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Runzhe Tao

Publications and source records attributed to Runzhe Tao.

4 recordsLinked to original sources

DiagramNet: An End-to-End Recognition Framework and Dataset for Non-Standard System-Level Diagrams

System-level diagrams encode the architectural blueprint of chip design, specifying module functions, dataflows, and interface protocols. However, non-standardized symbols and the scarcity of structured training data hinder existing multimodal large language models (MLLMs) from recognizing these diagrams. To address this gap, we introduce DiagramNet, the first multimodal dataset for system-level diagrams, comprising 10,977 connection annotations and 15,515 chain-of-thought QA pairs across four tasks: Listing, Localization, Connection, and Circuit QA. Building on this dataset, we propose a progressive training pipeline together with a decoupled multi-agent workflow that decomposes complex visual reasoning into Perception, Reasoning, and Knowledge stages. On the DiagramNet benchmark, integrating our 3B-parameter model with the proposed workflow surpasses the 2025 EDA Elite Challenge winner and outperforms GPT-5, Claude-Sonnet-4, and Gemini-2.5-Pro by over 2x in end-to-end evaluation. Notably, the workflow generalizes beyond our model, boosting Task 1 performance by 128.7x for Gemini-2.5-Pro and 12.4x for GPT-5. Furthermore, with only 60 images for detector adaptation, the method transfers effectively to AMSBench, achieving zero-shot connectivity reasoning on par with GPT-5 and Claude-Sonnet-4 while surpassing the AMS state-of-the-art method Netlistify.

cs.AI

LEGO: An LLM Skill-Based Front-End Design Generation Platform

Existing LLM-based EDA agents are often isolated task-specific systems. This leads to repeated engineering effort and limited reuse of successful design and debugging strategies. We present LEGO, a unified skill-based platform for front-end design generation. It decomposes the digital front-end flow into six independent steps and represents every agent capability as a standardized composable circuit skill within a plug-and-play architecture. To build this skill library, we survey more than 100 papers, select 11 representative open-source projects, and extract 42 executable circuit skills within a six-step finite state machine formulation. Circuit Skill Builder automates skill extraction with linear scalability. Agent Skill RAG achieves submillisecond retrieval without relying on embedding models. Empirical evaluation on a hard subset of 41 VerilogEval v2 problems that gpt-5.2-codex fails to solve under extra-high reasoning effort shows that individual circuit skills constructed within LEGO raise Pass@1 from 0.000 to 0.805. This is an 80.5% gain over the baseline. Cross-project skill compositions also reach 0.805 Pass@1. They outperform hierarchy-verilog by 14.6% and VerilogCoder by 2.5%. They also match MAGE. These results show that modular skill composition supports both effective and flexible RTL design automation. The LEGO platform and all circuit skills are publicly available at GitHub: https://github.com/loujc/LEGO-An-LLM-Skill-Based-Front-End-Design-Generation-Platform

cs.AI

LEAPS: Topological-Layout-Adaptable Multi-Die FPGA Placement for Super Long Line Minimization

Multi-die FPGAs are crucial components in modern computing systems, particularly for high-performance applications such as artificial intelligence and data centers. Super long lines (SLLs) provide interconnections between super logic regions (SLRs) for a multi-die FPGA on a silicon interposer. They have significantly higher delay compared to regular interconnects, which need to be minimized. With the increase in design complexity, the growth of SLLs gives rise to challenges in timing and power closure. Existing placement algorithms focus on optimizing the number of SLLs but often face limitations due to specific topologies of SLRs. Furthermore, they fall short of achieving continuous optimization of SLLs throughout the entire placement process. This highlights the necessity for more advanced and adaptable solutions. In this paper, we propose LEAPS, a comprehensive, systematic, and adaptable multi-die FPGA placement algorithm for SLL minimization. Our contributions are threefold: 1) proposing a high-performance global placement algorithm for multi-die FPGAs that optimizes the number of SLLs while addressing other essential design constraints such as wirelength, routability, and clock routing; 2) introducing a versatile method for more complex SLR topologies of multi-die FPGAs, surpassing the limitations of existing approaches; and 3) executing continuous optimization of SLLs across the whole placement stages, including global placement (GP), legalization (LG), and detailed placement (DP). Experimental results demonstrate the effectiveness of LEAPS in reducing SLLs and enhancing circuit performance. Compared with the most recent state-of-the-art (SOTA) method, LEAPS achieves an average reduction of 43.08% in SLLs and 9.99% in HPWL, while exhibiting a notable 34.34$\times$ improvement in runtime.

cs.AR

Imbalanced Large Graph Learning Framework for FPGA Logic Elements Packing Prediction

Packing is a required step in a typical FPGA CAD flow. It has high impacts to the performance of FPGA placement and routing. Early prediction of packing results can guide design optimization and expedite design closure. In this work, we propose an imbalanced large graph learning framework, ImLG, for prediction of whether logic elements will be packed after placement. Specifically, we propose dedicated feature extraction and feature aggregation methods to enhance the node representation learning of circuit graphs. With imbalanced distribution of packed and unpacked logic elements, we further propose techniques such as graph oversampling and mini-batch training for this imbalanced learning task in large circuit graphs. Experimental results demonstrate that our framework can improve the F1 score by 42.82% compared to the most recent Gaussian-based prediction method. Physical design results show that the proposed method can assist the placer in improving routed wirelength by 0.93% and SLICE occupation by 0.89%.

cs.LG