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Michael Tarkhov

Publications and source records attributed to Michael Tarkhov.

2 recordsLinked to original sources

Superconducting properties of Nb$_{0.85}$Sc$_{0.15}$ film deposited by magnetron co-sputtering

The technology has been developed for synthesizing Nb$_{1-x}$Sc$_x$ films using magnetron co-sputtering from Nb and Sc targets. The material synthesis was accompanied by structural characterization using X-ray diffraction and X-ray reflectometry methods, which enabled the determination of thickness, phase composition and crystal structure. We also analyzed the superconducting properties. The critical temperature $T_c$ was measured for samples with different concentarions of Sc and Nb. The maximum value of $T_c$ equal to 6.35 K was observed for sample with a scandium content of approximately 15 %, which was determined by Auger spectroscopy. Transport and magnetoresistive measurements were performed in microbridges with length of 50 $\mu$m, width of 2 $\mu$m, and thickness of 30 nm. The critical current density was as high as 2.5 $\text{ MA/cm}^{2}$. Magnetic measurements were performed with the field oriented perpendicular to the sample. The upper critical field $H_{c2}(0) = 3.2$ T, electron diffusion coefficient $D = 1.1$ $\text{cm}^{2}/s$, and coherence length $\xi_{GL} = 10.1$ nm. The synthesized Nb$_{1-x}$Sc$_x$ intermetallic compound shows promise for various functional cryogenic electronics devices. \keywords{NbSc; superconductor; microbridge}

cond-mat.supr-con

Superconducting TSV contact for cryoelectronic devices

This work focuses on the fabrication of niobium through silicon vias (TSV) superconductors interconnects. The effect of supercycle of sequential oxidation and chemical etching process on the through-etch wall quality was investigated. It was experimentally shown that the use of supercycle in the fabrication process leads to significant improvement of the TSV wall quality and removal of the defect type - scallops. After 12 times repetitions of supercycles a dissipative bonding of superconducting strips on the front and back side of the sample is observed. The critical current density of such coupling is 5x104 A/cm2. The critical ratio of substrate thickness to hole diameter at which electrical coupling is formed is 3 : 1.

cond-mat.supr-con