arXiv subjects

Satwik Patnaik

Publications and source records attributed to Satwik Patnaik.

31 records · Page 2Linked to original sources

arXiv2020

Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

Layout camouflaging can protect the intellectual property of modern circuits. Most prior art, however, incurs excessive layout overheads and necessitates customization of active-device manufacturing processes, i.e., the front-end-of-line (FEOL). As a result, camouflaging has typically been applied selectively, which can ultimately undermine its resilience. Here, we propose a low-cost and generic scheme---full-chip camouflaging can be finally realized without reservations. Our scheme is based on obfuscating the interconnects, i.e., the back-end-of-line (BEOL), through design-time handling for real and dummy wires and vias. To that end, we implement custom, BEOL-centric obfuscation cells, and develop a CAD flow using industrial tools. Our scheme can be applied to any design and technology node without FEOL-level modifications. Considering its BEOL-centric nature, we advocate applying our scheme in conjunction with split manufacturing, to furthermore protect against untrusted fabs. We evaluate our scheme for various designs at the physical, DRC-clean layout level. Our scheme incurs a significantly lower cost than most of the prior art. Notably, for fully camouflaged layouts, we observe average power, performance, and area overheads of 24.96%, 19.06%, and 32.55%, respectively. We conduct a thorough security study addressing the threats (attacks) related to untrustworthy FEOL fabs (proximity attacks) and malicious end-users (SAT-based attacks). An empirical key finding is that only large-scale camouflaging schemes like ours are practically secure against powerful SAT-based attacks. Another key finding is that our scheme hinders both placement- and routing-centric proximity attacks; correct connections are reduced by 7.47X, and complexity is increased by 24.15X, respectively, for such attacks.

cs.CR↗

arXiv2019

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual property (IP) of ICs, SM can further mitigate the insertion of hardware Trojans (HTs). In this paper, we strive for the "best of both worlds," that is we seek to combine the individual strengths of SM and LC. By jointly extending SM and LC techniques toward 3D integration, an up-and-coming paradigm based on stacking and interconnecting of multiple chips, we establish a modern approach to hardware security. Toward that end, we develop a security-driven CAD and manufacturing flow for 3D ICs in two variations, one for IP protection and one for HT prevention. Essential concepts of that flow are (i) "3D splitting" of the netlist to protect, (ii) obfuscation of the vertical interconnects (i.e., the wiring between stacked chips), and (iii) for HT prevention, a security-driven synthesis stage. We conduct comprehensive experiments on DRC-clean layouts of multi-million-gate DARPA and OpenCores designs (and others). Strengthened by extensive security analysis for both IP protection and HT prevention, we argue that entering the third dimension is eminent for effective and efficient hardware security.

cs.CR↗

arXiv2019

Toward Physically Unclonable Functions from Plasmonics-Enhanced Silicon Disc Resonators

The omnipresent digitalization trend has enabled a number of related malicious activities, ranging from data theft to disruption of businesses, counterfeiting of devices, and identity fraud, among others. Hence, it is essential to implement security schemes and to ensure the reliability and trustworthiness of electronic circuits. Toward this end, the concept of physically unclonable functions (PUFs) has been established at the beginning of the 21st century. However, most PUFs have eventually, at least partially, fallen short of their promises, which are unpredictability, unclonability, uniqueness, reproducibility, and tamper resilience. That is because most PUFs directly utilize the underlying microelectronics, but that intrinsic randomness can be limited and may thus be predicted, especially by machine learning. Optical PUFs, in contrast, are still considered as promising---they can derive strong, hard-to-predict randomness independently from microelectronics, by using some kind of "optical token." Here we propose a novel concept for plasmonics-enhanced optical PUFs, or peo-PUFs in short. For the first time, we leverage two highly nonlinear phenomena in conjunction by construction: (i) light propagation in a silicon disk resonator, and (ii) surface plasmons arising from nanoparticles arranged randomly on top of the resonator. We elaborate on the physical phenomena, provide simulation results, and conduct a security analysis of peo- PUFs for secure key generation and authentication. This study highlights the good potential of peo-PUFs, and our future work is to focus on fabrication and characterization of such PUFs.

physics.app-ph↗

arXiv2019

3D Integration: Another Dimension Toward Hardware Security

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.

