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Maohua Nie

Publications and source records attributed to Maohua Nie.

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HierSVA: A Data Synthesis Pipeline, Dataset, and Benchmark for LLM-Driven Hierarchical Hardware Formal Verification

We present HierSVA, an integrated suite that combines a pipeline, dataset, and benchmark for LLM-driven hierarchical hardware formal verification. HierSVA-SP pairs an RTL preprocessing toolchain with an LLM-in-the-loop formal verification flow to produce reference SystemVerilog Assertions (SVA) on hierarchical RTL. Applying it to BaseJump STL yields HierSVA-DS, a dataset of 342 modules, with hierarchy metadata and depths 0--9, accompanied by a deep subset of 28 module-bug pairs with natural-language specifications and bug variants. HierSVA-B decomposes assertion quality into six metric axes: syntax correctness, assertion proof success rate, vacuity, specification faithfulness, mutation coverage, and formal core coverage. Applying HierSVA-B to twelve recent LLMs reveals three findings. First, the module-level compile rate is 67.1\%; among generated assertions in evaluable runs, 82.1\% prove non-vacuously, but the corresponding assertion sets detect only 70.2\% of eligible injected faults and cover 36.2\% of the formal core. Second, on 211 evaluable model--module entries in the deep subset, assertion sets flag buggy RTL with 0.87 recall, but 40\% of predicted-buggy outcomes are false positives on correct RTL, limiting precision to 0.60. Third, agentic mode improves S1-style provability and strength metrics, but gains plateau and oscillate. Codes and artifacts are available at \href{https://github.com/HierSVAAnon/HierSVACodeAndArtifacts}{https://github.com/HierSVAAnon/HierSVACodeAndArtifacts}. Dataset is available at \href{https://huggingface.co/datasets/AnonymousHierSVA/HierSVA}{https://huggingface.co/datasets/AnonymousHierSVA/HierSVA}.

cs.AR

TransDot: An Area-efficient Reconfigurable Floating-Point Unit for Trans-Precision Dot-Product Accumulation for FPGA AI Engines

Commercial FPGAs, such as AMD Versal devices, increasingly incorporate AI engines that exploit low-precision packed-SIMD fused multiply-accumulate (FMA) to achieve proportional throughput gains. However, trans-precision FMA (e.g., multiplying two FP16 numbers and adding their result to an FP32 accumulator), which preserves numerical stability by accumulating in higher precision, remains bottlenecked by the highest-precision, lowest-throughput operation. Dot-product accumulation (DPA) (e.g., performing a dot-product on two 4-element FP8 vectors and adding its result to an FP32 accumulator) can fully utilize the input/output bandwidth and computational resources. Existing flexible open-source FPUs, such as FPnew, do not support DPA and implement SIMD FMA on low-precision formats by replicating independent FMA lanes, which increases area, underutilizes shared arithmetic resources, and complicates the integration of DPA operations. This paper presents TransDot, a reconfigurable FPU that unifies multi-precision SIMD FMA and trans-precision DPA within a shared, reconfigurable datapath. TransDot extends the baseline design with 2-term FP16, 4-term FP8, and 8-term FP4 dot-product accumulation into FP32 using reconfigurable subcomponents. Evaluation shows that TransDot delivers 2$\times$ FP16, 4$\times$ FP8, and 8$\times$ FP4 throughput via DPA with FP32 accumulation, and 1.46$\times$ area efficiency in FP16 DPA and 2.92$\times$ area efficiency in FP8 DPA, at the cost of 37.3% larger area on average and an additional pipeline stage in dot-product mode compared to the FPnew baseline. These results demonstrate that TransDot's area-efficient design enables scalable deployment in next-generation AMD Versal AI engines.

cs.AR