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Seongho Park

Publications and source records attributed to Seongho Park.

5 recordsLinked to original sources

On the Reliability of Cue Conflict and Beyond

Understanding how neural networks rely on visual cues offers a human-interpretable view of their internal decision processes. The cue-conflict benchmark has been influential in probing shape-texture preference and in motivating the insight that stronger, human-like shape bias is often associated with improved in-domain performance. However, we find that the current stylization-based instantiation can yield unstable and ambiguous bias estimates. Specifically, stylization may not reliably instantiate perceptually valid and separable cues nor control their relative informativeness, ratio-based bias can obscure absolute cue sensitivity, and restricting evaluation to preselected classes can distort model predictions by ignoring the full decision space. Together, these factors can confound preference with cue validity, cue balance, and recognizability artifacts. We introduce REFINED-BIAS, an integrated dataset and evaluation framework for reliable and interpretable shape-texture bias diagnosis. REFINED-BIAS constructs balanced, human- and model- recognizable cue pairs using explicit definitions of shape and texture, and measures cue-specific sensitivity over the full label space via a ranking-based metric, enabling fairer cross-model comparisons. Across diverse training regimes and architectures, REFINED-BIAS enables fairer cross-model comparison, more faithful diagnosis of shape and texture biases, and clearer empirical conclusions, resolving inconsistencies that prior cue-conflict evaluations could not reliably disambiguate.

cs.CV

Selecting Alternative Metals for Advanced Interconnects

Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. With the slowdown of transistor scaling, interconnect scaling has become the primary driver of continued circuit miniaturization. The associated scaling challenges for interconnects are expected to further intensify in future CMOS technology nodes. As interconnect dimensions approach the 10 nm scale, the limitations of conventional Cu dual-damascene metallization are becoming increasingly difficult to overcome, spurring over a decade of focused research into alternative metallization schemes. The selection of alternative metals is a highly complex process, requiring consideration of multiple criteria, including resistivity at reduced dimensions, reliability, thermal performance, process technology readiness, and sustainability. This tutorial introduces the fundamental criteria for benchmarking and selecting alternative metals and reviews the current state of the art in this field. It covers materials nearing adoption in high-volume manufacturing, materials currently under active research, and potential future directions for fundamental study. While early alternatives to Cu metallization have recently been introduced in commercial CMOS devices, the search for the optimal interconnect metal remains ongoing.

physics.app-ph

Dimorphic properties of Bernoulli random variable

The aim of this paper is to study a dimorphic property associated with two different sums of identically independent Bernoulli random variables having two different families of probability mass functions. In addition, we give two expressions on sums of products of degenerate Stirling numbers of the second kind and Stirling numbers of the first kind connected with those two different sums of identically independent Bernoulli random variables.

math.NT

Some new properties on degenerate Bell polynomials

The aim of this paper is to study the degenerate Bell numbers and polynomials which are degenerate version of the Bell numbers and polynomials. we derive some new identities and properties of those numbers and polynomials that are associated with the degenerate Stirling numbers of the both kinds.

math.NT

Multi-Lah numbers and multi-Stirling numbers of the first kind

In this paper, we introduce multi-Lah numbers and multi-Stirling numbers of the first kind and recall multi-Bernoulli numbers, all of whose generating functions are given with the help of multiple logarithm. The aim of this paper is to study several relations among those three numbers. In more detail, we represent the multi-Bernoulli numbers in terms of the multi-Stirling numbers of the first kind and vice versa, and the multi-Lah numbers in terms of multi-Stirling numbers. In addition, we deduce a recurrence relation for multi-Lah numbers

math.NT