cs.CR↗

arXiv2019

An Interposer-Based Root of Trust: Seize the Opportunity for Secure System-Level Integration of Untrusted Chiplets

Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level integration. We showcase our scheme by utilizing industrial ARM components that are interconnected via a security-providing active interposer, and thoroughly evaluate the achievable security via different threat scenarios. Finally, we provide detailed end-to-end physical design results to demonstrate the efficacy of our proposed methodology.

cs.CR↗

arXiv2019

Spin-Orbit Torque Devices for Hardware Security: From Deterministic to Probabilistic Regime

Protecting intellectual property (IP) has become a serious challenge for chip designers. Most countermeasures are tailored for CMOS integration and tend to incur excessive overheads, resulting from additional circuitry or device-level modifications. On the other hand, power density is a critical concern for sub-50 nm nodes, necessitating alternate design concepts. Although initially tailored for error-tolerant applications, imprecise computing has gained traction as a general-purpose design technique. Emerging devices are currently being explored to implement ultra-low-power circuits for inexact computing applications. In this paper, we quantify the security threats of imprecise computing using emerging devices. More specifically, we leverage the innate polymorphism and tunable stochastic behavior of spin-orbit torque (SOT) devices, particularly, the giant spin-Hall effect (GSHE) switch. We enable IP protection (by means of logic locking and camouflaging) simultaneously for deterministic and probabilistic computing, directly at the GSHE device level. We conduct a comprehensive security analysis using state-of-the-art Boolean satisfiability (SAT) attacks; this study demonstrates the superior resilience of our GSHE primitive when tailored for deterministic computing. We also demonstrate how probabilistic computing can thwart most, if not all, existing SAT attacks. Based on this finding, we propose an attack scheme called probabilistic SAT (PSAT) which can bypass the defense offered by logic locking and camouflaging for imprecise computing schemes. Further, we illustrate how careful application of our GSHE primitive can remain secure even on the application of the PSAT attack. Finally, we also discuss side-channel attacks and invasive monitoring, which are arguably even more concerning threats than SAT attacks.

cs.ET↗

arXiv2019

Protect Your Chip Design Intellectual Property: An Overview

The increasing cost of integrated circuit (IC) fabrication has driven most companies to "go fabless" over time. The corresponding outsourcing trend gave rise to various attack vectors, e.g., illegal overproduction of ICs, piracy of the design intellectual property (IP), or insertion of hardware Trojans (HTs). These attacks are possibly conducted by untrusted entities residing all over the supply chain, ranging from untrusted foundries, test facilities, even to end-users. To overcome this multitude of threats, various techniques have been proposed over the past decade. In this paper, we review the landscape of IP protection techniques, which can be classified into logic locking, layout camouflaging, and split manufacturing. We discuss the history of these techniques, followed by state-of-the-art advancements, relevant limitations, and scope for future work.

cs.CR↗

arXiv2018

Best of Both Worlds: Integration of Split Manufacturing and Camouflaging into a Security-Driven CAD Flow for 3D ICs

With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

cs.CR↗

arXiv2018

Raise Your Game for Split Manufacturing: Restoring the True Functionality Through BEOL

Split manufacturing (SM) seeks to protect against piracy of intellectual property (IP) in chip designs. Here we propose a scheme to manipulate both placement and routing in an intertwined manner, thereby increasing the resilience of SM layouts. Key stages of our scheme are to (partially) randomize a design, place and route the erroneous netlist, and restore the original design by re-routing the BEOL. Based on state-of-the-art proximity attacks, we demonstrate that our scheme notably excels over the prior art (i.e., 0% correct connection rates). Our scheme induces controllable PPA overheads and lowers commercial cost (the latter by splitting at higher layers).

cs.CR↗

arXiv2018

Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing

Here we advance the protection of split manufacturing (SM)-based layouts through the judicious and well-controlled handling of interconnects. Initially, we explore the cost-security trade-offs of SM, which are limiting its adoption. Aiming to resolve this issue, we propose effective and efficient strategies to lift nets to the BEOL. Towards this end, we design custom "elevating cells" which we also provide to the community. Further, we define and promote a new metric, Percentage of Netlist Recovery (PNR), which can quantify the resilience against gate-level theft of intellectual property (IP) in a manner more meaningful than established metrics. Our extensive experiments show that we outperform the recent protection schemes regarding security. For example, we reduce the correct connection rate to 0\% for commonly considered benchmarks, which is a first in the literature. Besides, we induce reasonably low and controllable overheads on power, performance, and area (PPA). At the same time, we also help to lower the commercial cost incurred by SM.

