Shuwen Xie | Searcharxiv

arXiv2025

Single-crystalline high-quality beta-Ga2O3 pseudo-substrate on sapphire through sputtering for epitaxial deposition

Solid-phase epitaxy (SPE) of beta-Ga2O3 thin films by radio-frequency (RF) sputtering and then crystallized through high-temperature post-deposition annealing is employed on sapphire substrates, yielding a high-quality pseudo-substrate for subsequent buffer growth via MOCVD and LPCVD. Low roughness (<0.5 nm) and sharp single-crystalline diffraction peaks corresponding to the (-201), (-402), and (-603) reflections of beta-Ga2O3 were observed in the SPE beta-Ga2O3 film and the subsequent epitaxial buffer layer. N-doped Ga2O3 film on SPE Ga2O3 film grown by LPCVD showed step-assisted growth mode with reasonable electronic behavior with 45 cm^2/V-s mobility at a bulk carrier concentration of 1.3e17 cm^-3. These results suggest that SPE Ga2O3 is a promising pathway to advance the development of beta-Ga2O3 on foreign substrates.

cond-mat.mtrl-sci↗

arXiv2024

Demonstration of Si-doped Al-rich thin regrown Al(Ga)N films on AlN on sapphire templates with $\gt10^{15}/cm^3$ free carrier concentration using close-coupled showerhead MOCVD reactor

Thin Si-doped Al-rich (Al>0.85) regrown Al(Ga)N layers were deposited on AlN on Sapphire template using metal-organic chemical vapor deposition (MOCVD) techniques. The optimization of the deposition conditions such as temperature, V/III ratio, deposition rate, and Si concentration resulted in a high charge carrier concentration (>$10^{15}/cm^{3}$) in the Si-doped Al-rich Al(Ga)N films. A pulsed deposition condition was employed to achieve a controllable Al composition greater than 95% and to prevent unintended Ga incorporation in the AlGaN material deposited using the close-coupled showerhead reactor. Also, the effect of unintentional Si incorporation on free charge carrier concentration at the regrowth interface was observed by varying the thickness of the regrown Al(Ga)N layer. A maximum charge carrier concentration of $4.8\times 10^{16}/cm^3$ and $7.5\times 10^{15}/cm^3$ were achieved for Al0.97Ga0.03N and AlN films with thickness <300 nm compared to previously reported n-Al(Ga)N films with thickness $\ge$400 nm deposited using MOCVD technique.

physics.app-ph↗