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R. Lipton

Publications and source records attributed to R. Lipton.

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Solid State Detectors and Tracking for Snowmass

Tracking detectors are of vital importance for collider-based high energy physics (HEP) experiments. The primary purpose of tracking detectors is the precise reconstruction of charged particle trajectories and the reconstruction of secondary vertices. The performance requirements from the community posed by the future collider experiments require an evolution of tracking systems, necessitating the development of new techniques, materials and technologies in order to fully exploit their physics potential. In this article we summarize the discussions and conclusions of the 2022 Snowmass Instrumentation Frontier subgroup on Solid State and Tracking Detectors (Snowmass IF03).

physics.ins-det

Muon Collider Forum Report

A multi-TeV muon collider offers a spectacular opportunity in the direct exploration of the energy frontier. Offering a combination of unprecedented energy collisions in a comparatively clean leptonic environment, a high energy muon collider has the unique potential to provide both precision measurements and the highest energy reach in one machine that cannot be paralleled by any currently available technology. The topic generated a lot of excitement in Snowmass meetings and continues to attract a large number of supporters, including many from the early career community. In light of this very strong interest within the US particle physics community, Snowmass Energy, Theory and Accelerator Frontiers created a cross-frontier Muon Collider Forum in November of 2020. The Forum has been meeting on a monthly basis and organized several topical workshops dedicated to physics, accelerator technology, and detector R&D. Findings of the Forum are summarized in this report.

hep-ex

Electronics for Fast Timing

Picosecond-level timing will be an important component of the next generation of particle physics detectors. The ability to add a 4$^{th}$ dimension to our measurements will help address the increasing complexity of events at hadron colliders and provide new tools for precise tracking and calorimetry for all experiments. Detectors are described in detail on other whitepapers. In this note, we address challenges in electronics design for the new generations of fast timing detectors

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Integration and Packaging

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.

hep-ex

Simulations of Silicon Radiation Detectors for High Energy Physics Experiments

Silicon radiation detectors are an integral component of current and planned collider experiments in high energy physics. Simulations of these detectors are essential for deciding operational configurations, for performing precise data analysis, and for developing future detectors. In this white paper, we briefly review the existing tools and discuss challenges for the future that will require research and development to be able to cope with the foreseen extreme radiation environments of the High Luminosity runs of the Large Hadron Collider and future hadron colliders like FCC-hh and SPPC.

physics.ins-det

Enabling U.S. participation in Future Higgs Factories

Exciting proposals for a new Higgs factory collider, aimed at the search for new physics and precision studies of particles and forces, especially measurement of the Higgs boson couplings at the loop level, will be evaluated as part of the Snowmass process. Potential facilities include (among others) ILC, FCC-ee, C3, CEPC, CLIC, muon collider and advanced accelerator concepts being investigated by Snowmass topical group AF6, potentially located in Asia, Europe, or the United States. The European Strategy has endorsed an electron-positron Higgs factory as its highest priority after HL-LHC. Much of the detector, software, and physics preparative studies needed for these machines is in common, and is currently being implemented by physicists world-wide. In this white paper for the 2021 Snowmass process we look at current global activity on future Higgs factories and give examples of investments that could be made in these common areas over the next five years to establish a leadership role for the U.S. in a future Higgs factory, wherever it is built. The U.S. high energy physics program confronts a number of challenges that a strong role in the study of the Higgs boson can address. These include, in addition to the scientific results, maintaining leading roles in international partnerships, nurturing and advancing world-leading capabilities and expert resources, and maintaining and attracting talent. The international effort would benefit from increased U.S. participation, and the U.S., in turn, would maintain stature through the partnership.

