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Ryan O'Hayre

Publications and source records attributed to Ryan O'Hayre.

3 recordsLinked to original sources

High-Temperature Hydrogen Sensors Based on Gallium Oxide Heterojunction Diodes

Long-term, high temperature operation of Ga2O3 devices is a crucial hurdle that must be overcome before widespread adoption of the technology can be achieved, but is largely absent from the overall body of work. Demonstrations up to this point show devices are either limited by material or dopant instability that leads to performance degradation with time. Herein, Ga2O3-based hydrogen sensors employing Pt Schottky and Cr2O3/Ga2O3 p-n diodes (Mg- and N-doped) were fabricated and evaluated for long-term stability at 600C for 800-1,800 hours, with cyclic exposure to N2 and low-concentration H2 (500-1,500 ppm). Transient current density (measured at -0.1 V) and periodic J-V characterization were used to track performance. Despite gradual declines in sensor signal and sensitivity, devices distinguished hydrogen concentrations throughout weeks of operation. Degradation was architecture-dependent: Cr2O3:Mg degraded gradually, consistent with known Mg migration; the Pt Schottky diode showed dramatic changes after 1,000 hours; and Cr2O3:N showed the lowest but most stable performance before failing at 800 hours. Thermionic emission and Lambert W-based modeling confirmed hydrogen exposure reduces interfacial barrier height via a proton-induced dipole mechanism common to both diode types. TEM of aged Pt Schottky diodes revealed Pt grain growth and microvoid formation as key degradation mechanisms. TOF-SIMS confirmed nitrogen dopants remain confined to the Cr2O3:N layer, supporting N-doping as a stable, lower-performance alternative to Mg-doping

cond-mat.mtrl-sci

Reliable operation of Cr$_2$O$_3$:Mg/ $β$-Ga$_2$O$_3$ p-n heterojunction diodes at 600$^\circ$C

$β$-Ga$_2$O$_3$-based semiconductor heterojunctions have recently demonstrated improved performance at high voltages and elevated temperatures and are thus promising for applications in power electronic devices and harsh-environment sensors. However, the long-term reliability of these ultra-wide band gap (UWBG) semiconductor devices remains barely addressed and may be strongly influenced by chemical reactions at the p-n heterojunction interface. Here, we experimentally demonstrate operation and evaluate the reliability of Cr$_2$O$_3$:Mg/ $β$-Ga$_2$O$_3$ p-n heterojunction diodes at during extended operation at 600$^\circ$C, as well as after 30 repeated cycles between 25-550$^\circ$C. The calculated pO2-temperature phase stability diagram of the Ga-Cr-O material system predicts that Ga$_2$O$_3$ and Cr$_2$O$_3$ should remain thermodynamically stable in contact with each other over a wide range of oxygen pressures and operating temperatures. The fabricated Cr$_2$O$_3$:Mg / $β$-Ga$_2$O$_3$ p-n heterojunction diodes show room-temperature on/off ratios >10$^4$ at $\pm$5V and a breakdown voltage (V$_{Br}$) of -390V. The leakage current increases with increasing temperature up to 600$^\circ$C, which is attributed to Poole-Frenkel emission with a trap barrier height of 0.19 eV. Over the course of a 140-hour thermal soak at 600$^\circ$C, both the device turn-on voltage and on-state resistance increase from 1.08V and 5.34 m$Ω$-cm$^2$ to 1.59V and 7.1 m$Ω$-cm$^2$ respectively. This increase is attributed to the accumulation of Mg and MgO at the Cr$_2$O$_3$/Ga$_2$O$_3$ interface as observed from TOF-SIMS analysis. These findings inform future design strategies of UWBG semiconductor devices for harsh environment operation and underscore the need for further reliability assessments for $β$-Ga$_2$O$_3$ based devices.

cond-mat.mtrl-sci

Ultrathin Stable Ohmic Contacts for High-Temperature Operation of $β$-Ga$_2$O$_3$ Devices

Beta gallium oxide ($β$-Ga$_2$O$_3$) shows significant promise in the high-temperature, high-power, and sensing electronics applications. However, long-term stable metallization layers for Ohmic contacts at high temperature present unique thermodynamic challenges. The current most common Ohmic contact design based on 20 nm of Ti has been repeatedly demonstrated to fail at even moderately elevated temperatures (300-400$^{\circ}$C) due to a combination of non-stoichiometric Ti/Ga$_2$O$_3$ interfacial reactions and kinetically favored Ti diffusion processes. Here we demonstrate stable Ohmic contacts for Ga$_2$O$_3$ devices operating up to 500-600$^{\circ}$C using ultrathin Ti layers with a self-limiting interfacial reaction. The ultrathin Ti layer in the 5nm Ti / 100nm Au contact stack is designed to fully oxidize while forming an Ohmic contact, thereby limiting both thermodynamic and kinetic instability. This novel contact design strategy results in an epitaxial conductive anatase titanium oxide interface layer that enables low-resistance Ohmic contacts that are stable both under long-term continuous operation (>500 hours) at 600$^{\circ}$C in vacuum ($\leq$ 10$^{-4}$ Torr), as well as after repeated thermal cycling (15 times) between room temperature and 550$^{\circ}$C in flowing N$_2$. This stable Ohmic contact design will accelerate the development of high-temperature devices by enabling research focus to shift towards rectifying contacts and other interfacial layers.

physics.app-ph