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Minesh Patel

Publications and source records attributed to Minesh Patel.

At least 19 recordsLinked to original sources

DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips

State-of-the-art DRAM read disturbance mitigations rely on the read disturbance threshold (RDT) (e.g., the number of aggressor row activations needed to induce the first read disturbance bitflip) to securely and performance- and energy-efficiently prevent read disturbance bitflips. However, accurately and exhaustively characterizing the RDT of every DRAM row in a chip is time intensive. Rapidly determining RDT is important for enabling secure, performance- and energy-efficient systems. Our goal is to develop and evaluate a reliable and rapid read disturbance testing methodology. To that end, we develop DiscoRD building on the key results of an extensive experimental characterization study using 212 real DDR4 chips whereby we measure the RDT of hundreds of thousands of DRAM rows millions of times. We develop an empirical model for read disturbance bitflips and evaluate the probability of read-disturbance-induced uncorrectable errors when a read disturbance mechanism is configured using a single $RDT_{min}$ measurement. Using this model we demonstrate that 1) relying on a lightweight error-correcting code (ECC) alone yields relatively high uncorrectable error probability and 2) combining ECC, infrequent memory scrubbing, and configurable read disturbance mitigation mechanisms can greatly reduce the error probability. Building on our observations and analyses, we discuss the RDT of each individual row can be identified more precisely. Our results show that error tolerance, memory scrubbing, online profiling, and run-time configurable read disturbance mitigation techniques are important to enable secure and energy-efficient spatial-variation aware read disturbance mitigations. We hope that DiscoRD drives research that enables us to quantitatively navigate the performance/cost - reliability tradeoff space for read disturbance mitigation techniques.

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Variable Read Disturbance: An Experimental Analysis of Temporal Variation in DRAM Read Disturbance

Modern DRAM chips are subject to read disturbance errors. State-of-the-art read disturbance mitigations rely on accurate and exhaustive characterization of the read disturbance threshold (RDT) (e.g., the number of aggressor row activations needed to induce the first RowHammer or RowPress bitflip) of every DRAM row (of which there are millions or billions in a modern system) to prevent read disturbance bitflips securely and with low overhead. We experimentally demonstrate for the first time that the RDT of a DRAM row significantly and unpredictably changes over time. We call this new phenomenon variable read disturbance (VRD). Our experiments using 160 DDR4 chips and 4 HBM2 chips from three major manufacturers yield two key observations. First, it is very unlikely that relatively few RDT measurements can accurately identify the RDT of a DRAM row. The minimum RDT of a DRAM row appears after tens of thousands of measurements (e.g., up to 94,467), and the minimum RDT of a DRAM row is 3.5X smaller than the maximum RDT observed for that row. Second, the probability of accurately identifying a row's RDT with a relatively small number of measurements reduces with increasing chip density or smaller technology node size. Our empirical results have implications for the security guarantees of read disturbance mitigation techniques: if the RDT of a DRAM row is not identified accurately, these techniques can easily become insecure. We discuss and evaluate using a guardband for RDT and error-correcting codes for mitigating read disturbance bitflips in the presence of RDTs that change unpredictably over time. We conclude that a >10% guardband for the minimum observed RDT combined with SECDED or Chipkill-like SSC error-correcting codes could prevent read disturbance bitflips at the cost of large read disturbance mitigation performance overheads (e.g., 45% performance loss for an RDT guardband of 50%).

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SpyHammer: Understanding and Exploiting RowHammer under Fine-Grained Temperature Variations

