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S. Dilhaire

Publications and source records attributed to S. Dilhaire.

4 recordsLinked to original sources

Influence of generated defects by Ar-implantation on the thermoelectric properties of ScN

Nowadays, making thermoelectric materials more efficient in energy conversion is still a challenge. In this work, to reduce the thermal conductivity and thus improve the overall thermoelectric performances, point and extended defects were generated in epitaxial 111-ScN thin films by implantation using argon ions. The films were investigated by structural, optical, electrical, and thermoelectric characterization methods. The results demonstrated that argon implantation leads to the formation of stable defects (up to 750 K operating temperature) were identified as interstitial type defect clusters and so-called argon-vacancy complexes. The insertion of those specific defects induces acceptor-type deep levels in the bandgap yielding to a reduce of the free carrier mobility. With a reduce electrical conductivity, the irradiated sample exhibited higher Seebeck coefficient maintaining the power factor of the film. The thermal conductivity is strongly reduced from 12 to 3 W.m-1.K-1 at 300 K, showing the effect of defects in increasing phonon scattering. Subsequent high temperature annealing, at 1573 K, leads to the progressive evolution of defects: the initial clusters of interstitial evolved to the benefit of smaller clusters and the formation of bubble. Thus, the number of free carriers, the resistivity and the Seebeck coefficient are almost restored but the mobility of the carriers remains low and a 30% drop in thermal conductivity is still effective (8.5 W.m-1.K-1). This study shows that the control defect engineering with defects introduced by irradiation using noble gases in a thermoelectric coating can be an attractive method to enhance the figure of merit of thermoelectric materials.

cond-mat.mtrl-sci

Anomalous light absorption around subwavelength apertures in metal films

In this work, we study the heat dissipated at metal surfaces by the electromagnetic field scattered by isolated subwavelength apertures in metal screens. In contrast to our common belief that the intensity of waves created by local sources should decrease with the distance from the sources, we reveal that the dissipated heat at the surface remains constant over a broad spatial interval of a few tens of wavelengths. This behavior which occurs for noble metals at near infrared wavelengths is observed with nonintrusive thermoreflectance measurements and is analyzed with an analytical model which underlines the intricate role played by quasi-cylindrical waves in the phenomenon. Additionally, computational results reveal that the absorption plateau is an intrinsic property that occurs for a large variety of topologies, irrespective of aperture shapes.

physics.optics

Joule Expansion Imaging Techniques on Microlectronic Devices

We have studied the electrically induced off-plane surface displacement on two microelectronic devices using Scanning Joule Expansion Microscopy (SJEM). We present the experimental method and surface displacement results. We show that they can be successfully compared with surface displacement images obtained using an optical interferometry method. We also present thermal images using Scanning Thermal Microscopy (SThM) technique to underline that SJEM is more adapted to higher frequency measurements, which should improve the spatial resolution.

physics.gen-ph

Temperature measurement of sub-micrometric ICs by scanning thermal microscopy

Surface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometrSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometric size. A CMOS device was designed with arrays of resistive lines 0.35$μ$m in width. The array periods are 0.8micron and 10micron to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10micron. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.ic size. A CMOS device was designed with arrays of resistive lines 0.35$μ$m in width. The array periods are 0.8micron and 10micron to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10micron. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.

physics.class-ph