arXiv subjects
Publications and source records attributed to P Normand.
In this work, the comparison of resistive memory MIS single-cells without selector (1R), having silicon nitride as switching dielectric, fabricated on SOI and bulk Si wafers is demonstrated. Comprehensive experimental investigations reveal the advantage of SOI substrate over bulk Si in terms of cycling endurance, cell-to-cell variability, retention and data loss rate.
Resistive memories (RRAM) are promising candidates for replacing present nonvolatile memories and realizing storage class memories; hence resistance switching devices are of particular interest. These devices are typically memristive, with a large number of discrete resistance levels and in some configurations, they perform as analog memories. Noise studies have been used to enlighten further the resistance switching mechanism in these devices. Recently, a strong interest arose on the noise generated by RRAM/memristors because due to their inherent stochasticity can be used for cryptography and other security applications. In this work, two fully CMOS compatible memristive devices both with silicon nitride as switching material, were examined in terms of multi-level resistance operation. Using appropriate SET/RESET pulse sequences through a flexible analog tuning protocol, four stable resistance states were investigated through random telegraph noise measurements and analysis. A possible model enlightening the role of silicon nitride defects in the observed noise signals at different resistive states is presented.
Several resistive memory technologies (RRAMs) are prominent, but few are fulfilling the requirements for CMOS integration and meet the commercialization standards. In this work, the fabrication and electrical characterization of a fully compatible CMOS process on SOI substrate of 1R silicon SiN-based resistance switching (RS) MIS devices is presented. The RS characteristics are compared with the same devices previously fabricated on bulk silicon.
Stoichiometric SiNx layers (x = [N]/[Si] = 1.33) are doped with Si atoms by ultra-low energy ion implantation (ULE-II) and subsequently annealed at different temperatures in inert ambient conditions. Detailed material and memory cells characterization is performed to investigate the effect of Si dopants on the switching properties and performance of the fabricated resistive memory cells. In this context extensive dc current-voltage and impedance spectroscopy measurements are carried out systematically and the role of doping in dielectric properties of the nitride films is enlightened. The dc and ac conduction mechanisms are investigated in a comprehensive way. Room temperature retention characteristics of resistive states are also presented.
Doping stoichiometric SiNx layers (x=[N]/[Si]=1.33) with Si atoms by ultra-low energy ion implantation (ULE-II) and annealing them at different temperatures can significantly impact the switching characteristics. Electrical characterization and dielectric breakdown measurements are used to identify the main switching properties and performance of the fabricated devices and the effect that the Si dopants and annealing temperature have. In addition, impedance spectroscopy measurements revealed the dielectric properties of the silicon nitride films, as well as the ac conductance, which is utilized to identify the conduction mechanisms.