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Puqing Jiang

Publications and source records attributed to Puqing Jiang.

At least 19 recordsLinked to original sources

A transfer-learning-enhanced POD-FNN surrogate for rapid signal prediction and inverse fitting in thermoreflectance with patterned transducers

Patterned-transducer thermoreflectance enhances sensitivity to low-thermal-conductivity materials by suppressing lateral heat spreading in the metal transducer, but its wider use is limited by the cost of repeated high-fidelity forward evaluations in iterative fitting. Here, we develop a transfer-learning-enhanced POD-FNN surrogate for rapid phase prediction in patterned-transducer thermoreflectance, using patterned FDTR as a representative case. A validated COMSOL model is first constructed, and proper orthogonal decomposition is applied directly to the phase signals to build a compact reduced-order representation. A feedforward neural network is then trained to predict the POD coefficients from thermophysical and geometric parameters. Within the original parameter domain, the surrogate achieves mean and median RMSE values of 0.19 and 0.17 degrees, with a maximum RMSE below 0.47 degrees, while reducing the average prediction time per signal from 5.39 s to 0.01 s (about 534x). In inverse analysis, the fitting time for a representative case is reduced from about 18950 s to about 65 s with comparable accuracy. The framework is further applied to measured Al/SiO2 samples, yielding stable silica thermal conductivities of 1.44 +/- 0.088, 1.43 +/- 0.093, and 1.50 +/- 0.079 W/(m K) for conventional FDTR and patterned FDTR with pattern radii of 5.3 and 3.25 um, respectively. Transfer learning further improves performance in expanded parameter domains, with the TL-FR strategy giving the best overall results. Reducing the additional target-domain dataset from 6000 to 1000 samples also lowers the high-fidelity data-generation time from about 34179 s to about 5885 s. The proposed framework provides an accurate and efficient route for repeated forward evaluation, rapid inverse fitting, and cost-effective model updating in patterned thermoreflectance workflows.

physics.app-ph

Universal thermometry of solid-liquid interfacial thermal conductance

Solid-liquid interfacial thermal conductance (ITC) critically influences heat transport in microfluidic, electronic, and energy systems, yet most optical thermometry techniques are limited to specific metal-liquid interfaces. In this work, we introduce a universal broadband square-pulsed thermometry method that enables simultaneous quantification of ITC across a wide range of arbitrary solid-liquid interfaces, while also providing accurate measurements of nanoscale liquid-film thickness. To validate the method, we applied it to Al-water interfaces, yielding ITC values in the range of 50-55 MW m^(-2) K^(-1), consistent with prior studies. The technique also reveals markedly lower ITCs for glass-water (9.9 MW m^(-2) K^(-1)) and Si-water (5.7 MW m^(-2) K^(-1)), and further measurements on Al-silicone oil (~10 MW m^(-2) K^(-1)) and PMMA-silicone oil (~0.4 MW m^(-2) K^(-1)) extend the validation to highly viscous nonpolar liquids and polymer-liquid interfaces. These results highlight the capability of the method to capture thermal transport differences across diverse solid-liquid combinations. Further comparisons with acoustic/diffuse mismatch models and molecular dynamics simulations, together with theoretical analysis, highlight the influence of vibrational mismatch, wettability, and surface condition on interfacial thermal transport. This broadly applicable technique enables rapid, quantitative characterization of solid-liquid interfacial thermal transport, with broad implications for interfacial heat transfer science and technology.

physics.app-ph

Simultaneous, Non-Contact Measurement of Liquid and Interfacial Thermal Properties via a Differential Square-Pulsed Source Method