RowHammer is a DRAM vulnerability that can cause bit errors in a victim DRAM row solely by accessing its neighboring DRAM rows at a high-enough rate. Recent studies demonstrate that new DRAM devices are becoming increasingly vulnerable to RowHammer, and many works demonstrate system-level attacks for privilege escalation or information leakage. In this work, we perform the first rigorous fine-grained characterization and analysis of the correlation between RowHammer and temperature. We show that RowHammer is very sensitive to temperature variations, even if the variations are very small (e.g., $\pm 1$ °C). We leverage two key observations from our analysis to spy on DRAM temperature: 1) RowHammer-induced bit error rate consistently increases (or decreases) as the temperature increases, and 2) some DRAM cells that are vulnerable to RowHammer exhibit bit errors only at a particular temperature. Based on these observations, we propose a new RowHammer attack, called SpyHammer, that spies on the temperature of DRAM on critical systems such as industrial production lines, vehicles, and medical systems. SpyHammer is the first practical attack that can spy on DRAM temperature. Our evaluation in a controlled environment shows that SpyHammer can infer the temperature of the victim DRAM modules with an error of less than $\pm 2.5$ °C at the 90th percentile of all tested temperatures, for 12 real DRAM modules (120 DRAM chips) from four main manufacturers.

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Rethinking the Producer-Consumer Relationship in Modern DRAM-Based Systems

Generational improvements to commodity DRAM throughout half a century have long solidified its prevalence as main memory across the computing industry. However, overcoming today's DRAM technology scaling challenges requires new solutions driven by both DRAM producers and consumers. In this paper, we observe that the separation of concerns between producers and consumers specified by industry-wide DRAM standards is becoming a liability to progress in addressing scaling-related concerns. To understand the problem, we study four key directions for overcoming DRAM scaling challenges using system-memory cooperation: (i) improving memory access latencies; (ii) reducing DRAM refresh overheads; (iii) securely defending against the RowHammer vulnerability; and (iv) addressing worsening memory errors. We find that the single most important barrier to advancement in all four cases is the consumer's lack of insight into DRAM reliability. Based on an analysis of DRAM reliability testing, we recommend revising the separation of concerns to incorporate limited information transparency between producers and consumers. Finally, we propose adopting this revision in a two-step plan, starting with immediate information release through crowdsourcing and publication and culminating in widespread modifications to DRAM standards.

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NEON: Enabling Efficient Support for Nonlinear Operations in Resistive RAM-based Neural Network Accelerators

Resistive Random-Access Memory (RRAM) is well-suited to accelerate neural network (NN) workloads as RRAM-based Processing-in-Memory (PIM) architectures natively support highly-parallel multiply-accumulate (MAC) operations that form the backbone of most NN workloads. Unfortunately, NN workloads such as transformers require support for non-MAC operations (e.g., softmax) that RRAM cannot provide natively. Consequently, state-of-the-art works either integrate additional digital logic circuits to support the non-MAC operations or offload the non-MAC operations to CPU/GPU, resulting in significant performance and energy efficiency overheads due to data movement. In this work, we propose NEON, a novel compiler optimization to enable the end-to-end execution of the NN workload in RRAM. The key idea of NEON is to transform each non-MAC operation into a lightweight yet highly-accurate neural network. Utilizing neural networks to approximate the non-MAC operations provides two advantages: 1) We can exploit the key strength of RRAM, i.e., highly-parallel MAC operation, to flexibly and efficiently execute non-MAC operations in memory. 2) We can simplify RRAM's microarchitecture by eliminating the additional digital logic circuits while reducing the data movement overheads. Acceleration of the non-MAC operations in memory enables NEON to achieve a 2.28x speedup compared to an idealized digital logic-based RRAM. We analyze the trade-offs associated with the transformation and demonstrate feasible use cases for NEON across different substrates.

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DRAM Bender: An Extensible and Versatile FPGA-based Infrastructure to Easily Test State-of-the-art DRAM Chips

