Tianhai Luo | Searcharxiv

arXiv2025

Epitaxial Recovery of beta-Ga2O3 after High Dose Implantation

As an ultrawide bandgap semiconductor, beta-Ga2O3 has been attractive for its strong tolerance to irradiation damage and high n-type conductivity through ion implantation. Homoepitaxial (010) \b{eta}-Ga2O3 films grown by MOCVD were implanted with Ge to study the post-implantation damage and lattice recovery after thermal annealing. Box profiles of 100 or 50 nm at concentration of 5*10^19 or 3*10^19 cm^-3 were formed, with maximum displacement per atom (DPA) of 1.2 or 2.0. Lattice recovery was investigated using X-ray diffraction (XRD) for anneals from 100 C to 1050 C. A gamma-phase related peak was observed for all implant conditions. All samples showed strain relaxation of beta-phase peak at temperature below 500 C, with no significant change for the gamma-phase related peak. For lower damage implants, films recovered fully to epitaxial beta-phase after sequential annealing to 900 C. For the higher damage implant, the gamma-phase associated peak annealed out with increasing temperature, but a new diffraction peak formed at slightly smaller lattice spacing; full recovery of the lattice was not observed until annealing at 1050 C. The newly formed diffraction peak is identified as beta-(20-4), beta-(512), or beta-(71-2), each potentially arising from the conversion of gamma-phase to beta-phase via a common oxygen sub-lattice.

cond-mat.mtrl-sci↗

arXiv2025

Limitations on Activation of High Dose Ge implant in beta-Ga2O3

Among ultrawide bandgap semiconductors, beta-Ga2O3 is particularly promising for high power and frequency applications. For devices, n-type concentrations above 10^19 cm^-3 are required. Ge is a promising alternative n-type dopant with an ionic radius similar to Ga. Homoepitaxial 010 beta-Ga2O3 films were implanted with Ge to form 50 and 100 nm box concentration of 3*10^19 cm^-3 and 5*10^19 cm^-3, with damage ranging from 1.2 to 2.0 displacement per atom. For lower damage implants, optimized anneals in ultrahigh purity N2 at 950-1000 C for 5-10 minutes resulted in Rs of 600-700 omega/sqr, mobilities of 60-70 cm^2/Vs, and Ge activation of up to 40%. For higher damage implants, activation dropped to 23% with similar mobilities. Ge diffusion, measured by second ion mass spectrometry, showed formation of a Ge "clustering peak" with a concentration exceeding the initial implant following anneals in N2 or O2 at 950-1000 C. Beyond this peak, minimal Ge diffusion occurred for N2 anneals at 950 C, but at 1050 C non-Fickian diffusion extended to >200 nm. Electrical activation data suggests that clustered Ge is electrically inactive. To understand Ge clustering, several samples were characterized by synchrotron x-ray diffraction. Second-phase precipitates were observed in as-implanted samples which then fully dissoved after furnace annealing in N2 at 1050 C. Diffraction peaks suggest these implant-induced precipitates may be related to a high pressure Pa-3 phase of GeO2, and may evolve during anneals to explain the Ge clustering. Ultimately, we believe Ge clustering limits activation of implanted Ge at high concentrations.

cond-mat.mtrl-sci↗