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Moritz Baier

Publications and source records attributed to Moritz Baier.

2 recordsLinked to original sources
arXiv2026

Chip-Scale Transmitter Module for Real-Time Continuous-Variable QKD

Continuous-variable quantum key distribution (CV-QKD) enables secure communication over standard telecom infrastructure, but scaling is stalled by bulky, discrete optical hardware. We address this bottleneck by demonstrating a real-time CV-QKD system driven by a chip-scale hybrid transmitter using commercial telecom components. Combining a micro-optic external-cavity laser with a monolithic photonic integrated IQ modulator we enable secure secret-key generation over 102 km of optical fiber while reducing optical volume by 95% relative to the commercial discrete-component counterpart. Moreover, real-time operation overcomes offline post-processing bottlenecks of experimental setups. This work bridges laboratory demonstrations and field-deployable technology for cost-effective quantum networks.

quant-ph↗
arXiv2025

Deep Learning-based Multi Project InP Wafer Simulation for Unsupervised Surface Defect Detection

Quality management in semiconductor manufacturing often relies on template matching with known golden standards. For Indium-Phosphide (InP) multi-project wafer manufacturing, low production scale and high design variability lead to such golden standards being typically unavailable. Defect detection, in turn, is manual and labor-intensive. This work addresses this challenge by proposing a methodology to generate a synthetic golden standard using Deep Neural Networks, trained to simulate photo-realistic InP wafer images from CAD data. We evaluate various training objectives and assess the quality of the simulated images on both synthetic data and InP wafer photographs. Our deep-learning-based method outperforms a baseline decision-tree-based approach, enabling the use of a 'simulated golden die' from CAD plans in any user-defined region of a wafer for more efficient defect detection. We apply our method to a template matching procedure, to demonstrate its practical utility in surface defect detection.

cs.CV↗