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Ozgur Sinanoglu

Publications and source records attributed to Ozgur Sinanoglu.

At least 73 records · Page 4Linked to original sources

2.5D Root of Trust: Secure System-Level Integration of Untrusted Chiplets

Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries. More specifically, we integrate chiplets (i.e., third-party hard intellectual property of complex functionality, like microprocessors) using a security-enforcing interposer. Such hardware organization provides a robust 2.5D root of trust for trustworthy, yet powerful and flexible, computation systems. The security paradigms for our scheme, employed firmly by design and construction, are: 1) stringent physical separation of trusted from untrusted components, and 2) runtime monitoring. The system-level activities of all untrusted commodity chiplets are checked continuously against security policies via physically separated security features. Aside from the security promises, the good economics of outsourced supply chains are still maintained; the system vendor is free to procure chiplets from the open market, while only producing the interposer and assembling the 2.5D system oneself. We showcase our scheme using the Cortex-M0 core and the AHB-Lite bus by ARM, building a secure 64-core system with shared memories. We evaluate our scheme through hardware simulation, considering different threat scenarios. Finally, we devise a physical-design flow for 2.5D systems, based on commercial-grade design tools, to demonstrate and evaluate our 2.5D root of trust.

cs.CR↗

Power Side-Channel Attacks in Negative Capacitance Transistor (NCFET)

Side-channel attacks have empowered bypassing of cryptographic components in circuits. Power side-channel (PSC) attacks have received particular traction, owing to their non-invasiveness and proven effectiveness. Aside from prior art focused on conventional technologies, this is the first work to investigate the emerging Negative Capacitance Transistor (NCFET) technology in the context of PSC attacks. We implement a CAD flow for PSC evaluation at design-time. It leverages industry-standard design tools, while also employing the widely-accepted correlation power analysis (CPA) attack. Using standard-cell libraries based on the 7nm FinFET technology for NCFET and its counterpart CMOS setup, our evaluation reveals that NCFET-based circuits are more resilient to the classical CPA attack, due to the considerable effect of negative capacitance on the switching power. We also demonstrate that the thicker the ferroelectric layer, the higher the resiliency of the NCFET-based circuit, which opens new doors for optimization and trade-offs.

cs.CR↗

Opening the Doors to Dynamic Camouflaging: Harnessing the Power of Polymorphic Devices

The era of widespread globalization has led to the emergence of hardware-centric security threats throughout the IC supply chain. Prior defenses like logic locking, layout camouflaging, and split manufacturing have been researched extensively to protect against intellectual property (IP) piracy at different stages. In this work, we present dynamic camouflaging as a new technique to thwart IP reverse engineering at all stages in the supply chain, viz., the foundry, the test facility, and the end-user. Toward this end, we exploit the multi-functionality, post-fabrication reconfigurability, and run-time polymorphism of spin-based devices, specifically the magneto-electric spin-orbit (MESO) device. Leveraging these unique properties, dynamic camouflaging is shown to be resilient against state-of-the-art analytical SAT-based attacks and test-data mining attacks. Such dynamic reconfigurability is not afforded in CMOS owing to fundamental differences in operation. For such MESO-based camouflaging, we also anticipate massive savings in power, performance, and area over other spin-based camouflaging schemes, due to the energy-efficient electric-field driven reversal of the MESO device. Based on thorough experimentation, we outline the promises of dynamic camouflaging in securing the supply chain end-to-end along with a case study, demonstrating the efficacy of dynamic camouflaging in securing error-tolerant image processing IP.

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Attacking Split Manufacturing from a Deep Learning Perspective

The notion of integrated circuit split manufacturing which delegates the front-end-of-line (FEOL) and back-end-of-line (BEOL) parts to different foundries, is to prevent overproduction, piracy of the intellectual property (IP), or targeted insertion of hardware Trojans by adversaries in the FEOL facility. In this work, we challenge the security promise of split manufacturing by formulating various layout-level placement and routing hints as vector- and image-based features. We construct a sophisticated deep neural network which can infer the missing BEOL connections with high accuracy. Compared with the publicly available network-flow attack [1], for the same set of ISCAS-85 benchmarks, we achieve 1.21X accuracy when splitting on M1 and 1.12X accuracy when splitting on M3 with less than 1% running time.

