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M. Glavanovics

Publications and source records attributed to M. Glavanovics.

2 recordsLinked to original sources

Watching a GaN Transistor Switch: Real-Time Nanoscale Strain and Heat Dynamics

Digital and energy technologies depend on microelectromechanical and power electronic components whose performance is critically impacted by rapid, cyclic deformations. Real-time information on their operation has remained inaccessible due to the need for nanosecond and nanometer resolution in fully integrated devices. We break this limitation by imaging the complete switching cycle of an industrial GaN high electron mobility transistor through stroboscopic dark field X ray microscopy at a fourth-generation synchrotron, resolving electromechanical and thermal micro strain fields across the entire device and correlating them with time dependent voltage characteristics. Coupled simulations benchmarked against the measurements reproduce electric field evolution and transient thermal hotspots. This combined approach provides direct insight into device physics and informs design strategies for next generation energy and information processing technologies.

cond-mat.mtrl-sci

Transient Non-linear Thermal FEM Simulation of Smart Power Switches and Verification by Measurements

Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly temperature dependent. In this paper, validity of a common non-linear silicon material model is verified by transient non-linear thermal FEM simulations of Smart Power Switches and measurements. For verification, over-temperature protection behavior of Smart Power Switches is employed. This protection turns off the switch at a pre-defined temperature which is used as a temperature reference in the investigation. Power dissipation generated during a thermal overload event of two Smart Power devices is measured and used as an input stimulus to transient thermal FEM simulations. The duration time of the event together with the temperature reference is confronted with simulation results and thus the validity of the silicon model is proved. In addition, the impact of non-linear thermal properties of silicon on the thermal impedance of power semiconductors is shown.

physics.gen-ph