To understand and improve DRAM performance, reliability, security and energy efficiency, prior works study characteristics of commodity DRAM chips. Unfortunately, state-of-the-art open source infrastructures capable of conducting such studies are obsolete, poorly supported, or difficult to use, or their inflexibility limit the types of studies they can conduct. We propose DRAM Bender, a new FPGA-based infrastructure that enables experimental studies on state-of-the-art DRAM chips. DRAM Bender offers three key features at the same time. First, DRAM Bender enables directly interfacing with a DRAM chip through its low-level interface. This allows users to issue DRAM commands in arbitrary order and with finer-grained time intervals compared to other open source infrastructures. Second, DRAM Bender exposes easy-to-use C++ and Python programming interfaces, allowing users to quickly and easily develop different types of DRAM experiments. Third, DRAM Bender is easily extensible. The modular design of DRAM Bender allows extending it to (i) support existing and emerging DRAM interfaces, and (ii) run on new commercial or custom FPGA boards with little effort. To demonstrate that DRAM Bender is a versatile infrastructure, we conduct three case studies, two of which lead to new observations about the DRAM RowHammer vulnerability. In particular, we show that data patterns supported by DRAM Bender uncovers a larger set of bit-flips on a victim row compared to the data patterns commonly used by prior work. We demonstrate the extensibility of DRAM Bender by implementing it on five different FPGAs with DDR4 and DDR3 support. DRAM Bender is freely and openly available at https://github.com/CMU-SAFARI/DRAM-Bender.

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HiRA: Hidden Row Activation for Reducing Refresh Latency of Off-the-Shelf DRAM Chips

DRAM is the building block of modern main memory systems. DRAM cells must be periodically refreshed to prevent data loss. Refresh operations degrade system performance by interfering with memory accesses. As DRAM chip density increases with technology node scaling, refresh operations also increase because: 1) the number of DRAM rows in a chip increases; and 2) DRAM cells need additional refresh operations to mitigate bit failures caused by RowHammer, a failure mechanism that becomes worse with technology node scaling. Thus, it is critical to enable refresh operations at low performance overhead. To this end, we propose a new operation, Hidden Row Activation (HiRA), and the HiRA Memory Controller (HiRA-MC). HiRA hides a refresh operation's latency by refreshing a row concurrently with accessing or refreshing another row within the same bank. Unlike prior works, HiRA achieves this parallelism without any modifications to off-the-shelf DRAM chips. To do so, it leverages the new observation that two rows in the same bank can be activated without data loss if the rows are connected to different charge restoration circuitry. We experimentally demonstrate on 56% real off-the-shelf DRAM chips that HiRA can reliably parallelize a DRAM row's refresh operation with refresh or activation of any of the 32% of the rows within the same bank. By doing so, HiRA reduces the overall latency of two refresh operations by 51.4%. HiRA-MC modifies the memory request scheduler to perform HiRA when a refresh operation can be performed concurrently with a memory access or another refresh. Our system-level evaluations show that HiRA-MC increases system performance by 12.6% and 3.73x as it reduces the performance degradation due to periodic refreshes and refreshes for RowHammer protection (preventive refreshes), respectively, for future DRAM chips with increased density and RowHammer vulnerability.

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BlockHammer: Preventing RowHammer at Low Cost by Blacklisting Rapidly-Accessed DRAM Rows

Aggressive memory density scaling causes modern DRAM devices to suffer from RowHammer, a phenomenon where rapidly activating a DRAM row can cause bit-flips in physically-nearby rows. Recent studies demonstrate that modern DRAM chips, including chips previously marketed as RowHammer-safe, are even more vulnerable to RowHammer than older chips. Many works show that attackers can exploit RowHammer bit-flips to reliably mount system-level attacks to escalate privilege and leak private data. Therefore, it is critical to ensure RowHammer-safe operation on all DRAM-based systems. Unfortunately, state-of-the-art RowHammer mitigation mechanisms face two major challenges. First, they incur increasingly higher performance and/or area overheads when applied to more vulnerable DRAM chips. Second, they require either proprietary information about or modifications to the DRAM chip design. In this paper, we show that it is possible to efficiently and scalably prevent RowHammer bit-flips without knowledge of or modification to DRAM internals. We introduce BlockHammer, a low-cost, effective, and easy-to-adopt RowHammer mitigation mechanism that overcomes the two key challenges by selectively throttling memory accesses that could otherwise cause RowHammer bit-flips. The key idea of BlockHammer is to (1) track row activation rates using area-efficient Bloom filters and (2) use the tracking data to ensure that no row is ever activated rapidly enough to induce RowHammer bit-flips. By doing so, BlockHammer (1) makes it impossible for a RowHammer bit-flip to occur and (2) greatly reduces a RowHammer attack's impact on the performance of co-running benign applications. Compared to state-of-the-art RowHammer mitigation mechanisms, BlockHammer provides competitive performance and energy when the system is not under a RowHammer attack and significantly better performance and energy when the system is under attack.

