arXiv subjects

Steven Akwabli

Publications and source records attributed to Steven Akwabli.

4 recordsLinked to original sources

arXiv2026

Germanium-tin (GeSn) avalanche photodiode with up to 2.7 micro cutoff wavelength for extended SWIR detection

Separate absorption charge multiplication germanium tin on silicon avalanche photodiode offers a viable solution to achieve CMOS compatible, high sensitivity detection technology in SWIR or extended SWIR range, leveraging the excellent k-factor of Si as multiplication layer and SWIR or e-SWIR band absorption of GeSn. However, unlike well-established growth of GeSn on Si with thick Ge buffer in-between to reduce threading dislocation density due to lattice mismatch, GeSn on Si APD design requires relatively thin Ge buffer to limit electric field drop through the background p-doped buffer and efficiently transporting photocarrier from GeSn absorber to Si multiplication layer, therefore making growth of high Sn content APD for e-SWIR coverage very challenging. In this work, we experimentally demonstrate GeSn on Si APD up to 12.7 percent Sn, monolithically grown on Si substrate with 122-nm-thick Ge buffer in between, which is considerably thinner than widely used 700-900 nm thick Ge buffer. Stronger relaxation of GeSn absorber via thin Ge buffer favors Sn incorporation, leading to higher Sn content than the nominal target of 8 percent Sn. Device detection range is significantly improved compared to previous work - with cutoff wavelength increased up to 2.7 micro at 300 K, in parallel with high avalanche gain at 77 K up to 21 at 1.55 micro and up to 52 at 2 micro, and good responsivity in SWIR or e-SWIR range, up to 1.45 AW-1 at 1.55 micro and 0.66 AW-1 at 2 micro.

physics.app-ph↗

arXiv2026

Systematic study of high performance GeSn photodiodes with thick absorber for SWIR and extended SWIR detection

Germanium-tin (GeSn) photodiodes potentiate a viable solution to integrate SWIR and extended SWIR detection technology into CMOS processing line. However, challenges in the growth of thick, high quality GeSn limit the device absorber thickness, making it impossible to ascertain the performance limit of GeSn photodiodes. An in-depth understanding of their device physics and a clear optimization pathway towards commercial-grade devices remain elusive. This work presents a systematic empirical study of GeSn photodiodes with thick absorber (2 to 8% Sn content, up to 2630 nm thick), showing high responsivity up to 0.59 A.W-1 at 1.55 {\mu}m and 0.43 A.W-1 at 2 {\mu}m wavelengths, low dark current density down to 2 x 10-2 A.cm-2, and high detection cutoff wavelengths up to 2.1 and 2.5 {\mu}m at 5% and 8% Sn, respectively. Using specific doping design (P-i-N and N-i-P), an in-depth analysis is presented on the impact of junction position, p-type background carrier concentration, bulk/ surface defects and photocarrier diffusion length - on photodetection performance. Different optimization strategies for GeSn photodiodes, in particular at high Sn content, are proposed.

physics.ins-det↗

arXiv2025

Ge0.95Sn0.05 on Si avalanche photodiode with Spectral Response Cutoff at 2.14 micrometer

GeSn-based avalanche photodiode (APD) operating in shortwave infrared (SWIR) wavelength was demonstrated in this work. A separate absorption and charge multiplication (SACM) structure was employed to take advantage of long wavelength absorption in GeSn and low impact ionization ratio of Si. Due to lattice mismatch between Si and GeSn that would degrade GeSn material quality if with direct growth, a 240-nm-thick Ge buffer was utilized which simultaneously allows for the transporting photo generated electrons from GeSn absorber to Si multiplication layer. Spectral response showed the cut off wavelength beyond 2.1 {\mu}m at room temperature. Dart current and capacitance-voltage measurements indicated a punch-through voltage of -10 V. The measured responsivities were 0.55 A/W and 0.34 A/W under 1.55 {\mu}m and 1.9 {\mu}m excitation lasers, respectively. The maximum gain was obtained as 3.44 at 77 K under 1.9 {\mu}m laser. Even at 250 K, the calculated gain was greater than unity. Simulation of electric field distribution revealed that the GeSn is partially depleted at operating voltages, which can be improved by reducing the background doping levels in GeSn absorber and Ge buffer layer.

physics.app-ph↗

arXiv2024

Monolithic Germanium Tin on Si Avalanche Photodiodes

We demonstrate monolithically grown germanium-tin (GeSn) on silicon avalanche photodiodes (APDs) for infrared light detection. A relatively thinner Ge buffer design was adopted to allow effective photo carriers to transport from the GeSn absorber to the Si multiplication layer such that clear punch-through behavior and a saturated primary responsivity of 0.3 A/W at 1550 nm were observed before avalanche breakdown in GeSn/Si APDs for the first time. The spectral response covers 1500 to 1700 nm. The measured punch-through and breakdown voltages are 15 and 17 V, respectively. Undisputed multiplication gain was obtained with the maximum value of 4.5 at 77 K, and 1.4 at 250 K, directly in reference to the saturated primary responsivity from the same device rather than a different GeSn p-i-n photodiode in previous reports. A peak responsivity was measured as 1.12 A/W at 1550 nm and 77 K.

cond-mat.mtrl-sci↗