Accurate characterization of heat transport across solid-liquid interfaces is essential for thermal management in micro and nanoscale systems. Yet existing techniques often require prior knowledge of liquid properties, which complicates the simultaneous resolution of interfacial and bulk behaviors, and lose sensitivity once interfacial conductance exceeds 100 MW m-2 K-1. Here we present a differential square pulsed source (DSPS) method that provides simultaneous, non-contact measurement of liquid thermal conductivity, volumetric heat capacity, and solid-liquid interfacial conductance without any predefined material parameters. Dual frequency excitation combined with in-situ substrate referencing enables property extraction from multilayer structures, and numerical simulations show a typical uncertainty of about 8 % in interfacial conductance, confirming robustness. The protocol is validated for a wide spectrum of liquids, including oils, lubricants, aqueous electrolytes, and pure water, with excellent agreement with literature values for bulk properties. Analysis of the data set clarifies how vibrational spectrum mismatch, ionic layering, and related interfacial phenomena govern heat transfer, and demonstrates that oleophilic hexadecyl silane modification of aluminum increases interfacial conductance by a factor of sixteen. The results reveal that conductance can be strongly tuned through surface wettability and chemical functionalization, offering direct guidelines for interface engineering. Because the approach is readily extendable to soft materials such as thermal interface gels, it promises broad applicability in emerging interface-dominated thermal technologies.

physics.app-ph

A Variable-Spot-Size and Multi-Frequency Square-Pulsed Source (SPS) Approach for Comprehensive Characterization of Anisotropic Thermal Transport Properties in Multilayered Thin Films

Multilayered thin-film structures are frequently encountered in industrial applications, where accurate thermal property characterization is essential for performance optimization. These films, typically ranging from nanometers to micrometers in thickness, often exhibit anisotropic thermal conductivity and non-bulk heat capacity, which are challenging to measure. In this study, we introduce a variable-spot-size and multi-frequency square-pulsed source (SPS) method for the simultaneous determination of anisotropic thermal conductivities, heat capacities, and interfacial thermal conductance in multilayered systems. By leveraging a broad modulation frequency range (1 Hz to 10 MHz) and tunable laser spot sizes, the SPS method enhances sensitivity to different thermal parameters across layers. We validate this approach on a silicon-on-insulator (SOI) sample comprising a 1.59 um Si layer, 1.03 um SiO2 layer, and a silicon substrate with a 122 nm aluminum (Al) transducer. The SPS method successfully extracts seven key thermal parameters, including the in-plane and cross-plane thermal conductivities and heat capacity of the Si film, the thermal conductivity and heat capacity of the SiO2 layer, the thermal conductivity of the substrate, and the interfacial thermal conductance between Al and Si. Temperature-dependent measurements from 80 to 500 K showed excellent agreement with literature values and first-principles predictions, confirming the method's accuracy and reliability. These results demonstrate the SPS method as a powerful tool for comprehensive thermal characterization of complex multilayered structures, with implications for both fundamental research and practical applications.

physics.app-ph

Depth-Resolved Thermal Conductivity of HFCVD Diamond Films via Square-Pulsed Thermometry

The integration of high-thermal-conductivity diamond films onto silicon carbide (SiC) substrates offers a promising pathway for thermal management in high-power electronic devices. Here, we investigate the depth-dependent thermal conductivity of a ~5 μm-thick diamond film grown on SiC by hot-filament chemical vapor deposition (HFCVD) using square-pulsed source (SPS) thermometry. Electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM) reveal pronounced grain coarsening from the nucleation interface to the film surface. By combining frequency-dependent thermal penetration with a depth-resolved thermal transport model, we quantitatively reconstruct the thermal conductivity profile. The thermal conductivity increases sharply from ~60 W m^(-1) K^(-1) near the nucleation region to ~200 W m^(-1) K^(-1) at the surface, directly reflecting the underlying microstructural evolution. These results provide a physically grounded understanding of graded heat transport in HFCVD diamond and offer practical guidance for engineering diamond-based thermal management layers for next-generation power devices.

cond-mat.mtrl-sci

Anisotropic Thermal Characterization of Suspended and Spin-Coated Polyimide Films Using a Square-Pulsed Source Method

Polyimide (PI) thin films are widely used in advanced technologies, yet accurate characterization of their thermal properties remains challenging, as evidenced by significant inconsistencies in reported data and an incomplete understanding of heat transfer mechanisms. In this study, we employ an optical Square-Pulsed Source (SPS) technique to simultaneously measure the in-plane and cross-plane thermal conductivities, as well as the volumetric heat capacity, of PI thin films. SPS is a pump-probe method that utilizes a square-wave-modulated pump laser to induce periodic heating and a probe laser to detect the thermoreflectance response. Thermal properties are extracted by analyzing amplitude signals across multiple modulation frequencies and laser spot sizes. Measurements were conducted on both suspended commercial PI films and spin-coated PI films on fused silica substrates. The results show that spin-coated films exhibit higher cross-plane thermal conductivity and lower anisotropy compared to suspended films, which we attribute to differences in molecular orientation and substrate interactions. These findings provide new physical insights into anisotropic heat transport in polymer thin films and demonstrate the SPS technique as a robust tool for probing microscale thermal phenomena in soft materials.

