arXiv subjects

M. Dinardo

Publications and source records attributed to M. Dinardo.

3 recordsLinked to original sources

arXiv2019

First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm$^{-2}$

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}$neq cm$^{-2}$ (1MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.

physics.ins-det↗

arXiv2019

Opportunities in Flavour Physics at the HL-LHC and HE-LHC

Motivated by the success of the flavour physics programme carried out over the last decade at the Large Hadron Collider (LHC), we characterize in detail the physics potential of its High-Luminosity and High-Energy upgrades in this domain of physics. We document the extraordinary breadth of the HL/HE-LHC programme enabled by a putative Upgrade II of the dedicated flavour physics experiment LHCb and the evolution of the established flavour physics role of the ATLAS and CMS general purpose experiments. We connect the dedicated flavour physics programme to studies of the top quark, Higgs boson, and direct high-$p_T$ searches for new particles and force carriers. We discuss the complementarity of their discovery potential for physics beyond the Standard Model, affirming the necessity to fully exploit the LHC's flavour physics potential throughout its upgrade eras.

hep-ph↗

arXiv2014

Testbeam and Laboratory Characterization of CMS 3D Pixel Sensors

The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase in luminosity expected with the High- Luminosity LHC (HL-LHC) phase. As a possible replacement for planar sensors, 3D silicon technology is under consideration due to its good performance after high radiation fluence. In this paper, we report on pre- and post- irradiation measurements for CMS 3D pixel sensors with different electrode configurations. The effects of irradiation on electrical properties, charge collection efficiency, and position resolution of 3D sensors are discussed. Measurements of various test structures for monitoring the fabrication process and studying the bulk and surface properties, such as MOS capacitors, planar and gate-controlled diodes are also presented.

physics.ins-det↗