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Shajib Ghosh

Publications and source records attributed to Shajib Ghosh.

3 recordsLinked to original sources

AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits

Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management challenges due to high-density bonding and heterogeneous materials. Traditional methods like thermal microscopes and in-package sensors yield sparse data, limiting full thermal profile visibility. This paper presents a dual-method solution combining an AI-driven thermal modeling framework with a design-based heuristic approach. The AI method integrates sparse sensor data with design layer and density information to predict multilayer temperature variations, while the heuristic approach uses localized material properties, design layout, component geometries, and sensor coordinates to refine thermal estimations in specific regions. A 2D thermal map of a 3D PIC is generated by interpolating sensor data and adjusting for local thermal resistivity using comparative analysis between design regions. The heuristic method complements the AI model, improving estimation accuracy without extensive training data. Together, these methods offer a scalable, accurate solution for real-time thermal mapping and design-time simulation, enabling reliable thermal management in next-generation 3D photonic systems.

cs.AR

FPIC: A Novel Semantic Dataset for Optical PCB Assurance

Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.

cs.CV

PCB Component Detection using Computer Vision for Hardware Assurance

Printed Circuit Board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods, however they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduce the number of trainable ML parameters and thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection using semantic data. Results of this study indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

cs.CV