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Sung-Kyu Lim

Publications and source records attributed to Sung-Kyu Lim.

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Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators

The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase performance because it introduces another level of spatial parallelism. Therefore, we analyze dataflows, performance, area, power and temperature of such 3D-DNN-accelerators. Monolithic and TSV-based stacked 3D-ICs are compared against 2D-ICs. We identify workload properties and architectural parameters for efficient 3D-ICs and achieve up to 9.14x speedup of 3D vs. 2D. We discuss area-performance trade-offs. We demonstrate applicability as the 3D-IC draws similar power as 2D-ICs and is not thermal limited.

cs.AR

LCP: A Low-Communication Parallelization Method for Fast Neural Network Inference in Image Recognition

Deep neural networks (DNNs) have inspired new studies in myriad edge applications with robots, autonomous agents, and Internet-of-things (IoT) devices. However, performing inference of DNNs in the edge is still a severe challenge, mainly because of the contradiction between the intensive resource requirements of DNNs and the tight resource availability in several edge domains. Further, as communication is costly, taking advantage of other available edge devices by using data- or model-parallelism methods is not an effective solution. To benefit from available compute resources with low communication overhead, we propose the first DNN parallelization method for reducing the communication overhead in a distributed system. We propose a low-communication parallelization (LCP) method in which models consist of several almost-independent and narrow branches. LCP offers close-to-minimum communication overhead with better distribution and parallelization opportunities while significantly reducing memory footprint and computation compared to data- and model-parallelism methods. We deploy LCP models on three distributed systems: AWS instances, Raspberry Pis, and PYNQ boards. We also evaluate the performance of LCP models on a customized hardware (tailored for low latency) implemented on a small edge FPGA and as a 16mW 0.107mm2 ASIC @7nm chip. LCP models achieve a maximum and average speedups of 56x and 7x, compared to the originals, which could be improved by up to an average speedup of 33x by incorporating common optimizations such as pruning and quantization.

eess.SP

Breaking Barriers: Maximizing Array Utilization for Compute In-Memory Fabrics

Compute in-memory (CIM) is a promising technique that minimizes data transport, the primary performance bottleneck and energy cost of most data intensive applications. This has found wide-spread adoption in accelerating neural networks for machine learning applications. Utilizing a crossbar architecture with emerging non-volatile memories (eNVM) such as dense resistive random access memory (RRAM) or phase change random access memory (PCRAM), various forms of neural networks can be implemented to greatly reduce power and increase on chip memory capacity. However, compute in-memory faces its own limitations at both the circuit and the device levels. Although compute in-memory using the crossbar architecture can greatly reduce data transport, the rigid nature of these large fixed weight matrices forfeits the flexibility of traditional CMOS and SRAM based designs. In this work, we explore the different synchronization barriers that occur from the CIM constraints. Furthermore, we propose a new allocation algorithm and data flow based on input data distributions to maximize utilization and performance for compute-in memory based designs. We demonstrate a 7.47$\times$ performance improvement over a naive allocation method for CIM accelerators on ResNet18.

cs.AR