arXiv subjects

Rémy Dendievel

Publications and source records attributed to Rémy Dendievel.

3 recordsLinked to original sources

arXiv2025

Stabilizing post-yielding behavior of a stretching dominated lattice structure through microstructural optimization

We investigate the effect of the microstructure on the mechanical response of lattice structures made of a defect tolerant Ti-14 Mo binary alloy fabricated by Electron Powder Bed Fusion. Some of the lattice structures were subjected to different heat treatments to compare different microstructures: a two-phase $α$+$β$ microstructure inherited from the fabrication (as-built), a full $β$-metastable microstructure, and a $β$-metastable microstructure strengthened via nanoprecipitation of the $ω$iso phase. We demonstrate that the macroscopic mechanical behavior of one of the most popular stretching-dominated lattice structure, namely the octet-truss, can be tailored through microstructural optimization by increasing the tolerance to plastic buckling of the constitutive struts. Defect-tolerant materials pave the way towards lattice structures fabricated by additive manufacturing with optimized energy absorption performances.

physics.med-ph↗

arXiv2022

Effect of the build orientation on mechanical and electrical properties of pure Cu fabricated by E-PBF

Electrical conductors are usually made of pure copper because this material shows outstanding electrical conductivity (IACS > 100%). Additive manufacturing can be used to further improve the performances of such electrical conductors because it enables to consider sophisticated geometries impossible to be fabricated by conventional processing routes such as casting, machining or hot forming. In the present work, Electron Beam Powder Bed Fusion is optimized to achieve dense pure copper specimens (relative density >99.9%). Only few residual spherical pores inherited from the as-received powder particles are detected in the samples as nicely revealed by X-ray microtomography scans. Three different build orientations, namely 0{\textdegree}, 45{\textdegree} and 90{\textdegree} with respect to the build direction are produced. The microstructures are characterized using optical microscopy and EBSD measurements. The electrical conductivity is measured using the Eddy current method as well as the four-probes method while the mechanical properties are assessed using Vickers microhardness and tensile mechanical testing. The electrical and mechanical performances are discussed in the light of the microstructural characterizations, and further compared with a cold-worked Cu-ETP sheet subjected to an annealing treatment. It demonstrates that E-PBF is able to reliably produce components made of pure Copper whose properties equal those of pure copper fabricated by more conventional processing routes, regardless of the build orientation.

physics.med-ph↗

arXiv2019

Atomic-scale grain boundary engineering to overcome hot-cracking in additively-manufactured superalloys

There are still debates regarding the mechanisms that lead to hot cracking in parts build by additive manufacturing (AM) of non-weldable Ni-based superalloys. This lack of in-depth understanding of the root causes of hot cracking is an impediment to designing engineering parts for safety-critical applications. Here, we deploy a near-atomic-scale approach to investigate the details of the compositional decoration of grain boundaries in the coarse-grained, columnar microstructure in parts built from a non-weldable Ni-based superalloy by selective electron-beam melting. The progressive enrichment in Cr, Mo and B at grain boundaries over the course of the AM-typical successive solidification and remelting events, accompanied by solid-state diffusion, causes grain boundary segregation induced liquation. This observation is consistent with thermodynamic calculations. We demonstrate that by adjusting build parameters to obtain a fine-grained equiaxed or a columnar microstructure with grain width smaller than 100 $μ$m enables to avoid cracking, despite strong grain boundary segregation. We find that the spread of critical solutes to a higher total interfacial area, combined with lower thermal stresses, helps to suppress interfacial liquation.

cond-mat.mtrl-sci↗