cs.CR↗

arXiv2018

Advancing Hardware Security Using Polymorphic and Stochastic Spin-Hall Effect Devices

Protecting intellectual property (IP) in electronic circuits has become a serious challenge in recent years. Logic locking/encryption and layout camouflaging are two prominent techniques for IP protection. Most existing approaches, however, particularly those focused on CMOS integration, incur excessive design overheads resulting from their need for additional circuit structures or device-level modifications. This work leverages the innate polymorphism of an emerging spin-based device, called the giant spin-Hall effect (GSHE) switch, to simultaneously enable locking and camouflaging within a single instance. Using the GSHE switch, we propose a powerful primitive that enables cloaking all the 16 Boolean functions possible for two inputs. We conduct a comprehensive study using state-of-the-art Boolean satisfiability (SAT) attacks to demonstrate the superior resilience of the proposed primitive in comparison to several others in the literature. While we tailor the primitive for deterministic computation, it can readily support stochastic computation; we argue that stochastic behavior can break most, if not all, existing SAT attacks. Finally, we discuss the resilience of the primitive against various side-channel attacks as well as invasive monitoring at runtime, which are arguably even more concerning threats than SAT attacks.

cs.CR↗

arXiv2017

Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

Layout camouflaging (LC) is a promising technique to protect chip design intellectual property (IP) from reverse engineers. Most prior art, however, cannot leverage the full potential of LC due to excessive overheads and/or their limited scope on an FEOL-centric and accordingly customized manufacturing process. If at all, most existing techniques can be reasonably applied only to selected parts of a chip---we argue that such "small-scale or custom camouflaging" will eventually be circumvented, irrespective of the underlying technique. In this work, we propose a novel LC scheme which is low-cost and generic---full-chip LC can finally be realized without any reservation. Our scheme is based on obfuscating the interconnects (BEOL); it can be readily applied to any design without modifications in the device layer (FEOL). Applied with split manufacturing in conjunction, our approach is the first in the literature to cope with both the FEOL fab and the end-user being untrustworthy. We implement and evaluate our primitives at the (DRC-clean) layout level; our scheme incurs significantly lower cost than most of the previous works. When comparing fully camouflaged to original layouts (i.e., for 100% LC), we observe on average power, performance, and area overheads of 12%, 30%, and 48%, respectively. Here we also show empirically that most existing LC techniques (as well as ours) can only provide proper resilience against powerful SAT attacks once at least 50% of the layout is camouflaged---only large-scale LC is practically secure. As indicated, our approach can deliver even 100% LC at acceptable cost. Finally, we also make our flow publicly available, enabling the community to protect their sensitive designs.

cs.CR↗

arXiv2017

Rethinking Split Manufacturing: An Information-Theoretic Approach with Secure Layout Techniques

Split manufacturing is a promising technique to defend against fab-based malicious activities such as IP piracy, overbuilding, and insertion of hardware Trojans. However, a network flow-based proximity attack, proposed by Wang et al. (DAC'16) [1], has demonstrated that most prior art on split manufacturing is highly vulnerable. Here in this work, we present two practical layout techniques towards secure split manufacturing: (i) gate-level graph coloring and (ii) clustering of same-type gates. Our approach shows promising results against the advanced proximity attack, lowering its success rate by 5.27x, 3.19x, and 1.73x on average compared to the unprotected layouts when splitting at metal layers M1, M2, and M3, respectively. Also, it largely outperforms previous defense efforts; we observe on average 8x higher resilience when compared to representative prior art. At the same time, extensive simulations on ISCAS'85 and MCNC benchmarks reveal that our techniques incur an acceptable layout overhead. Apart from this empirical study, we provide---for the first time---a theoretical framework for quantifying the layout-level resilience against any proximity-induced information leakage. Towards this end, we leverage the notion of mutual information and provide extensive results to validate our model.

cs.CR↗