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Nathan Jurik

Publications and source records attributed to Nathan Jurik.

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Optimal binning of $D\rightarrow K_{\mathrm S}^0\pi^+\pi^-$ and $D\rightarrow K_{\mathrm S}^0K^+K^-$ phase space for experimental measurements

New binning schemes for the Dalitz plots of $D \rightarrow K^0_{\mathrm S}\pi^+\pi^-$ and $D \rightarrow K^0_{\mathrm S} K^+ K^-$ decays are presented. These are determined using a new figure of merit for optimisation that better represents the sensitivity to $\gamma$ than previous metrics. Further augmentation comes from including consideration of degeneracy with other physics parameters determined simultaneously and a more accurate treatment of relevant backgrounds. The overall expected improvement in the precision of $\gamma$ measurements using $B^\pm\to DK^\pm$ decays, followed by $D \rightarrow K^0_{\mathrm S}\pi^+\pi^-$, is estimated at around 5$\%$. In addition, the first dedicated optimisation is performed for the observables relevant to charm mixing, $x_{CP}$ and $\Delta x$, in $D \rightarrow K^0_{\mathrm S}\pi^+\pi^-$ decays. This procedure accounts for both statistical sensitivity and the migration of events between bins due to detector resolution. The resulting binning scheme leads to an estimated gain of approximately 20$\%$ in statistical sensitivity, while maintaining the bias due to bin migration at a level comparable to the currently used scheme.

hep-ex

Microchannel cooling for the LHCb VELO Upgrade I

The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R\&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.

physics.ins-det