physics.app-ph

Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis

Accurate evaluation of buried thermal interfaces is vital for understanding and optimizing heat dissipation in wide- and ultra-wide-bandgap (WBG/UWBG) semiconductor devices. Conventional time-domain thermoreflectance (TDTR) typically probes only near-surface transport due to its restricted modulation frequency range. Here, we employ a frequency-tunable periodic waveform analysis TDTR (PWA-TDTR) technique to perform depth-resolved thermal measurements on three representative systems: epitaxial ε-Ga2O3/SiC, GaN/Si, and mechanically bonded GaN/diamond. By combining broadband multi-frequency probing with sensitivity-guided joint fitting, we quantitively determine interfacial thermal conductance, layer-specific thermal conductivity, and volumetric heat capacity, without requiring destructive sample preparation. The results reveal that the buried Ga2O3/SiC interface exhibits weak phonon transmission due to acoustic mismatch; the transition layers in GaN/Si act as phonon-impedance gradients that redistribute heat flux; and the GaN/diamond boundary remains the dominant thermal bottleneck despite diamond's ultrahigh bulk conductivity. These findings demonstrate that the modulation frequency in PWA-TDTR functions as a tunable probe of depth-dependent phonon transport, directly linking frequency-domain thermal response to interfacial energy transmission. Overall, this work positions PWA-TDTR as a versatile platform for investigating buried nonmetal-nonmetal interfaces in next-generation high-power and optoelectronic materials.

physics.app-ph

Simultaneous measurement of pressure-dependent bulk and interfacial thermal properties in thermal interface materials using square-pulsed source thermoreflectance

Thermal interface materials (TIMs) critically regulate heat dissipation from electronic chips to heat spreaders, yet their thermal conductivity (k), volumetric heat capacity (C), and interfacial thermal resistance (ITR) evolve with mechanical pressure and cannot be determined simultaneously using existing steady-state or transient techniques. As a result, the coupled roles of bulk compaction and interfacial contact in governing heat transport in TIM assemblies remain poorly resolved. Here, we present a square-pulsed source (SPS) thermoreflectance method that enables simultaneous determination of k, C, and ITR in TIM stacks under controlled mechanical loading. By spanning square-wave modulation frequencies from 1 Hz to 10 MHz, SPS probes a broad range of thermal penetration depths, enabling distinction between heat diffusion in the TIM bulk and interfacial heat transfer at the Al/TIM contact. Measurements on a thermally conductive gel, a thermal pad, and a high-vacuum grease during compression-unloading cycles reveal distinct pressure-dependent thermal transport mechanisms. The gel and pad exhibit increases in k and C, reduced ITR, and pronounced hysteresis, indicating coupled bulk densification and persistent interfacial conformity during loading cycles. In contrast, the grease shows nearly pressure-independent bulk properties but a strong pressure dependence of ITR, consistent with an interface-dominated response. These results resolve the long-standing challenge of simultaneously quantifying bulk and interfacial thermal transport in mechanically loaded TIM assemblies, enabling experimentally constrained thermal management and reliability analysis in electronic packaging.

physics.app-ph

Weak Coupling of Diffusional and Phonon-like Modes in Liquids Revealed by Dynamic Kapitza Length

Understanding heat transfer across solid-liquid interfaces is central to thermal management and energy technologies, yet whether the interfacial thermal conductance (ITC) depends on the timescale of heating remains unclear. Here we use square-pulsed source thermoreflectance, which combines time-resolved detection with broadband modulation, to probe Al-water and Al-octane interfaces. We observe a reproducible increase of the apparent ITC with modulation frequency. A control Al-silica interface shows no measurable frequency dependence, indicating that the effect is specific to liquids rather than a generic feature shared by all amorphous materials. We explain the data with a two-channel liquid picture in which diffusional and phonon-like modes exchange energy weakly over a finite nonequilibrium length. From the relative magnitude of the thermal penetration depth and the nonequilibrium length, we identify three transport regimes. These findings challenge the common assumption of fully equilibrated liquid modes and provide experimental constraints for modeling dynamic energy exchange at liquid interfaces.

