Muhammed Yusufoglu | Searcharxiv

arXiv2026

Electrical and Structural Response of Nine-Atom-Wide Armchair Graphene Nanoribbon Transistors to Gamma Irradiation

Materials and devices used in space and advanced energy systems are continuously exposed to high-energy photons and particles, leading to gradual changes in their structural and electronic properties. Gamma-ray exposure is particularly critical because their strong penetrating power allows them to traverse conventional shielding and device packaging. Real-time monitoring of exposure-induced changes in compact, chip-integrated devices remains limited despite the availability of external radiation detectors. Atomically precise graphene nanoribbons (GNRs) present an attractive platform for probing such effects due to their structural uniformity, tunable electronic properties, and exceptional sensitivity of charge transport to even subtle lattice modifications. Here, we investigate the structural and electronic response of atomically precise GNRs under gamma irradiation. Nine-atom-wide armchair GNRs (9-AGNRs) were synthesized via a bottom-up on-surface approach, integrated into field-effect transistors (FETs), and characterized before and after exposure using Raman spectroscopy and electrical transport measurements. Raman spectroscopy indicates preservation of the primary GNR lattice structure, accompanied by subtle spectral changes suggestive of irradiation-induced oxidation or local lattice perturbations. While these measurements do not indicate severe structural damage, electrical transport measurements reveal a pronounced degradation in device performance, demonstrating the strong susceptibility of GNRFETs to gamma-ray exposure. This pronounced response may be attributed to Anderson localization of charge carriers, potentially arising from enhanced quantum interference in atomically narrow, quasi-one-dimensional GNRs. These results highlight the potential of GNR-based nanoelectronic devices for sensing and monitoring under extreme operational conditions.

cond-mat.mtrl-sci↗

arXiv2025

Scalable Etch-Free Transfer of Low-Dimensional Materials from Metal Films to Diverse Substrates

Low-dimensional materials hold great promises for exploring emergent physical phenomena, nanoelectronics, and quantum technologies. Their synthesis often depends on catalytic metal films, from which the synthesized materials must be transferred to insulating substrates to enable device functionality and minimize interfacial interactions during quantum investigations. Conventional transfer methods, such as chemical etching or electrochemical delamination, degrade material quality, limit scalability, or prove incompatible with complex device architectures. Here, a scalable, etch-free transfer technique is presented, employing Field's metal (51% In, 32.5% Bi, and 16.5% Sn by weight) as a low-melting-point mechanical support to gently delaminate low-dimensional materials from metal films without causing damage. Anchoring the metal film during separation prevents tearing and preserves material integrity. As a proof of concept, atomically precise graphene nanoribbons (GNRs) are transferred from Au(111)/mica to dielectric substrates, including silicon dioxide (SiO_2) and single-crystalline lanthanum oxychloride (LaOCl). Comprehensive characterization confirms the preservation of structural and chemical integrity throughout the transfer process. Wafer-scale compatibility and device integration are demonstrated by fabricating GNR-based field-effect transistors (GNRFETs) that exhibit room-temperature switching with on/off current ratios exceeding 10^3. This method provides a scalable and versatile platform for integrating low-dimensional materials into advanced low-dimensional materials-based technologies.

cond-mat.mtrl-sci↗