arXiv subjects

Matteo Galetta

Publications and source records attributed to Matteo Galetta.

6 recordsLinked to original sources

arXiv2026

Update Disturbance-Resilient Analog ReRAM Crossbar Arrays for In-Memory Deep Learning Accelerators

Resistive memory (ReRAM) technologies with crossbar array architectures hold significant potential for analog AI accelerator hardware, enabling both in-memory inference and training. Recent developments have successfully demonstrated inference acceleration by offloading compute-heavy training workloads to off-chip digital processors. However, in-memory acceleration of training algorithms is crucial for more sustainable and power-efficient AI, but still in an early stage of research. This study addresses in-memory training acceleration using analog ReRAM arrays, focusing on a key challenge during fully parallel weight updates: disturbances of the weight values in cross-point devices. A ReRAM device solution is presented on 350 nm silicon technology, utilizing a resistive switching conductive metal oxide (CMO) formed on a nanoscale conductive filament within a HfOx layer. The devices not only exhibit 60 ns fast, non-volatile analog switching, but also demonstrates outstanding resilience to update disturbances, enduring over 100k pulses. The disturbance tolerance of the ReRAM is analyzed using COMSOL Multiphysics simulations, modeling the filament-induced thermoelectric energy concentration that results in a highly nonlinear device responses to input voltage amplitudes. Disturbance-free parallel weight mapping is also demonstrated on the back-end-of-line integrated ReRAM array chip. Finally, comprehensive hardware-aware neural network simulations validate the potential of our ReRAM for in-memory deep learning accelerators capable of fully parallel weight updates.

cs.ET↗

arXiv2026

Study of Resistive Switching Dynamics and Memory States Equilibria in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM via Compact Modeling

Resistive Random Access Memory (ReRAM) devices offer a promising solution for next-generation non-volatile memory and neuromorphic computing systems. Yet, existing compact models fail to capture analog resistive switching behavior of ReRAM devices. This work presents an advanced physics-based compact model for analog filamentary Conductive-Metal-Oxide (CMO)/HfOx ReRAM, capable of reproducing switching characteristics over a broad range of operating conditions. Compared to the state-of-the-art, the model extends the dynamic interplay between ion migration and electron hopping, while also accounting for parasitic resistive elements. Simulations of various voltage inputs are tested to reproduce quasi-static I-V curves, SET switching kinetics under single-pulse programming conditions, and analog accumulative conductance modulation upon bipolar identical pulse streams. Additional simulations reveal the physical criterion underlying the stabilization of the CMO/HfOx-based ReRAM memory state around the equilibrium point, namely symmetry point, under pulsing conditions when a fading memory mechanism emerges. Building upon the evidence of such equilibrium stabilization under pulsing and quasi-static conditions, a procedure is established to visualize and map equilibrium memory states across different input domains. The physical model supports design optimization of switching behavior for analog neuromorphic systems and non-volatile memory architectures. It also enables accurate integrated circuit simulations with CMO/HfOx-based ReRAM technology.

cs.ET↗

arXiv2025

Analytical Modelling of the Transport in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM Devices

The recent co-optimization of memristive technologies and programming algorithms enabled neural networks training with in-memory computing systems. In this context, novel analog filamentary conductive-metal-oxide (CMO)/HfOx redox-based resistive switching memory (ReRAM) represents a key technology. Despite device performance enhancements reported in literature, the underlying mechanism behind resistive switching is not fully understood. This work presents the first physics-based analytical model of the current transport and of the resistive switching in these devices. As a case study, analog TaOx/HfOx ReRAM devices are considered. The current transport is explained by a trap-to-trap tunneling process, and the resistive switching by a modulation of the defect density within the sub-band of the TaOx that behaves as electric field and temperature confinement layer. The local temperature and electric field distributions are derived from the solution of the electric and heat transport equations in a 3D finite element ReRAM model. The intermediate resistive states are described as a gradual modulation of the TaOx defect density, which results in a variation of its electrical conductivity. The drift-dynamics of ions during the resistive switching is analytically described, allowing the estimation of defect migration energies in the TaOx layer. Moreover, the role of the electro-thermal properties of the CMO layer is unveiled. The proposed analytical model accurately describes the experimental switching characteristic of analog TaOx/HfOx ReRAM devices, increasing the physical understanding and providing the equations necessary for circuit simulations incorporating this technology.

