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R. Plackett

Publications and source records attributed to R. Plackett.

10 recordsLinked to original sources

A Reusable Four-Port S-Parameter to Link-Level Signal-Integrity Analysis Framework for High-Speed Detector Interconnects

A reusable MATLAB signal-integrity (SI) framework is presented that converts compatible four-port S-parameter data, measured by VNA or obtained from electromagnetic simulation, into traceable link-level evidence rather than a single loss metric. Its contribution is the checked, traceable automation of established SI operations while keeping source data, model assumptions, analytical projections, and finite-record observations distinct. The framework is demonstrated on the four 1.25 Gbps differential routes (DP1-DP4) of the PPCB-1347-MuPix11 probe card using PTSL CST Microwave 3D-Solver-derived four-port S-parameters and a virtual time-domain solver. The automated pipeline preflights file structures, performs a power-normalized mixed-mode transformation, applies route-length-aware loss decomposition, constructs a causally loaded channel model, and propagates full PRBS-31 sequences into eye-diagram, conditional-BER, and 8b10b-coded-link analyses. At the 1.25 Gbps data rate (Nyquist 0.625 GHz), DP1-DP4 exhibit differential insertion loss (SDD21) from -0.350 to -0.300 dB, differential-to-common conversion from -31.038 to -28.236 dBc, and modeled FEB-input eye openings from 0.586 to 0.588 V. The comparison shows that path length alone is not an adequate SI ranking variable: DP3 has the lowest Nyquist insertion loss, DP1 the strongest differential-to-common isolation, and DP4 the largest modeled eye. All analytical BER values remain below the reporting floor and therefore do not support a BER ranking. By preserving the distinction between route-dependent waveform behavior, model projections, and finite-record observations, the framework provides an extensible basis for comparative high-speed-interconnect SI analysis from design review through calibrated VNA measurement interpretation.

hep-ex

Investigation of the in-pixel response of the Mupix11 monolithic pixel sensor using a microfocus X-ray beam at Diamond Light Source

MuPix11 is a High-Voltage Monolithic Active Pixel Sensor (HV-MAPS) developed for the tracking system of the Mu3e experiment. The in-pixel photon response of a MuPix11 sensor thinned to 70 {\mu}m was measured using an 8 keV X-ray beam with a 3 {\mu}m spot size at the B16 beamline at Diamond Light Source, emulating the passage of a minimum ionising particle (MIP). At nominal operating voltage and threshold, high-resolution scans across the pixel matrix show the detector response to be uniform. In the absence of reverse bias (0 V), the relative sub-pixel response is location-dependent as a reduced detection rate is observed at pixel boundaries.

physics.ins-det

Measurement of the Resolution of the Timepix4 Detector for 100 keV and 200 keV Electrons for Transmission Electron Microscopy

We have evaluated the imaging capabilities of the Timepix4 hybrid silicon pixel detector for 100 keV and 200 keV electrons in a Transmission Electron Microscope (TEM). Using the knife-edge method, we have measured the Modulation Transfer Function (MTF) at both energies. Our results show a decrease in MTF response at Nyquist (spatial) frequency, dropping from approximately 0.16 at 100 keV to 0.0046 at 200 keV. However, by using the temporal structure of the detected events, including the arrival time and amplitude provided by the Timepix4, we enhanced the spatial discrimination of electron arrival. This approach improved the MTF at Nyquist by factors of 2.12 for 100 keV and 3.16 for 200 keV. These findings demonstrate that the blurring effects caused by extended electron trajectories within the sensing layer can be partially corrected in the image data.

physics.ins-det

Technical design of the phase I Mu3e experiment

The Mu3e experiment aims to find or exclude the lepton flavour violating decay $μ\rightarrow eee$ at branching fractions above $10^{-16}$. A first phase of the experiment using an existing beamline at the Paul Scherrer Institute (PSI) is designed to reach a single event sensitivity of $2\cdot 10^{-15}$. We present an overview of all aspects of the technical design and expected performance of the phase~I Mu3e detector. The high rate of up to $10^{8}$ muon decays per second and the low momenta of the decay electrons and positrons pose a unique set of challenges, which we tackle using an ultra thin tracking detector based on high-voltage monolithic active pixel sensors combined with scintillating fibres and tiles for precise timing measurements.

physics.ins-det

Study of prototypes of LFoundry active and monolithic CMOS pixels sensors for the ATLAS detector