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Understanding RowHammer Under Reduced Wordline Voltage: An Experimental Study Using Real DRAM Devices

RowHammer is a circuit-level DRAM vulnerability, where repeatedly activating and precharging a DRAM row, and thus alternating the voltage of a row's wordline between low and high voltage levels, can cause bit flips in physically nearby rows. Recent DRAM chips are more vulnerable to RowHammer: with technology node scaling, the minimum number of activate-precharge cycles to induce a RowHammer bit flip reduces and the RowHammer bit error rate increases. Therefore, it is critical to develop effective and scalable approaches to protect modern DRAM systems against RowHammer. To enable such solutions, it is essential to develop a deeper understanding of the RowHammer vulnerability of modern DRAM chips. However, even though the voltage toggling on a wordline is a key determinant of RowHammer vulnerability, no prior work experimentally demonstrates the effect of wordline voltage (VPP) on the RowHammer vulnerability. Our work closes this gap in understanding. This is the first work to experimentally demonstrate on 272 real DRAM chips that lowering VPP reduces a DRAM chip's RowHammer vulnerability. We show that lowering VPP 1) increases the number of activate-precharge cycles needed to induce a RowHammer bit flip by up to 85.8% with an average of 7.4% across all tested chips and 2) decreases the RowHammer bit error rate by up to 66.9% with an average of 15.2% across all tested chips. At the same time, reducing VPP marginally worsens a DRAM cell's access latency, charge restoration, and data retention time within the guardbands of system-level nominal timing parameters for 208 out of 272 tested chips. We conclude that reducing VPP is a promising strategy for reducing a DRAM chip's RowHammer vulnerability without requiring modifications to DRAM chips.

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A Case for Transparent Reliability in DRAM Systems

Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigations), we observe that designers today lack sufficient insight into commodity DRAM chips' reliability characteristics to implement these techniques in practice. In this work, we make a case for DRAM manufacturers to provide increased transparency into key aspects of DRAM reliability (e.g., basic chip design properties, testing strategies). Doing so enables system designers to make informed decisions to better adapt commodity DRAM to meet modern systems' needs while preserving its cost advantages. To support our argument, we study four ways that system designers can adapt commodity DRAM chips to system-specific design goals: (1) improving DRAM reliability; (2) reducing DRAM refresh overheads; (3) reducing DRAM access latency; and (4) mitigating RowHammer attacks. We observe that adopting solutions for any of the four goals requires system designers to make assumptions about a DRAM chip's reliability characteristics. These assumptions discourage system designers from using such solutions in practice due to the difficulty of both making and relying upon the assumption. We identify DRAM standards as the root of the problem: current standards rigidly enforce a fixed operating point with no specifications for how a system designer might explore alternative operating points. To overcome this problem, we introduce a two-step approach that reevaluates DRAM standards with a focus on transparency of DRAM reliability so that system designers are encouraged to make the most of commodity DRAM technology for both current and future DRAM chips.

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Enabling Effective Error Mitigation in Memory Chips That Use On-Die Error-Correcting Codes

Improvements in main memory storage density are primarily driven by process technology scaling, which negatively impacts reliability by exacerbating various circuit-level error mechanisms. To compensate for growing error rates, both memory manufacturers and consumers use error-mitigation mechanisms that improve manufacturing yield and allow system designers to meet reliability targets. Developing effective error mitigations requires understanding the errors' characteristics (e.g., worst-case behavior, statistical properties). Unfortunately, we observe that proprietary on-die Error-Correcting Codes (ECC) used in modern memory chips introduce new challenges to efficient error mitigation by obfuscating CPU-visible error characteristics in an unpredictable, ECC-dependent manner. This dissertation builds a detailed understanding of how on-die ECC obfuscates the statistical properties of main memory error mechanisms using a combination of real-chip experiments and statistical analyses. We experimentally study memory errors, examine how on-die ECC obfuscates their statistical characteristics, and develop new testing techniques to overcome the obfuscation. Our results show that the obfuscated error characteristics can be recovered using new memory testing techniques that exploit the interaction between on-die ECC and the statistical characteristics of memory error mechanisms to expose physical cell behavior. We conclude by discussing the critical need for transparency in DRAM reliability characteristics in order to enable DRAM consumers to better understand and adapt commodity DRAM chips to their system-specific needs. We hope and believe that the analysis, techniques, and results we present in this dissertation will enable the community to better understand and tackle current and future reliability challenges as well as adapt commodity memory to new advantageous applications.