cond-mat.mtrl-sci

Mechanistic Insight into BEOL Thermal Transport via Optical Metrology and Multiphysics Simulation

As integrated circuits continue to scale down and adopt three-dimensional (3D) stacking, thermal management in the back-end-of-line (BEOL) has emerged as a critical design constraint. In this study, we present a combined experimental and simulation framework to quantitatively characterize and mechanistically understand thermal transport in BEOL multilayers. Using the Square-Pulsed Source (SPS) method, a time-resolved optical metrology technique, we measure cross-plane thermal resistance and areal heat capacity in semiconductor chips at nanometer resolution. Two fabricated chip samples, polished to the M4 and M6 interconnection layers, are analyzed to extract thermal properties of distinct multilayer stacks. Results show that thermal resistance follows a series model, while areal heat capacity scales linearly with metal content. To uncover the underlying physical mechanisms, we perform finite element simulations using COMSOL Multiphysics, examining the influence of via connectivity and dielectric thermal conductivity on effective cross-plane heat transport. The simulations reveal that dielectric materials, due to their large volume fraction, are the primary limiting factor in BEOL thermal conduction, while the via structure plays a secondary but significant role. This combined experimental-simulation approach provides mechanistic insight into heat transport in advanced IC architectures and offers practical guidance for optimizing thermal pathways in future high-performance 3D-stacked devices.

cond-mat.mes-hall

Hybrid Particle Swarm Optimization for Fast and Reliable Parameter Extraction in Thermoreflectance

Frequency-domain thermoreflectance (FDTR) is a widely used technique for characterizing thermal properties of multilayer thin films. However, extracting multiple parameters from FDTR measurements presents a nonlinear inverse problem due to its high dimensionality and multimodal, non-convex solution space. This study evaluates four popular global optimization algorithms: Genetic Algorithm (GA), Quantum Genetic Algorithm (QGA), Particle Swarm Optimization (PSO), and Fireworks Algorithm (FWA), for extracting parameters from FDTR measurements of a GaN/Si heterostructure. However, none achieve reliable convergence within 60 seconds. To improve convergence speed and accuracy, we propose an AI-driven hybrid optimization framework that combines each global algorithm with a Quasi-Newton local refinement method, resulting in four hybrid variants: HGA, HQGA, HPSO, and HFWA. Among these, HPSO outperforms all other methods, with 80% of trials reaching the target fitness value within 60 seconds, showing greater robustness and a lower risk of premature convergence. In contrast, only 30% of HGA and HQGA trials and 20% of HFWA trials achieve this threshold. We then evaluate the worst-case performance across 100 independent trials for each algorithm when the time is extended to 1000 seconds. Only HPSO, PSO, and HGA consistently reach the target accuracy, with HPSO converging five times faster than the others. HPSO provides a general-purpose solution for inverse problems in thermal metrology and can be readily extended to other model-fitting techniques.

cs.NE

Extending the Low-Frequency Limit of Time-Domain Thermoreflectance via Periodic Waveform Analysis

Time-domain thermoreflectance (TDTR) is a powerful technique for characterizing the thermal properties of layered materials. However, its effectiveness at modulation frequencies below 0.1 MHz is hindered by pulse accumulation effects, limiting its ability to accurately measure in-plane thermal conductivities below 6 W/(m K). Here, we present a periodic waveform analysis-based TDTR (PWA-TDTR) method that extends the measurable frequency range down to 50 Hz with minimal modifications to the conventional setup. This advancement greatly enhances measurement sensitivity, enabling accurate measurements of in-plane thermal conductivities as low as 0.2 W/(m K). We validate the technique by measuring polymethyl methacrylate (PMMA) and fused silica, using PWA-TDTR to obtain in-plane thermal diffusivity and conventional TDTR to measure cross-plane thermal effusivity. Together, these allow the extraction of both thermal conductivity and volumetric heat capacity, with results in excellent agreement with literature values. We further demonstrate the versatility of PWA-TDTR through (1) thermal conductivity and heat capacity measurements of thin liquid films and (2) depth-resolved thermal conductivity profiling in lithium niobate crystals, revealing point defect-induced inhomogeneities at depths up to 100 um. By overcoming frequency and sensitivity constraints, PWA-TDTR significantly expands the applicability of TDTR, enabling detailed investigations of thermal transport in materials and conditions that were previously challenging to study.