hep-ex

200 mm Sensor Development Using Bonded Wafers

Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have increased from a few square cm to $\> 200\ m^2$ for the existing CMS tracker. High Luminosity Large Hadron Collider (HL-LHC), CMS and ATLAS tracker upgrades will each require more than $200\ m^2$ of silicon and the CMS High Granularity Calorimeter (HGCAL) will require more than $600\ m^2$. The cost and complexity of assembly of these devices is related to the area of each module, which in turn is set by the size of the silicon sensors. In addition to large area, the devices must be radiation hard, which requires the use of sensors thinned to 200 microns or less. The combination of wafer thinning and large wafer diameter is a significant technical challenge, and is the subject of this work. We describe work on development of thin sensors on $200 mm$ wafers using wafer bonding technology. Results of development runs with float zone, Silicon-on-Insulator and Silicon-Silicon bonded wafer technologies are reported.

physics.ins-det

Charge Collection and Electrical Characterization of Neutron Irradiated Silicon Pad Detectors for the CMS High Granularity Calorimeter

The replacement of the existing endcap calorimeter in the Compact Muon Solenoid (CMS) detector for the high-luminosity LHC (HL-LHC), scheduled for 2027, will be a high granularity calorimeter. It will provide detailed position, energy, and timing information on electromagnetic and hadronic showers in the immense pileup of the HL-LHC. The High Granularity Calorimeter (HGCAL) will use 120-, 200-, and 300-$μ\textrm{m}$ thick silicon (Si) pad sensors as the main active material and will sustain 1-MeV neutron equivalent fluences up to about $10^{16}~\textrm{n}_\textrm{eq}\textrm{cm}^{-2}$. In order to address the performance degradation of the Si detectors caused by the intense radiation environment, irradiation campaigns of test diode samples from 8-inch and 6-inch wafers were performed in two reactors. Characterization of the electrical and charge collection properties after irradiation involved both bulk polarities for the three sensor thicknesses. Since the Si sensors will be operated at -30 $^\circ$C to reduce increasing bulk leakage current with fluence, the charge collection investigation of 30 irradiated samples was carried out with the infrared-TCT setup at -30 $^\circ$C. TCAD simulation results at the lower fluences are in close agreement with the experimental results and provide predictions of sensor performance for the lower fluence regions not covered by the experimental study. All investigated sensors display 60$\%$ or higher charge collection efficiency at their respective highest lifetime fluences when operated at 800 V, and display above 90$\%$ at the lowest fluence, at 600 V. The collected charge close to the fluence of $10^{16}~\textrm{n}_\textrm{eq}\textrm{cm}^{-2}$ exceeds 1 fC at voltages beyond 800 V.

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New Technologies for Discovery

For the field of high energy physics to continue to have a bright future, priority within the field must be given to investments in the development of both evolutionary and transformational detector development that is coordinated across the national laboratories and with the university community, international partners and other disciplines. While the fundamental science questions addressed by high energy physics have never been more compelling, there is acute awareness of the challenging budgetary and technical constraints when scaling current technologies. Furthermore, many technologies are reaching their sensitivity limit and new approaches need to be developed to overcome the currently irreducible technological challenges. This situation is unfolding against a backdrop of declining funding for instrumentation, both at the national laboratories and in particular at the universities. This trend has to be reversed for the country to continue to play a leadership role in particle physics, especially in this most promising era of imminent new discoveries that could finally break the hugely successful, but limited, Standard Model of fundamental particle interactions. In this challenging environment it is essential that the community invest anew in instrumentation and optimize the use of the available resources to develop new innovative, cost-effective instrumentation, as this is our best hope to successfully accomplish the mission of high energy physics. This report summarizes the current status of instrumentation for high energy physics, the challenges and needs of future experiments and indicates high priority research areas.

physics.ins-det

Random on-board pixel sampling (ROPS) X-ray Camera

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

physics.ins-det

Planning the Future of U.S. Particle Physics (Snowmass 2013): Chapter 8: Instrumentation Frontier

These reports present the results of the 2013 Community Summer Study of the APS Division of Particles and Fields ("Snowmass 2013") on the future program of particle physics in the U.S. Chapter 8, on the Instrumentation Frontier, discusses the instrumentation needs of future experiments in the Energy, Intensity, and Cosmic Frontiers, promising new technologies for particle physics research, and issues of gathering resources for long-term research in this area.

