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Soheil Gholami Shahrouz

Publications and source records attributed to Soheil Gholami Shahrouz.

2 recordsLinked to original sources

The Road Less Traveled: Congestion-Aware NoC Placement and Packet Routing for FPGAs

To help scale to ever-larger and more complex designs, recent FPGA architectures now integrate network-on-chips (NoCs). NoCs help transfer high-bandwidth data over long distances within the chip without using scarce low-delay long routing wire segments. While NoC-enhanced FPGAs aid system integration and design reuse, they also complicate FPGA computer-aided design (CAD) flows by introducing new constraints and metrics. Placement and routing need to optimize NoC metrics like latency and bandwidth utilization and avoid link oversubscription (congestion), while simultaneously optimizing the programmable routing resource usage of the design modules attached to NoC routers. In this work, we develop several new approaches to reduce NoC congestion while minimizing the impact on other design metrics. First, we incorporate a NoC link congestion cost into the placement engine of the open-source CAD flow, versatile place & route (VPR). Second, we integrate turn model NoC routing algorithms into the placement engine to leverage path diversity to further reduce congestion. On average over a suite of 29 benchmarks, combining placement congestion modeling with turn model packet routing reduces NoC congestion by 90.7% at the cost of increasing aggregate bandwidth demand by 4%. In cases where the enhanced placement engine and NoC routing fail to fully resolve congestion, we formulate NoC routing as a Boolean satisfiability (SAT) problem. This approach yields significant additional improvements; the combined algorithm reduces congestion by 95.1% compared to the baseline placement. Finally, we enhance the reinforcement learning (RL) agent in VPR's placement engine by introducing a NoC-aware move type, resulting in an 8.8% reduction in wirelength on designs that make extensive use of the NoC.

cs.AR↗

Modeling, Optimizing and Exploring Multi-Die FPGA Routing Architectures

Die stacking has enabled 2.5D FPGAs by integrating multiple active dice on a passive silicon interposer for improved yield and capacity, and paved the way for 3D architectures that stack active dice directly atop one another. In these multi-die devices, the unique electrical and physical characteristics of the underlying die-stacking technology impose limitations on inter-die connection density and latency, necessitating a bespoke inter-die routing architecture. However, the absence of accurate and versatile modeling tools has left most questions about how to best design the inter-die routing architecture unanswered. To address this gap, we enhance the open-source FPGA CAD tool VTR to flexibly model a wide range of multi-die routing architectures, and augment VPR's placement and routing engines to improve optimization for both 2.5D and 3D FPGAs. We perform HSPICE-based circuit modeling of inter-die connections for active dice using a 7 nm process node and a 45 nm silicon interposer across several die-crossing technologies. Using this enhanced framework, we conduct a detailed design space exploration of inter-die routing architecture in 2.5D and 3D FPGAs, characterizing the impact of die-crossing technology, inter-die connection count, fan-in/fan-out, and interposer wire length on critical path delay (CPD), wirelength, area, and routability. Our results show that with suitable inter-die routing architectures, 2.5D and 3D FPGAs can increase capacity without significant routability or delay penalties. Specifically, 3D FPGAs achieve up to 14% wirelength reduction and 6% CPD improvement over 2D devices, and remain routable even with existing $10\,μ$m pitch technologies, while 2.5D FPGAs incur only a 2% wirelength and 4% CPD overhead at 32% inter-die connectivity. All extensions are open source and integrated with the VTR master branch.

cs.AR↗