physics.app-ph

Three-dimensional (3D) tensor-based methodology for characterizing 3D anisotropic thermal conductivity tensor

The increasing complexity of advanced materials with anisotropic thermal properties necessitates more generic and efficient methods to determine three-dimensional (3D) anisotropic thermal conductivity tensors with up to six independent components. Current methods rely on a vector-based framework that can handle only up to four independent components, often leading to inefficiencies and inaccuracies. We introduce Three-Dimensional Spatially Resolved Lock-In Micro-Thermography (3D SR-LIT), a novel optical thermal characterization technique combining a 3D tensor-based framework with an efficient area-detection experimental system. For simple tensors (e.g., x-cut quartz, k_xz=k_yz=0), our method reduces uncertainty by over 50% compared to vector-based methods. For complex tensors with six independent components (e.g., AT-cut quartz), 2σ uncertainties remain below 12% for all components. A novel adaptive mapping approach enables high-throughput data acquisition (40 seconds to 3 minutes, depending on tensor complexity), over 35 times faster than current methods, and accommodates samples with 200 nm surface roughness. Extensive numerical validation on 1,000 arbitrary anisotropic tensors ranging from 1 to 1,000 Wm^(-1) K^(-1) further validates the robustness of this methodology. This work highlights significant advancements in thermal characterization of complex anisotropic materials.

cond-mat.mtrl-sci

Decoupling Thermal Properties in Multilayer Systems for Advanced Thermoreflectance Techniques

Thermoreflectance techniques, including time-domain thermoreflectance (TDTR), frequency-domain thermoreflectance (FDTR), and the square-pulsed source (SPS) method, are powerful tools for characterizing the thermal properties of bulk and thin-film materials. However, accurately interpreting their signals remains challenging due to intricate interdependencies among experimental variables. This study introduces a systematic framework based on singular value decomposition (SVD) to decouple these interdependent parameters and enhance the reliability of thermal property extraction. By applying SVD to the sensitivity matrix, we identify key parameter combinations and establish essential dimensionless numbers that govern thermoreflectance signals. The framework is applied to a GaN/Si heterostructure, where the performance of TDTR, FDTR, and SPS is evaluated and compared. The results demonstrate a high degree of consistency across all three techniques. Notably, with the intricate relationships of parameters unraveled, TDTR, FDTR, and SPS demonstrate significant potential to simultaneously and accurately extract five to seven key thermal properties, including thermal conductivity, heat capacity, and interfacial thermal conductance of the GaN/Si multilayer system. This framework not only improves the precision of thermoreflectance measurements but also lays a foundation for advanced thermal metrology in research and industrial applications.

physics.app-ph

Sub-Millimeter-Scale Measurement of Local Convective Heat Transfer Coefficient Exceeding 100 W/(m^2-K) Using an Optical Pump-Probe Method

Conventional methods for measuring the local convective heat transfer coefficient (h_c) often rely on simplifying assumptions that can compromise accuracy. Pump-probe methods like time-domain thermoreflectance (TDTR) avoid these assumptions but are limited to h_c values larger than 30 kW/(m^2-K) due to modulation frequency constraints. This study introduces an optical-based Square-Pulsed Source (SPS) method, expanding the frequency range from 10 MHz to 1 Hz, enabling measurements of h_c values above 100 W/(m^2-K) with uncertainties under 10%. The efficacy of the SPS method is demonstrated through measurements of local h_c in an impingement heat transfer process with a single round gas jet. The local Nusselt number distribution is compared with existing literature correlations, offering insights into convective heat transfer phenomena. This study presents a novel tool for measuring local intrinsic convective heat transfer coefficients, enhancing the understanding of local convective heat transfer.