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Benchmarking at the Frontier of Hardware Security: Lessons from Logic Locking

Integrated circuits (ICs) are the foundation of all computing systems. They comprise high-value hardware intellectual property (IP) that are at risk of piracy, reverse-engineering, and modifications while making their way through the geographically-distributed IC supply chain. On the frontier of hardware security are various design-for-trust techniques that claim to protect designs from untrusted entities across the design flow. Logic locking is one technique that promises protection from the gamut of threats in IC manufacturing. In this work, we perform a critical review of logic locking techniques in the literature, and expose several shortcomings. Taking inspiration from other cybersecurity competitions, we devise a community-led benchmarking exercise to address the evaluation deficiencies. In reflecting on this process, we shed new light on deficiencies in evaluation of logic locking and reveal important future directions. The lessons learned can guide future endeavors in other areas of hardware security.

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SMART: Secure Magnetoelectric AntifeRromagnet-Based Tamper-Proof Non-Volatile Memory

The storage industry is moving toward emerging non-volatile memories (NVMs), including the spin-transfer torque magnetoresistive random-access memory (STT-MRAM) and the phase-change memory (PCM), owing to their high density and low-power operation. In this paper, we demonstrate, for the first time, circuit models and performance benchmarking for the domain wall (DW) reversal-based magnetoelectric-antiferromagnetic random access memory (ME-AFMRAM) at cell-level and at array-level. We also provide perspectives for coherent rotation-based memory switching with topological insulator-driven anomalous Hall read-out. In the coherent rotation regime, the ultra-low power magnetoelectric switching coupled with the terahertz-range antiferromagnetic dynamics result in substantially lower energy-per-bit and latency metrics for the ME-AFMRAM compared to other NVMs including STTMRAM and PCM. After characterizing the novel ME-AFMRAM, we leverage its unique properties to build a dense, on-chip, secure NVM platform, called SMART: A Secure Magnetoelectric Antiferromagnet- Based Tamper-Proof Non-Volatile Memory. New NVM technologies open up challenges and opportunities from a data-security perspective. For example, their sensitivity to magnetic fields and temperature fluctuations, and their data remanence after power-down make NVMs vulnerable to data theft and tampering attacks. The proposed SMART memory is not only resilient against data confidentiality attacks seeking to leak sensitive information but also ensures data integrity and prevents Denial-of-Service (DoS) attacks on the memory. It is impervious to particular power side-channel (PSC) attacks which exploit asymmetric read/write signatures for 0 and 1 logic levels, and photonic side-channel attacks which monitor photo-emission signatures from the chip backside.

cs.ET↗

Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

Layout camouflaging can protect the intellectual property of modern circuits. Most prior art, however, incurs excessive layout overheads and necessitates customization of active-device manufacturing processes, i.e., the front-end-of-line (FEOL). As a result, camouflaging has typically been applied selectively, which can ultimately undermine its resilience. Here, we propose a low-cost and generic scheme---full-chip camouflaging can be finally realized without reservations. Our scheme is based on obfuscating the interconnects, i.e., the back-end-of-line (BEOL), through design-time handling for real and dummy wires and vias. To that end, we implement custom, BEOL-centric obfuscation cells, and develop a CAD flow using industrial tools. Our scheme can be applied to any design and technology node without FEOL-level modifications. Considering its BEOL-centric nature, we advocate applying our scheme in conjunction with split manufacturing, to furthermore protect against untrusted fabs. We evaluate our scheme for various designs at the physical, DRC-clean layout level. Our scheme incurs a significantly lower cost than most of the prior art. Notably, for fully camouflaged layouts, we observe average power, performance, and area overheads of 24.96%, 19.06%, and 32.55%, respectively. We conduct a thorough security study addressing the threats (attacks) related to untrustworthy FEOL fabs (proximity attacks) and malicious end-users (SAT-based attacks). An empirical key finding is that only large-scale camouflaging schemes like ours are practically secure against powerful SAT-based attacks. Another key finding is that our scheme hinders both placement- and routing-centric proximity attacks; correct connections are reduced by 7.47X, and complexity is increased by 24.15X, respectively, for such attacks.

