arXiv subjects

Mirco Nydegger

Publications and source records attributed to Mirco Nydegger.

3 recordsLinked to original sources

arXiv2026

Nanodroplet-Confined Electroplating Enables Submicron Printing of Metals and Oxide Ceramics

The fabrication of functional micro- and nano-electronic devices requires the deposition of high-quality materials of different electronic material classes, such as conductors, semiconductors and insulators. To establish ultra-high-resolution additive manufacturing as a viable addition to existing fabrication methods requires the combinatorial additive deposition of different electronic material classes. However, current techniques do not provide such a capability. Here, we demonstrate that droplet confined electroplating, an ultra-high-resolution AM technique initially developed for metals as electrohydrodynamic redox printing (EHD-RP), allows not only the direct deposition of many metals, but also of metal-oxides. Particularly, we demonstrate that applying fundamental electrochemical principles in combination with on-the-fly switching of the deposited material allows for the direct co-deposition of metals, metal-hydroxides and -oxides. Our results exemplify the feasibility of leveraging simple water-based electrochemical concepts to produce intricate and multi-material structures at the nanoscale.

cond-mat.mtrl-sci↗

arXiv2024

Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires

Droplet-confined electrodeposition enables a precise deposition of three dimensional, nanoscopic and high purity metal structures. It aspires to fabricate intricate microelectronic devices, metamaterials, plasmonic structures and functionalized surfaces. Yet, a major handicap of droplet-confined electrodeposition is the current lack of control over the process, which is owed to its dynamic nature and the nanoscopic size of the involved droplets. The deposition current offers itself as an obvious and real-time window into the deposition. Therefore, the current during droplet-confined deposition is analysed. Nucleation and growth dynamics are evaluated systematically. Our results indicate different deposition regimes and link current to both volume and morphology of deposited copper. This allows for optimized electroplating strategies and to calibrate the slicing algorithms necessary for a controlled deposition of 3D structures. The potential of selecting appropriate solvents further readies this novel technique for the reliable deposition of functional structures with submicron resolution.

cond-mat.mtrl-sci↗

arXiv2023

Direct in- and out-of-plane writing of metals on insulators by electron-beam-enabled, confined electrodeposition with submicrometer feature size

Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g. high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, we demonstrate the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells could offer greater flexibility towards deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.

physics.app-ph↗