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HARP: Practically and Effectively Identifying Uncorrectable Errors in Memory Chips That Use On-Die Error-Correcting Codes

State-of-the-art techniques for addressing scaling-related main memory errors identify and repair bits that are at risk of error from within the memory controller. Unfortunately, modern main memory chips internally use on-die error correcting codes (on-die ECC) that obfuscate the memory controller's view of errors, complicating the process of identifying at-risk bits (i.e., error profiling). To understand the problems that on-die ECC causes for error profiling, we analytically study how on-die ECC changes the way that memory errors appear outside of the memory chip (e.g., to the memory controller). We show that on-die ECC introduces statistical dependence between errors in different bit positions, raising three key challenges for practical and effective error profiling. To address the three challenges, we introduce Hybrid Active-Reactive Profiling (HARP), a new error profiling algorithm that rapidly achieves full coverage of at-risk bits in memory chips that use on-die ECC. HARP separates error profiling into two phases: (1) using existing profiling techniques with the help of small modifications to the on-die ECC mechanism to quickly identify a subset of at-risk bits; and (2) using a secondary ECC within the memory controller to safely identify the remaining at-risk bits, if and when they fail. Our evaluations show that HARP achieves full coverage of all at-risk bits faster (e.g., 99th-percentile coverage 20.6%/36.4%/52.9%/62.1% faster, on average, given 2/3/4/5 raw bit errors per ECC word) than two state-of-the-art baseline error profiling algorithms, which sometimes fail to achieve full coverage. We perform a case study of how each profiler impacts the system's overall bit error rate (BER) when using a repair mechanism to tolerate DRAM data-retention errors. We show that HARP outperforms the best baseline algorithm (e.g., by 3.7x for a raw per-bit error probability of 0.75).

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A Deeper Look into RowHammer`s Sensitivities: Experimental Analysis of Real DRAM Chips and Implications on Future Attacks and Defenses

RowHammer is a circuit-level DRAM vulnerability where repeatedly accessing (i.e., hammering) a DRAM row can cause bit flips in physically nearby rows. The RowHammer vulnerability worsens as DRAM cell size and cell-to-cell spacing shrink. Recent studies demonstrate that modern DRAM chips, including chips previously marketed as RowHammer-safe, are even more vulnerable to RowHammer than older chips such that the required hammer count to cause a bit flip has reduced by more than 10X in the last decade. Therefore, it is essential to develop a better understanding and in-depth insights into the RowHammer vulnerability of modern DRAM chips to more effectively secure current and future systems. Our goal in this paper is to provide insights into fundamental properties of the RowHammer vulnerability that are not yet rigorously studied by prior works, but can potentially be $i$) exploited to develop more effective RowHammer attacks or $ii$) leveraged to design more effective and efficient defense mechanisms. To this end, we present an experimental characterization using 248~DDR4 and 24~DDR3 modern DRAM chips from four major DRAM manufacturers demonstrating how the RowHammer effects vary with three fundamental properties: 1)~DRAM chip temperature, 2)~aggressor row active time, and 3)~victim DRAM cell's physical location. Among our 16 new observations, we highlight that a RowHammer bit flip 1)~is very likely to occur in a bounded range, specific to each DRAM cell (e.g., 5.4% of the vulnerable DRAM cells exhibit errors in the range 70C to 90C), 2)~is more likely to occur if the aggressor row is active for longer time (e.g., RowHammer vulnerability increases by 36% if we keep a DRAM row active for 15 column accesses), and 3)~is more likely to occur in certain physical regions of the DRAM module under attack (e.g., 5% of the rows are 2x more vulnerable than the remaining 95% of the rows).