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DynUnlock: Unlocking Scan Chains Obfuscated using Dynamic Keys

Outsourcing in semiconductor industry opened up venues for faster and cost-effective chip manufacturing. However, this also introduced untrusted entities with malicious intent, to steal intellectual property (IP), overproduce the circuits, insert hardware Trojans, or counterfeit the chips. Recently, a defense is proposed to obfuscate the scan access based on a dynamic key that is initially generated from a secret key but changes in every clock cycle. This defense can be considered as the most rigorous defense among all the scan locking techniques. In this paper, we propose an attack that remodels this defense into one that can be broken by the SAT attack, while we also note that our attack can be adjusted to break other less rigorous (key that is updated less frequently) scan locking techniques as well.

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ScanSAT: Unlocking Static and Dynamic Scan Obfuscation

While financially advantageous, outsourcing key steps, such as testing, to potentially untrusted Outsourced Assembly and Test (OSAT) companies may pose a risk of compromising on-chip assets. Obfuscation of scan chains is a technique that hides the actual scan data from the untrusted testers; logic inserted between the scan cells, driven by a secret key, hides the transformation functions that map the scan-in stimulus (scan-out response) and the delivered scan pattern (captured response). While static scan obfuscation utilizes the same secret key, and thus, the same secret transformation functions throughout the lifetime of the chip, dynamic scan obfuscation updates the key periodically. In this paper, we propose ScanSAT: an attack that transforms a scan obfuscated circuit to its logic-locked version and applies the Boolean satisfiability (SAT) based attack, thereby extracting the secret key. We implement our attack, apply on representative scan obfuscation techniques, and show that ScanSAT can break both static and dynamic scan obfuscation schemes with 100% success rate. Moreover, ScanSAT is effective even for large key sizes and in the presence of scan compression.

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A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual property (IP) of ICs, SM can further mitigate the insertion of hardware Trojans (HTs). In this paper, we strive for the "best of both worlds," that is we seek to combine the individual strengths of SM and LC. By jointly extending SM and LC techniques toward 3D integration, an up-and-coming paradigm based on stacking and interconnecting of multiple chips, we establish a modern approach to hardware security. Toward that end, we develop a security-driven CAD and manufacturing flow for 3D ICs in two variations, one for IP protection and one for HT prevention. Essential concepts of that flow are (i) "3D splitting" of the netlist to protect, (ii) obfuscation of the vertical interconnects (i.e., the wiring between stacked chips), and (iii) for HT prevention, a security-driven synthesis stage. We conduct comprehensive experiments on DRC-clean layouts of multi-million-gate DARPA and OpenCores designs (and others). Strengthened by extensive security analysis for both IP protection and HT prevention, we argue that entering the third dimension is eminent for effective and efficient hardware security.

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Is Robust Design-for-Security Robust Enough? Attack on Locked Circuits with Restricted Scan Chain Access

The security of logic locking has been called into question by various attacks, especially a Boolean satisfiability (SAT) based attack, that exploits scan access in a working chip. Among other techniques, a robust design-for-security (DFS) architecture was presented to restrict any unauthorized scan access, thereby, thwarting the SAT attack (or any other attack that relies on scan access). Nevertheless, in this work, we successfully break this technique by recovering the secret key despite the lack of scan access. Our security analysis on a few benchmark circuits protected by the robust DFS architecture demonstrates the effectiveness of our attack; on average ~95% of the key bits are correctly recovered, and almost 100% in most cases. To overcome this and other prevailing attacks, we propose a defense by making fundamental changes to the robust DFS technique; the new defense can withstand all logic locking attacks. We observe, on average, lower area overhead (~1.65%) than the robust DFS design (~5.15%), and similar test coverage (~99.88%).

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Toward Physically Unclonable Functions from Plasmonics-Enhanced Silicon Disc Resonators

The omnipresent digitalization trend has enabled a number of related malicious activities, ranging from data theft to disruption of businesses, counterfeiting of devices, and identity fraud, among others. Hence, it is essential to implement security schemes and to ensure the reliability and trustworthiness of electronic circuits. Toward this end, the concept of physically unclonable functions (PUFs) has been established at the beginning of the 21st century. However, most PUFs have eventually, at least partially, fallen short of their promises, which are unpredictability, unclonability, uniqueness, reproducibility, and tamper resilience. That is because most PUFs directly utilize the underlying microelectronics, but that intrinsic randomness can be limited and may thus be predicted, especially by machine learning. Optical PUFs, in contrast, are still considered as promising---they can derive strong, hard-to-predict randomness independently from microelectronics, by using some kind of "optical token." Here we propose a novel concept for plasmonics-enhanced optical PUFs, or peo-PUFs in short. For the first time, we leverage two highly nonlinear phenomena in conjunction by construction: (i) light propagation in a silicon disk resonator, and (ii) surface plasmons arising from nanoparticles arranged randomly on top of the resonator. We elaborate on the physical phenomena, provide simulation results, and conduct a security analysis of peo- PUFs for secure key generation and authentication. This study highlights the good potential of peo-PUFs, and our future work is to focus on fabrication and characterization of such PUFs.

physics.app-ph↗

3D Integration: Another Dimension Toward Hardware Security

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.