cs.ET↗

arXiv2025

Decoupling Electric Field and Temperature-Driven Atomistic Forming Mechanisms in TaOx/HfO2-Based ReRAMs using Reactive Molecular Dynamics Simulations

Resistive random access memories (ReRAMs) with a bilayer TaOx/HfO2 stack structure have shown unique multi-level resistive switching capabilities. However, the physical processes governing their behavior, and specifically the atomistic mechanisms of forming, remain poorly understood. In this work, we present a detailed analysis of the forming mechanism at the atomic level using molecular dynamics (MD) simulations. An extended charge equilibration scheme, based on a combination of the charge transfer ionic potential (CTIP) formalism and the electrochemical dynamics with implicit degrees of freedom (EChemDID) method, is employed to model the localized effects of applied voltage. Our simulations reveal that tantalum ions exhibit the highest displacement under applied voltage, followed by hafnium ions, while oxygen ions respond only minimally. This results in the formation of a tantalum-depleted, oxygen-rich zone near the positive top electrode (anode), and the clustering of oxygen vacancies near the negative bottom electrode (cathode), where the conductive filament nucleates. This ionic segregation partially shields the bulk dielectric from the applied electric field, hindering further migration of ions in the vertical direction. We find that a minimum threshold voltage is required to initiate vacancy clustering. Filament growth proceeds through a localized mechanism, driven by thermally activated generation of oxygen vacancy defects, which are stabilized near the edge of the nucleated filament at the cathode.

cond-mat.mtrl-sci↗

arXiv2025

Edge Training and Inference with Analog ReRAM Technology for Hand Gesture Recognition

Tactile hand gesture recognition is a crucial task for user control in the automotive sector, where Human-Machine Interactions (HMI) demand low latency and high energy efficiency. This study addresses the challenges of power-constrained edge training and inference by utilizing analog Resistive Random Access Memory (ReRAM) technology in conjunction with a real tactile hand gesture dataset. By optimizing the input space through a feature engineering strategy, we avoid relying on large-scale crossbar arrays, making the system more suitable for edge deployment. Through realistic hardware-aware simulations that account for device non-idealities derived from experimental data, we demonstrate the functionalities of our analog ReRAM-based analog in-memory computing for on-chip training, utilizing the state-of-the-art Tiki-Taka algorithm. Furthermore, we validate the classification accuracy of approximately 91.4% for post-deployment inference of hand gestures. The results highlight the potential of analog ReRAM technology and crossbar architecture with fully parallelized matrix computations for real-time HMI systems at the Edge.

eess.SP↗

arXiv2025

All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices

Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training acceleration. However, a unified analog in-memory technology platform-capable of on-chip training, weight retention, and long-term inference acceleration-has yet to be reported. This work presents an all-in-one analog AI accelerator, combining these capabilities to enable energy-efficient, continuously adaptable AI systems. The platform leverages an array of analog filamentary conductive-metal-oxide (CMO)/HfOx resistive switching memory cells (ReRAM) integrated into the back-end-of-line (BEOL). The array demonstrates reliable resistive switching with voltage amplitudes below 1.5V, compatible with advanced technology nodes. The array multi-bit capability (over 32 stable states) and low programming noise (down to 10nS) enable a nearly ideal weight transfer process, more than an order of magnitude better than other memristive technologies. Inference performance is validated through matrix-vector multiplication simulations on a 64x64 array, achieving a root-mean-square error improvement by a factor of 20 at 1 second and 3 at 10 years after programming, compared to state-of-the-art. Training accuracy closely matching the software equivalent is achieved across different datasets. The CMO/HfOx ReRAM technology lays the foundation for efficient analog systems accelerating both inference and training in deep neural networks.

cs.ET↗