavior enables higher conformality than conventional processes. However, as the aspect ratio increases, deviations from complete conformality frequently occur, requiring comprehensive modeling to aid the development of novel technologies. To that end, we present a model for surface coverage during atomic layer deposition where incomplete conformality is present. This model combines existing approaches based on Knudsen diffusion and Langmuir kinetics. Our model expands the state-of-the art by (i) incorporating gas-phase diffusivity through the Bosanquet formula as well as reaction reversibility in the modeling framework first proposed by Yanguas-Gil and Elam, and (ii) being efficiently integrated within level-set topography simulators. The model is manually calibrated to published results of the prototypical atomic layer deposition of Al$_2$O$_3$ from TMA and H$_2$O in lateral high aspect ratio structures. We investigate the temperature dependence of the H$_2$O step, thus extracting an activation energy of $0.178\,\mathrm{eV}$ which is consistent with recent experiments. In the TMA step, we observe increased accuracy from the Bosanquet formula and we reproduce multiple independent experiments with the same parameter set, highlighting that the model parameters effectively capture the reactor conditions.

physics.comp-ph