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Higgs Working Group Report of the Snowmass 2013 Community Planning Study

This report summarizes the work of the Energy Frontier Higgs Boson working group of the 2013 Community Summer Study (Snowmass). We identify the key elements of a precision Higgs physics program and document the physics potential of future experimental facilities as elucidated during the Snowmass study. We study Higgs couplings to gauge boson and fermion pairs, double Higgs production for the Higgs self-coupling, its quantum numbers and $CP$-mixing in Higgs couplings, the Higgs mass and total width, and prospects for direct searches for additional Higgs bosons in extensions of the Standard Model. Our report includes projections of measurement capabilities from detailed studies of the Compact Linear Collider (CLIC), a Gamma-Gamma Collider, the International Linear Collider (ILC), the Large Hadron Collider High-Luminosity Upgrade (HL-LHC), Very Large Hadron Colliders up to 100 TeV (VLHC), a Muon Collider, and a Triple-Large Electron Positron Collider (TLEP).

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Enabling Intensity and Energy Frontier Science with a Muon Accelerator Facility in the U.S.: A White Paper Submitted to the 2013 U.S. Community Summer Study of the Division of Particles and Fields of the American Physical Society

A staged approach towards muon based facilities for Intensity and Energy Frontier science, building upon existing and proposed facilities at Fermilab, is presented. At each stage, a facility exploring new physics also provides an R&D platform to validate the technology needed for subsequent stages. The envisioned program begins with nuSTORM, a sensitive sterile neutrino search which also provides precision neutrino cross-section measurements while developing the technology of using and cooling muons. A staged Neutrino Factory based upon Project X, sending beams towards the Sanford Underground Research Facility (SURF), which will house the LBNE detector, could follow for detailed exploration of neutrino properties at the Intensity Frontier, while also establishing the technology of using intense bunched muon beams. The complex could then evolve towards Muon Colliders, starting at 126 GeV with measurements of the Higgs resonance to sub-MeV precision, and continuing to multi-TeV colliders for the exploration of physics beyond the Standard Model at the Energy Frontier. An Appendix addresses specific questions raised by the Lepton Colliders subgroup of the CSS2013 Frontier Capabilities Study Group.

physics.acc-ph

3D Technologies for Large Area Trackers

We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.

physics.ins-det

Summary of the Linear Collider Testbeam Workshop 2009 - LCTW09

This note summarises the workshop LCTW09 held between the 3.11.2009 and 5.11.2009 at LAL Orsay. The workshop was dedicated to discuss the beam tests in the years 2010 up to 2013 for detectors to be operated at a future linear electron positron collider. The document underlines the rich R&D program on these detectors in the coming years. Large synergies were identified in the DAQ and software systems. Considerable consolidation of resources are expected from the establishment of semi-permanent beam lines for linear collider detector R&D at major centres like CERN and FNAL. Reproducing a beam structure as foreseen for the International Linear Collider (ILC) would clearly enhance the value of the obtained beam test results. Although not ultimately needed for every research program, all groups would exploit such a feature if it is available.

physics.ins-det

The D0 Silicon Microstrip Tracker

This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider. In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.

physics.ins-det

The Layer 0 Inner Silicon Detector of the D0 Experiment

This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider. L0 provides tracking information from two layers of sensors, which are mounted with center lines at a radial distance of 16.1 mm and 17.6 mm respectively from the beam axis. The sensors and readout electronics are mounted on a specially designed and fabricated carbon fiber structure that includes cooling for sensor and readout electronics. The structure has a thin polyimide circuit bonded to it so that the circuit couples electrically to the carbon fiber allowing the support structure to be used both for detector grounding and a low impedance connection between the remotely mounted hybrids and the sensors.

physics.ins-det