arXiv subjects

M. Borri

Publications and source records attributed to M. Borri.

8 recordsLinked to original sources

arXiv2026

ePIC Early Science Report

This Early Science Report from the ePIC Collaboration outlines the compelling physics program achievable during the first years of operation of the Electron-Ion Collider (EIC), prior to the establishment of the full design luminosity and energy range. The analyses are based on realistic early-running beam configurations and detailed Geant4 ePIC detector simulations, hit digitization and data reconstruction. The projected studies from the physics working groups of ePIC span inclusive, semi-inclusive, exclusive, diffractive and tagging, as well as jet and heavy flavor measurements in both electron-proton and electron-ion collisions. Even before the collider reaches its full design performance, these measurements will constrain parton distribution functions in nucleons and nuclei, access transverse-momentum-dependent and spin-dependent observables, probe gluon dynamics in nuclei, and initiate a program of imaging of quarks and gluons. Each measurement is directly connected to the core science pillars of the EIC, identified in the 2018 report by the National Academy of Sciences: understanding the origin of the nucleon mass, unraveling the spin structure of the nucleon, and exploring the emergent properties of dense gluonic matter. The results presented here provide examples that demonstrate that the early years of EIC running with ePIC will deliver novel world-leading insights into Quantum Chromodynamics. In addition, the early science program will establish measurement and analysis methodologies that will pave the way to the subsequent full EIC physics program.

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arXiv2025

Sensor operating point calibration and monitoring of the ALICE Inner Tracking System during LHC Run 3

The new Inner Tracking System (ITS2) of the ALICE experiment began operation in 2021 with the start of LHC Run 3. Compared to its predecessor, ITS2 offers substantial improvements in pointing resolution, tracking efficiency at low transverse momenta, and readout-rate capabilities. The detector employs silicon Monolithic Active Pixel Sensors (MAPS) featuring a pixel size of 26.88$\times$29.24 $\mu$m$^2$ and an intrinsic spatial resolution of approximately 5 $\mu$m. With a remarkably low material budget of 0.36% of radiation length ($X_{0}$) per layer in the three innermost layers and a total sensitive area of about 10 m$^2$, the ITS2 constitutes the largest-scale application of MAPS technology in a high-energy physics experiment and the first of its kind operated at the LHC. For stable data taking, it is crucial to calibrate different parameters of the detector, such as in-pixel charge thresholds and the masking of noisy pixels. The calibration of 24120 monolithic sensors, comprising a total of 12.6$\times$10$^{9}$ pixels, represents a major operational challenge. This paper presents the methods developed for the calibration of the ITS2 and outlines the strategies for monitoring and dynamically adjusting the detector's key performance parameters over time.

physics.ins-det↗

arXiv2022

ATHENA Detector Proposal -- A Totally Hermetic Electron Nucleus Apparatus proposed for IP6 at the Electron-Ion Collider

ATHENA has been designed as a general purpose detector capable of delivering the full scientific scope of the Electron-Ion Collider. Careful technology choices provide fine tracking and momentum resolution, high performance electromagnetic and hadronic calorimetry, hadron identification over a wide kinematic range, and near-complete hermeticity. This article describes the detector design and its expected performance in the most relevant physics channels. It includes an evaluation of detector technology choices, the technical challenges to realizing the detector and the R&D required to meet those challenges.

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arXiv2021

First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors

A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance. In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.

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arXiv2019

A next-generation LHC heavy-ion experiment

The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with the innermost layers possibly positioned inside the beam pipe. In addition to superior tracking and vertexing capabilities over a wide momentum range down to a few tens of MeV/$c$, the detector will provide particle identification via time-of-flight determination with about 20~ps resolution. In addition, electron and photon identification will be performed in a separate shower detector. The proposed detector is conceived for studies of pp, pA and AA collisions at luminosities a factor of 20 to 50 times higher than possible with the upgraded ALICE detector, enabling a rich physics program ranging from measurements with electromagnetic probes at ultra-low transverse momenta to precision physics in the charm and beauty sector.

physics.ins-det↗

arXiv2018

Production and Integration of the ATLAS Insertable B-Layer

During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector.

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arXiv2011

Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

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arXiv2009

Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.

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