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Rachel Steiner

Publications and source records attributed to Rachel Steiner.

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Randomized benchmarking of a high-fidelity remote CNOT gate over a meter-scale microwave interconnect

High-fidelity, meter-scale microwave interconnects between superconducting quantum processor modules are a key technology for extending system size beyond constraints imposed by device manufacturing equipment, yield, and signal delivery. Although tomographic experiments have been used in previous demonstrations for benchmarking remote state transfer between modules, they do not reliably separate State Preparation and Measurement (SPAM) error from the error per state transfer. Recent developments based on randomized benchmarking provide a compatible theory for separating these two errors. In this work, we present a module-to-module interconnect based on Tunable-Coupling Qubits (TCQs) and benchmark, in a SPAM-error-tolerant manner enabled by a frame-tracking technique, a remote state transfer fidelity of 0.988 across a 60cm-long coplanar waveguide (CPW). The state transfer is implemented via a superadiabatic transitionless driving method, which suppresses intermediate excitation in the internal modes of the CPW. We further propose and construct a remote CNOT gate between modules, composed of local CZ gates in each module and remote state transfers, and report a gate fidelity of 0.933 using the randomized benchmarking method. The remote CNOT construction and benchmarking we present provide a way to fully characterize the module-to-module link operation and standardize reporting fidelity, analogous to randomized benchmarking protocols for other quantum gates.

quant-ph

Mechanically-intermixed indium superconducting connections for microwave quantum interconnects

Superconducting coaxial cables represent critical communication channels for interconnecting superconducting quantum processors. Here, we report mechanically-intermixed indium joins to aluminum coaxial cables for low loss quantum interconnects. We describe an ABCD matrix formalism to characterize the total resonator internal quality factor ($Q_i$) and any contact ($R_{cont}$) or shunt resistance ($R_{shunt}$) associated with the mechanically-intermixed indium joins. We present four resonator test systems incorporating three indium join methods over the typical frequency range of interest (3-5.5GHz) at temperatures below $20mK$. We measure high internal quality factor aluminum cables ($Q_i = 1.55 \pm 0.37 x 10^6$) through a push-to-connect indium join of the outer conductor that capacitively couples the inner conductor for reflection measurements. We then characterize the total internal quality factors of modes of a cable resonator with a push-to-connect superconducting cable-splice at the midpoint to find mean $Q_i = 1.40 x 10^6$ and $Q_i = 9.39 x 10^5$ for even and odd-modes respectively and use an ABCD matrix model of the system to extract $R_{cont} = 6x10^{-4} \Omega$ for the indium join of the inner conductor. Finally, we demonstrate indium press-mold cable-to-chip connections where the cable-to-chip join is placed at a current node and voltage node through varying on-chip waveguide lengths with mean $Q_i = 1.24 x 10^6$ and $Q_i = 1.07 x 10^6$ respectively to extract $R_{cont} = 8.5x10^{-4} \Omega$ and $R_{shunt} = 1.3x10^7 \Omega$ for the interface. With these techniques, we demonstrate a set of low-loss methods to join superconducting cables for future quantum

quant-ph