arXiv subjects

Theodorian Borca-Tasciuc

Publications and source records attributed to Theodorian Borca-Tasciuc.

3 recordsLinked to original sources

arXiv2026

Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack

Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line (BEOL) structures in hot-spot prediction. Multiscale homogenization strategies have been demonstrated to be effective for steady-state simulations, however accurate 3D transient simulations that include BEOL structures remain an open challenge. In this work, we demonstrate a transient thermal workflow that accounts for the 3D heterogeneous structures in the BEOL for problems with strong- and weak- temporal scale separation under the assumption of temperature independent constitutive properties. Our workflow, based on Bloomfield et. al. 2025, automatically extracts, meshes, and homogenizes thermal properties from GDSII and OASIS files to construct thermal property maps. Property maps (heat capacity and conductivity) have been generated for a 1 mm by 1 mm SoC-style model die that was constructed with LibreLane for 100 by 100 grids with 5 micron by 5 micron representative volume elements (RVEs), and 50 by 50 grids with 10 micron by 10 micron RVEs. The expressions for a transient effective conductivity are provided and a demonstration of the impact of the transient effects are provided for a single RVE. Finally, transient conductivity maps have been provided for a time integration timestep of dt=0.001.

cs.CE↗

arXiv2026

A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks

Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties and geometric feature sizes that span many orders of magnitude. The smallest heterostructures in the front and back ends of the line present significant thermal modeling and analysis challenges in isolation. Replicated millions or billions of times in a chiplet stack, these structures present a near insurmountable hurdle to meeting the speed and accuracy needed of analysis in the design process. Additionally, establishing precise parameter values for the materials in these systems, when size and temperature dependencies create significant deviations from bulk properties, further complicates the problem. To address these issues, we have developed a multiscale methodology that advances the current state of the field by enabling die-scale simulations that capture phenomena arising from the structural details of the BEOL metallization stack. Taking advantage of the large length-scale separation between the BEOL features and the die-level structures, we employ a hierarchical, multiscale, finite-element approach. This hierarchical method uses a standard finite element method (FEM) formulation on a die or package scale, using computational homogenization to obtain effective thermal conductivities in the BEOL. Referring to industry-standard layout and design files, we construct and solve a locally appropriate subscale FEM problem in a representative volume element (RVE) at every quadrature point in the macroscale FEM problem. To accomplish this, RVE models are automatically constructed, meshed, and used to compute homogenized, anisotropic, thermal conductivities from the relevant GDSII or OASIS.

cs.OH↗

arXiv2024

Development and Assessment of a Miniaturized Thermocouple for Precise Temperature Measurement in Biological Tissues and Cells

This study presents a novel thermocouple instrument designed for precise temperature monitoring within biological tissues and cells, addressing a significant gap in biological research. Constructed on a Silicon-On-Insulator (SOI) substrate, the instrument employs doped silicon and chromium/gold junctions, achieving a Seebeck coefficient of up to 447 uV/K, rapid response times, high temperature accuracy, and the necessary durability for tissue measurements. The cleanroom fabrication process yields a device featuring a triangular sensing tip. Using Finite Element Analysis (FEA) with COMSOL Multiphysics, the research delves into the device's thermal time constant within tissue environments. The device's efficacy in biological settings was validated by measuring temperatures inside ex-vivo tissue samples. Our findings, bolstered by FEA COMSOL simulations, confirm the device's robustness and applicability in biological studies. This advancement in thermocouple microneedle technology provides biologists with an instrument for accurately tracking temperature fluctuations in tissues.

physics.app-ph↗