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SIMDRAM: An End-to-End Framework for Bit-Serial SIMD Computing in DRAM

Processing-using-DRAM has been proposed for a limited set of basic operations (i.e., logic operations, addition). However, in order to enable full adoption of processing-using-DRAM, it is necessary to provide support for more complex operations. In this paper, we propose SIMDRAM, a flexible general-purpose processing-using-DRAM framework that (1) enables the efficient implementation of complex operations, and (2) provides a flexible mechanism to support the implementation of arbitrary user-defined operations. The SIMDRAM framework comprises three key steps. The first step builds an efficient MAJ/NOT representation of a given desired operation. The second step allocates DRAM rows that are reserved for computation to the operation's input and output operands, and generates the required sequence of DRAM commands to perform the MAJ/NOT implementation of the desired operation in DRAM. The third step uses the SIMDRAM control unit located inside the memory controller to manage the computation of the operation from start to end, by executing the DRAM commands generated in the second step of the framework. We design the hardware and ISA support for SIMDRAM framework to (1) address key system integration challenges, and (2) allow programmers to employ new SIMDRAM operations without hardware changes. We evaluate SIMDRAM for reliability, area overhead, throughput, and energy efficiency using a wide range of operations and seven real-world applications to demonstrate SIMDRAM's generality. Using 16 DRAM banks, SIMDRAM provides (1) 88x and 5.8x the throughput, and 257x and 31x the energy efficiency, of a CPU and a high-end GPU, respectively, over 16 operations; (2) 21x and 2.1x the performance of the CPU and GPU, over seven real-world applications. SIMDRAM incurs an area overhead of only 0.2% in a high-end CPU.

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CODIC: A Low-Cost Substrate for Enabling Custom In-DRAM Functionalities and Optimizations

DRAM is the dominant main memory technology used in modern computing systems. Computing systems implement a memory controller that interfaces with DRAM via DRAM commands. DRAM executes the given commands using internal components (e.g., access transistors, sense amplifiers) that are orchestrated by DRAM internal timings, which are fixed foreach DRAM command. Unfortunately, the use of fixed internal timings limits the types of operations that DRAM can perform and hinders the implementation of new functionalities and custom mechanisms that improve DRAM reliability, performance and energy. To overcome these limitations, we propose enabling programmable DRAM internal timings for controlling in-DRAM components. To this end, we design CODIC, a new low-cost DRAM substrate that enables fine-grained control over four previously fixed internal DRAM timings that are key to many DRAM operations. We implement CODIC with only minimal changes to the DRAM chip and the DDRx interface. To demonstrate the potential of CODIC, we propose two new CODIC-based security mechanisms that outperform state-of-the-art mechanisms in several ways: (1) a new DRAM Physical Unclonable Function (PUF) that is more robust and has significantly higher throughput than state-of-the-art DRAM PUFs, and (2) the first cold boot attack prevention mechanism that does not introduce any performance or energy overheads at runtime.

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QUAC-TRNG: High-Throughput True Random Number Generation Using Quadruple Row Activation in Commodity DRAM Chips

True random number generators (TRNG) sample random physical processes to create large amounts of random numbers for various use cases, including security-critical cryptographic primitives, scientific simulations, machine learning applications, and even recreational entertainment. Unfortunately, not every computing system is equipped with dedicated TRNG hardware, limiting the application space and security guarantees for such systems. To open the application space and enable security guarantees for the overwhelming majority of computing systems that do not necessarily have dedicated TRNG hardware, we develop QUAC-TRNG. QUAC-TRNG exploits the new observation that a carefully-engineered sequence of DRAM commands activates four consecutive DRAM rows in rapid succession. This QUadruple ACtivation (QUAC) causes the bitline sense amplifiers to non-deterministically converge to random values when we activate four rows that store conflicting data because the net deviation in bitline voltage fails to meet reliable sensing margins. We experimentally demonstrate that QUAC reliably generates random values across 136 commodity DDR4 DRAM chips from one major DRAM manufacturer. We describe how to develop an effective TRNG (QUAC-TRNG) based on QUAC. We evaluate the quality of our TRNG using NIST STS and find that QUAC-TRNG successfully passes each test. Our experimental evaluations show that QUAC-TRNG generates true random numbers with a throughput of 3.44 Gb/s (per DRAM channel), outperforming the state-of-the-art DRAM-based TRNG by 15.08x and 1.41x for basic and throughput-optimized versions, respectively. We show that QUAC-TRNG utilizes DRAM bandwidth better than the state-of-the-art, achieving up to 2.03x the throughput of a throughput-optimized baseline when scaling bus frequencies to 12 GT/s.