physics.app-ph

Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Time-domain thermoreflectance (TDTR) is a widely used technique for characterizing the thermal properties of bulk and thin-film materials. Traditional TDTR analyses typically focus on positive delay time data for fitting, often requiring multiple-frequency measurements to simultaneously determine thermal conductivity and heat capacity. However, this multiple-frequency approach is cumbersome and may introduce inaccuracies due to inconsistencies across different frequency measurements. In this study, we propose a novel solution to these challenges by harnessing the often-overlooked negative delay time data in TDTR. By integrating these data points, we offer a streamlined, single-frequency method that simultaneously measures thermal conductivity, heat capacity, and interface thermal conductance for both bulk and thin-film materials, enhancing measurement efficiency and accuracy. We demonstrate the effectiveness of this method by measuring several bulk samples including sapphire, silicon, diamond, and Si0.992Ge0.008, and several thin-film samples including a 1.76-μm-thick gallium nitride (GaN) film epitaxially grown on a silicon substrate, a 320-nm-thick gallium oxide (ε-Ga2O3) film epitaxially grown on a silicon carbide substrate, and a 330-nm-thick tantalum nitride (TaN) film deposited on a sapphire substrate, all coated with an aluminum (Al) transducer layer on the surface. Our results show that the new method accurately determines the thermal conductivity and heat capacity of these samples as well as the Al/sample interface thermal conductance using a single modulation frequency, except for the Si0.992Ge0.008 sample. This study sheds light on the untapped potential of TDTR, offering a new, efficient, and accurate avenue for thermal analysis in material science.

cond-mat.mtrl-sci

Comprehensive Measurement of Three-Dimensional Thermal Conductivity Tensor Using a Beam-Offset Square-Pulsed Source (BO-SPS) Approach

Accurately measuring the three-dimensional thermal conductivity tensor is essential for understanding and engineering the thermal behavior of anisotropic materials. Existing methods often struggle to isolate individual tensor elements, leading to large measurement uncertainties and time-consuming iterative fitting procedures. In this study, we introduce the Beam-Offset Square-Pulsed Source (BO-SPS) method for comprehensive measurements of three-dimensional anisotropic thermal conductivity tensors. This method uses square-pulsed heating and precise temperature rise measurements to achieve high signal-to-noise ratios, even with large beam offsets and low modulation frequencies, enabling the isolation of thermal conductivity tensor elements. We demonstrate and validate the BO-SPS method by measuring X-cut and AT-cut quartz samples. For X-cut quartz, with a known relationship between in-plane and cross-plane thermal conductivities, we can determine the full thermal conductivity tensor and heat capacity simultaneously. For AT-cut quartz, assuming a known heat capacity, we can determine the entire anisotropic thermal conductivity tensor, even with finite off-diagonal terms. Our results yield consistent principal thermal conductivity values for both quartz types, demonstrating the method's reliability and accuracy. This research highlights the BO-SPS method's potential to advance the understanding of thermal behavior in complex materials.

physics.app-ph

Simultaneous Measurement of Thermal Conductivity and Heat Capacity Across Diverse Materials Using the Square-Pulsed Source (SPS) Technique

State-of-the-art techniques like dual-frequency Time-Domain Thermoreflectance (TDTR) and Frequency-Domain Thermoreflectance (FDTR) offer superb capability for simultaneous measurements of thermal conductivity and heat capacity with a spatial resolution on the order of 10 μm. However, their applicability is limited to highly conductive materials with an in-plane thermal conductivity exceeding 10 W/(m*K). In this paper, we introduce the Square-Pulsed Source (SPS) technique, offering a novel approach to concurrently measure thermal conductivity and heat capacity with a 10 μm spatial resolution, while significantly extending the measurable thermal conductivity range to an unprecedented low of 0.1 W/(m*K), offering enhanced versatility. To demonstrate and validate its efficacy, we conducted measurements on various standard materials--PMMA, silica, sapphire, silicon, and diamond--spanning a wide thermal conductivity range from 0.1 to 2000 W/(m*K). The obtained results exhibit remarkable agreement with literature values, with a typical measurement uncertainty of less than 10% across the entire thermal conductivity range. By providing a unique capability to characterize both highly and lowly conductive materials with micron-scale spatial resolution, the SPS method opens new avenues for understanding and engineering thermal properties across diverse applications.

physics.app-ph