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An Interposer-Based Root of Trust: Seize the Opportunity for Secure System-Level Integration of Untrusted Chiplets

Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level integration. We showcase our scheme by utilizing industrial ARM components that are interconnected via a security-providing active interposer, and thoroughly evaluate the achievable security via different threat scenarios. Finally, we provide detailed end-to-end physical design results to demonstrate the efficacy of our proposed methodology.

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Spin-Orbit Torque Devices for Hardware Security: From Deterministic to Probabilistic Regime

Protecting intellectual property (IP) has become a serious challenge for chip designers. Most countermeasures are tailored for CMOS integration and tend to incur excessive overheads, resulting from additional circuitry or device-level modifications. On the other hand, power density is a critical concern for sub-50 nm nodes, necessitating alternate design concepts. Although initially tailored for error-tolerant applications, imprecise computing has gained traction as a general-purpose design technique. Emerging devices are currently being explored to implement ultra-low-power circuits for inexact computing applications. In this paper, we quantify the security threats of imprecise computing using emerging devices. More specifically, we leverage the innate polymorphism and tunable stochastic behavior of spin-orbit torque (SOT) devices, particularly, the giant spin-Hall effect (GSHE) switch. We enable IP protection (by means of logic locking and camouflaging) simultaneously for deterministic and probabilistic computing, directly at the GSHE device level. We conduct a comprehensive security analysis using state-of-the-art Boolean satisfiability (SAT) attacks; this study demonstrates the superior resilience of our GSHE primitive when tailored for deterministic computing. We also demonstrate how probabilistic computing can thwart most, if not all, existing SAT attacks. Based on this finding, we propose an attack scheme called probabilistic SAT (PSAT) which can bypass the defense offered by logic locking and camouflaging for imprecise computing schemes. Further, we illustrate how careful application of our GSHE primitive can remain secure even on the application of the PSAT attack. Finally, we also discuss side-channel attacks and invasive monitoring, which are arguably even more concerning threats than SAT attacks.

cs.ET↗

A New Paradigm in Split Manufacturing: Lock the FEOL, Unlock at the BEOL

Split manufacturing was introduced as an effective countermeasure against hardware-level threats such as IP piracy, overbuilding, and insertion of hardware Trojans. Nevertheless, the security promise of split manufacturing has been challenged by various attacks, which exploit the well-known working principles of physical design tools to infer the missing BEOL interconnects. In this work, we advocate a new paradigm to enhance the security for split manufacturing. Based on Kerckhoff's principle, we protect the FEOL layout in a formal and secure manner, by embedding keys. These keys are purposefully implemented and routed through the BEOL in such a way that they become indecipherable to the state-of-the-art FEOL-centric attacks. We provide our secure physical design flow to the community. We also define the security of split manufacturing formally and provide the associated proofs. At the same time, our technique is competitive with current schemes in terms of layout overhead, especially for practical, large-scale designs (ITC'99 benchmarks).

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Protect Your Chip Design Intellectual Property: An Overview

The increasing cost of integrated circuit (IC) fabrication has driven most companies to "go fabless" over time. The corresponding outsourcing trend gave rise to various attack vectors, e.g., illegal overproduction of ICs, piracy of the design intellectual property (IP), or insertion of hardware Trojans (HTs). These attacks are possibly conducted by untrusted entities residing all over the supply chain, ranging from untrusted foundries, test facilities, even to end-users. To overcome this multitude of threats, various techniques have been proposed over the past decade. In this paper, we review the landscape of IP protection techniques, which can be classified into logic locking, layout camouflaging, and split manufacturing. We discuss the history of these techniques, followed by state-of-the-art advancements, relevant limitations, and scope for future work.

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Best of Both Worlds: Integration of Split Manufacturing and Camouflaging into a Security-Driven CAD Flow for 3D ICs

With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

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