arXiv subjects

Nicholas A. Lanzillo

Publications and source records attributed to Nicholas A. Lanzillo.

7 recordsLinked to original sources

arXiv2025

Half-Metallic Fe/MgO Superlattice: An Ideal Candidate for Magnetic Tunnel Junction Electrodes

Magnetic Tunnel Junction (MTJ) based Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM) is poised to replace embedded Flash for advanced applications such as automotive microcontroller units. To achieve deeper technological adoption, MTJ needs to exhibit three key features: low magnetization (Ms), high perpendicular magnetic anisotropy (PMA) and high tunnel magnetoresistance (TMR). Here, we theoretically show that when Fe/MgO multilayers are inserted into the fixed and free layers of the MTJ, these three conditions are simultaneously met. As the number of Fe/MgO multilayers in MTJ electrodes is increased, we find that the electron transport evolves from direct barrier tunneling of majority spin states to the resonant tunneling of minority spin states. Remarkably, the projected density of states (PDOS) of Fe/MgO superlattice at the MgO tunnel barrier exhibits half-metallicity near the Fermi Energy, where the minority states exist while the majority states are gapped out, resulting in astronomically high TMR.

cond-mat.mes-hall↗

arXiv2024

Surface-dominated conductance scaling in Weyl semimetal NbAs

Protected surface states arising from non-trivial bandstructure topology in semimetals can potentially enable new device functionalities in compute, memory, interconnect, sensing, and communication. This necessitates a fundamental understanding of surface-state transport in nanoscale topological semimetals. Here, we investigate quantum transport in a prototypical topological semimetal NbAs to evaluate the potential of this class of materials for beyond-Cu interconnects in highly-scaled integrated circuits. Using density functional theory (DFT) coupled with non-equilibrium Green's function (NEGF) calculations, we show that the resistance-area RA product in NbAs films decreases with decreasing thickness at the nanometer scale, in contrast to a nearly constant RA product in ideal Cu films. This anomalous scaling originates from the disproportionately large number of surface conduction states which dominate the ballistic conductance by up to 70% in NbAs thin films. We also show that this favorable RA scaling persists even in the presence of surface defects, in contrast to RA sharply increasing with reducing thickness for films of conventional metals, such as Cu, in the presence of surface defects. These results underscore the promise of topological semimetals like NbAs as future back-end-of-line (BEOL) interconnect metals.

cond-mat.mes-hall↗

arXiv2022

Unconventional Resistivity Scaling in Topological Semimetal CoSi

Nontrivial band topologies in semimetals lead to robust surface states that can contribute dominantly to the total conduction. This may result in reduced resistivity with decreasing feature size contrary to conventional metals, which may highly impact the semiconductor industry. Here we study the resistivity scaling of a representative topological semimetal CoSi using realistic band structures and Green's function methods. We show that there exists a critical thickness d_c dividing different scaling trends. Above d_c, when the defect density is low such that surface conduction dominates, resistivity reduces with decreasing thickness; when the defect density is high such that bulk conduction dominates, resistivity increases in as conventional metals. Below d_c, the persistent remnants of the surface states give rise to decreasing resistivity down to the ultrathin limit, unlike in topological insulators. The observed CoSi scaling can apply to broad classes of topological semimetals, providing guidelines for materials screening and engineering. Our study shows that topological semimetals bear the potential of overcoming the resistivity scaling challenges in back-end-of-line interconnect applications.

cond-mat.mes-hall↗

arXiv2022

Size-Dependent Grain Boundary Scattering in Topological Semimetals

We assess the viability of topological semimetals for application in advanced interconnect technology, where conductor size is on the order of a few nanometers and grain boundaries are expected to be prevalent. We investigate the electron transport properties and grain boundary scattering in thin films of the topological semimetals CoSi and CoGe using first-principles calculations combined with the Non-Equilibrium Green's Function (NEGF) technique. Unlike conventional interconnect metals like Cu and Al, we find that CoSi and CoGe conduct primarily through topologically-protected surface states in thin film structures even in the presence of grain boundaries. The area-normalized resistance decreases with decreasing film thickness for CoSi and CoGe thin films both with and without grain boundaries; a trend opposite to that of the conventional metals Cu and Al. The surface-dominated transport mechanisms in thin films of topological semimetals with grain boundaries demonstrates a fundamentally new paradigm of the classical resistivity size-effect, and suggests that these materials may be promising candidates for applications as nano-interconnects where high electrical resistivity acts as a major bottleneck limiting semiconductor device performance.

cond-mat.mtrl-sci↗

arXiv2021

Topological Semimetals for Scaled Back-End-Of-Line Interconnect Beyond Cu

The resistance bottleneck in metal-interconnect scaling calls for new interconnect materials. This paper explores topological semimetals as a potential solution. After reviewing the desirable properties of topological semimetals for back-end-of-line (BEOL) interconnects, we use CoSi as an example to demonstrate the decreasing resistance-area product with scaling and provide material-search guidelines.

cond-mat.mes-hall↗

arXiv2020

First principles evaluation of fcc ruthenium for use in advanced interconnects

As the semiconductor industry turns to alternate conductors to replace Cu for future interconnect nodes, much attention as been focused on evaluating the electrical performance of Ru. The typical hexagonal close-packed (hcp) phase has been extensively studied, but relatively little attention has been paid to the face-centered cubic (fcc) phase, which has been shown to nucleate in confined structures and may be present in tight-pitch interconnects. Using \emph{ab initio} techniques, we benchmark the performance of fcc Ru. We find that the phonon-limited bulk resistivity of the fcc Ru is less than half of that of hcp Ru, a feature we trace back to the stronger electron-phonon coupling elements that are geometrically inherited from the modified Fermi surface shape of the fcc crystal. Despite this benefit of the fcc phase, high grain boundary scattering results in increased resistivity compared to Cu-based interconnects with similar average grain size. We find, however, that the line resistance of fcc Ru is lower than that of Cu below 21 nm line width due to the conductor volume lost to adhesion and wetting liners. In addition to studying bulk transport properties, we evaluate the performance of adhesion liners for fcc Ru. We find that it is energetically more favorable for fcc Ru to bind directly to silicon dioxide than through conventional adhesion liners such as TaN and TiN. In the case that a thin liner is necessary for the Ru deposition technique, we find that the vertical resistance penalty of a liner for fcc Ru can be up to eight times lower than that calculated for conventional liners used for Cu interconnects. Our calculations, therefore, suggest that the formation of the fcc phase of Ru may be a beneficial for advanced, low-resistance interconnects.

cond-mat.mtrl-sci↗

arXiv2014

Weak electron-phonon coupling in the early alkali atomic wires

The structural, electronic and vibrational properties of atomic wires composed of the early alkali metals lithium and sodium are studied using density functional perturbation theory. The s-like electronic states near the Fermi level couple very weakly to longitudinal acoustic phonons and not at all to the transverse acoustic phonons, which results in a weak overall electron-phonon coupling. The results are compared to earlier studies on the electron-phonon coupling in metallic atomic wires and reinforces the idea that s-like states at the Fermi level give rise to weak electron-phonon coupling in one-dimension, in contrast with materials containing d-like states at the Fermi level which have correspondingly larger electron-phonon coupling due to interactions with transverse phonons.

cond-mat.mtrl-sci↗