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SIMDRAM: A Framework for Bit-Serial SIMD Processing Using DRAM

Processing-using-DRAM has been proposed for a limited set of basic operations (i.e., logic operations, addition). However, in order to enable the full adoption of processing-using-DRAM, it is necessary to provide support for more complex operations. In this paper, we propose SIMDRAM, a flexible general-purpose processing-using-DRAM framework that enables massively-parallel computation of a wide range of operations by using each DRAM column as an independent SIMD lane to perform bit-serial operations. SIMDRAM consists of three key steps to enable a desired operation in DRAM: (1) building an efficient majority-based representation of the desired operation, (2) mapping the operation input and output operands to DRAM rows and to the required DRAM commands that produce the desired operation, and (3) executing the operation. These three steps ensure efficient computation of any arbitrary and complex operation in DRAM. The first two steps give users the flexibility to efficiently implement and compute any desired operation in DRAM. The third step controls the execution flow of the in-DRAM computation, transparently from the user. We comprehensively evaluate SIMDRAM's reliability, area overhead, operation throughput, and energy efficiency using a wide range of operations and seven diverse real-world kernels to demonstrate its generality. Our results show that SIMDRAM provides up to 5.1x higher operation throughput and 2.5x higher energy efficiency than a state-of-the-art in-DRAM computing mechanism, and up to 2.5x speedup for real-world kernels while incurring less than 1% DRAM chip area overhead. Compared to a CPU and a high-end GPU, SIMDRAM is 257x and 31x more energy-efficient, while providing 93x and 6x higher operation throughput, respectively.

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Bit-Exact ECC Recovery (BEER): Determining DRAM On-Die ECC Functions by Exploiting DRAM Data Retention Characteristics

Increasing single-cell DRAM error rates have pushed DRAM manufacturers to adopt on-die error-correction coding (ECC), which operates entirely within a DRAM chip to improve factory yield. The on-die ECC function and its effects on DRAM reliability are considered trade secrets, so only the manufacturer knows precisely how on-die ECC alters the externally-visible reliability characteristics. Consequently, on-die ECC obstructs third-party DRAM customers (e.g., test engineers, experimental researchers), who typically design, test, and validate systems based on these characteristics. To give third parties insight into precisely how on-die ECC transforms DRAM error patterns during error correction, we introduce Bit-Exact ECC Recovery (BEER), a new methodology for determining the full DRAM on-die ECC function (i.e., its parity-check matrix) without hardware tools, prerequisite knowledge about the DRAM chip or on-die ECC mechanism, or access to ECC metadata (e.g., error syndromes, parity information). BEER exploits the key insight that non-intrusively inducing data-retention errors with carefully-crafted test patterns reveals behavior that is unique to a specific ECC function. We use BEER to identify the ECC functions of 80 real LPDDR4 DRAM chips with on-die ECC from three major DRAM manufacturers. We evaluate BEER's correctness in simulation and performance on a real system to show that BEER is effective and practical across a wide range of on-die ECC functions. To demonstrate BEER's value, we propose and discuss several ways that third parties can use BEER to improve their design and testing practices. As a concrete example, we introduce and evaluate BEEP, the first error profiling methodology that uses the known on-die ECC function to recover the number and bit-exact locations of unobservable raw bit errors responsible for observable post-correction errors.

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