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Meiping Jiang

Publications and source records attributed to Meiping Jiang.

4 recordsLinked to original sources

Nanoinstabilities of Cu2O porous nanostructured films as driven by nanocurvature effect and thermal activation effect

In this work, the instabilities at the nanoscale (i.e. nanoinstabilities) of triangular pyramids-like Cu2O porous nanostructured films (PNFs) are studied by heating treatments under different atmosphere and temperature. It is found that the nanoscale building triangular-pyramids turn round preferentially at the sharp angles and/or coalesce with their contacting ones by directional diffusion and plastic flow of atoms, which are driven by the nonuniformly-distributed surface nanocurvature. As a result, the triangular pyramids become quasi-sphere shape and the PNF evolves into a big, dense particles film. It is also observed that the heating or thermal activation effect efficiently promotes the reduction or oxidation of Cu2O pyramids and the crystallization or growth of the as-achieved Cu or CuO grains. The above physical and chemical instabilities or changes at the nanoscale of Cu2O PNFs can be well accounted for by the combined mechanism of nanocurvature effect and thermal activation effect. The nanocurvature effect can lower the energy barrier for the atom diffusion or plastic flow and lower the activation energy for the chemical reactions, while the thermal activation effect can supply the required kinetic energy or activation energy and make the atomic transportations and reactions kinetically possible. The findings reveal the evolution laws of morphology, crystal structure and composition of triangular pyramids-like Cu2O PNF during heating treatments, which can further be extended to other types of Cu2O PNFs. Also, the findings have important implications for the nanoinstabilities of Cu2O PNFs-based devices, especially those working at a high temperature.

cond-mat.mtrl-sci

Cu2O porous nanostructured films fabricated by positive bias sputtering deposition

In this work, the authors fabricated Cu2O porous nanostructured films (PNFs) on glass slide substrates by the newly developed positive bias deposition approach in a balanced magnetron sputtering (MS) system. It was found that the surface morphology, crystal structure and optical property of the as-deposited products were greatly dependent on the applied positive substrate bias. In particular, when the substrate was biased at +50 V and +150 V, both of the as-prepared Cu2O PNFs exhibited a unique triangular pyramids-like structure with obvious edges and corners and little gluing, a preferred orientation of (111) and a blue shift of energy band gap at 2.35 eV. Quantitative calculation results indicated that the traditional bombardment effects of electrons and sputtering argon ions were both negligible during the bias deposition in the balanced MS system. Instead, a new model of tip charging effect was further proposed to account for the controllable formation of PNFs by the balanced bias sputtering deposition.

cond-mat.mtrl-sci

Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

In this paper, the oxidation-assisted dealloying (OAD) of Cu0.7Al0.3 films with different microstructures which were obtained by high vacuum annealing at different temperatures were studied using powder X-ray diffraction, field-emission scanning electron microscopy and energy dispersive X-ray analysis. It was observed that different microstructures such as eutectic mixture or solid solution, the grain size of Cu or Al component in eutectic-mixture Cu0.7Al0.3 films affected the corrosion morphology greatly. It thus provided a practical route to fabricate flexible CuO porous nanostructure-films (PNFs) with controllable pore size, porosity, block size and shape. Further, the underlying OAD mechanisms for the structure-resultant different corrosion morphologies of Cu0.7Al0.3 films were also explored. In these senses, the study is suggestive and crucial to both the mechanism understanding of OAD process and the technical controlling of PNF fabrication.

cond-mat.mtrl-sci

Oxidation of copper during physical sputtering deposition: mechanism, avoidance and utilization

In this paper, oxidation of Cu during physical sputtering deposition in a high purity and low pressure Ar atmosphere without introducing O2 gas flow was studied systemically. It was found that various flexible Cu-based films could be obtained by simply adjusting deposition parameters. Electrical and optical testing results showed that the achieved pure Cu films and Cu+Cu2O composite films both presented an intriguing combination of metal and semiconductor characteristics. It is expected that such Cu-based films with a superior conductivity and a solar-window bandgap may have fascinating potential applications such as in high electron mobility transistors, electrodes and solar cells. Further, the oxidation mechanisms of Cu under different deposition parameters and the main O2 source during physical sputtering deposition were also explored.

cond-mat.mtrl-sci