High Energy Particle Physics experiments at the LHC use hybrid silicon detectors, in both pixel and strip geometry, for their inner trackers. These detectors have proven to be very reliable and performant. Nevertheless, there is great interest in the development of depleted CMOS silicon detectors, which could achieve similar performances at lower cost of production and complexity. We present recent developments of this technology in the framework of the ATLAS CMOS demonstrator project. In particular, studies of two active sensors from LFoundry, CCPD_LF and LFCPIX, and the first fully monolithic prototype MONOPIX will be shown.

physics.ins-det

Using the Medipix3 detector for direct electron imaging in the range 60keV to 200keV in electron microscopy

Hybrid pixel sensor technology such as the Medipix3 represents a unique tool for electron imaging. We have investigated its performance as a direct imaging detector using a Transmission Electron Microscope (TEM) which incorporated a Medipix3 detector with a 300 micrometre thick silicon layer compromising of 256x256 pixels at 55 micrometre pixel pitch. We present results taken with the Medipix3 in Single Pixel Mode (SPM) with electron beam energies in the range, 60 to 200 keV. Measurements of the Modulation Transfer Function (MTF) and the Detective Quantum Efficiency (DQE) were investigated. At a given beam energy, the MTF data was acquired by deploying the established knife edge technique. Similarly, the experimental data required to DQE was obtained by acquiring a stack of images of a focused beam and of free space (flatfield) to determine the Noise Power Spectrum (NPS).

physics.ins-det

X-ray Metrology of an Array of Active Edge Pixel Sensors for Use at Synchrotron Light Sources

We report on the production of an array of active edge silicon sensors as a prototype of a large array. Four Medipix3RX.1 chips were bump bonded to four single chip sized Advacam active edge n-on-n sensors. These detectors were then mounted into a 2 by 2 array and tested on B16 at Diamond Light Source with an x-ray beam spot of 2um. The results from these tests, compared with optical metrology give confidence that these sensors are sensitive to the physical edge of the sensor, with only a modest loss of efficiency in the final two rows of pixels. We present the efficiency maps recorded with the microfocus beam and a sample powder diffraction measurement. These results give confidence that this sensor technology can be used in much larger arrays of detectors at synchrotron light sources.

physics.ins-det

Medipix3 Demonstration and understanding of near ideal detector performance for 60 & 80 keV electrons

In our article we report first quantitative measurements of imaging performance for the current generation of hybrid pixel detector, Medipix3, as direct electron detector. Utilising beam energies of 60 & 80 keV, measurements of modulation transfer function (MTF) and detective quantum efficiency (DQE) have revealed that, in single pixel mode (SPM), energy threshold values can be chosen to maximize either the MTF or DQE, obtaining values near to, or even exceeding, those for an ideal detector. We have demonstrated that the Medipix3 charge summing mode (CSM) can deliver simultaneous, near ideal values of both MTF and DQE. To understand direct detection performance further we have characterized the detector response to single electron events, building an empirical model which can predict detector MTF and DQE performance based on energy threshold. Exemplifying our findings we demonstrate the Medipix3 imaging performance, recording a fully exposed electron diffraction pattern at 24-bit depth and images in SPM and CSM modes. Taken together our findings highlight that for transmission electron microscopy performed at low energies (energies <100 keV) thick hybrid pixel detectors provide an advantageous and alternative architecture for direct electron imaging

physics.ins-det

Characterisation of Medipix3 Silicon Detectors in a Charged-Particle Beam

While designed primarily for X-ray imaging applications, the Medipix3 ASIC can also be used for charged-particle tracking. In this work, results from a beam test at the CERN SPS with irradiated and non-irradiated sensors are presented and shown to be in agreement with simulation, demonstrating the suitability of the Medipix3 ASIC as a tool for characterising pixel sensors.

physics.ins-det

Performance of the LHCb RICH detector at the LHC

The LHCb experiment has been taking data at the Large Hadron Collider (LHC) at CERN since the end of 2009. One of its key detector components is the Ring-Imaging Cherenkov (RICH) system. This provides charged particle identification over a wide momentum range, from 2-100 GeV/c. The operation and control software, and online monitoring of the RICH system are described. The particle identification performance is presented, as measured using data from the LHC. Excellent separation of hadronic particle types (pion, kaon and proton) is achieved.

physics.ins-det