arXiv subjects

Timothy J. Rupert

Publications and source records attributed to Timothy J. Rupert.

At least 55 records · Page 3Linked to original sources

arXiv2020

Alloying induces directionally-dependent mobility and alters migration mechanisms of faceted grain boundaries

Faceted grain boundaries exhibit unusual segregation and migration tendencies. To gain a deeper understanding of how solute atoms interact with faceted interfacial structures during migration, this study probes the migration behavior of a faceted $Σ$11 boundary in Cu doped with Ag atoms. The solutes are found to segregate to the facet with more free volume and strongly reduce boundary velocity in one migration direction, but not the other, due to the presence of a directionally-dependent motion mechanism that can escape solute pinning and therefore speed up migration. Hence, a new mechanism of chemically-induced anisotropy in grain boundary mobility is uncovered by these simulations.

cond-mat.mtrl-sci↗

arXiv2020

Embracing the chaos: Alloying adds stochasticity to twin embryo growth

High-throughput atomistic simulations reveal the unique effect of solute atoms on twin variant selection in Mg-Al alloys. Twin embryos first undergo a stochastic incubation stage when embryos choose which twin variant to adopt, and then a deterministic growth stage when embryos expand without changing the selected twin variant. An increase in Al composition promotes the stochastic incubation behavior on the atomic level due to nucleation and pinning of interfacial disconnections. At compositions above a critical value, disconnection pinning results in multiple twin variant selection.

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arXiv2020

Shuffling mode competition leads to directionally-anisotropic mobility of faceted Σ11 boundaries in face centered cubic metals

Faceted grain boundaries can migrate in interesting and unexpected ways. For example, faceted Σ11 <110> tilt grain boundaries were observed to exhibit mobility values that could be strongly dependent on the direction of migration. In order to understand whether this directionally-anisotropic mobility is a general phenomenon and to isolate mechanistic explanations for this behavior, molecular dynamics simulations of bicrystals evolved under an artificial driving force are used to study interface migration for a range of boundary plane inclination angles and temperatures in multiple face centered cubic metals (Al, Ni, and Cu). We find that directionally-anisotropic mobility is active in a large fraction of these boundaries in Ni and Cu and should therefore impact the coarsening of polycrystalline materials. On the other hand, no such anisotropy is observed in any of the Al boundaries, showing that this behavior is material-dependent. Migration of the faceted boundaries is accomplished through transformation events at facet nodes and incommensurate boundary plane facets, which are termed shuffling modes. Three major shuffling modes have been identified, namely Shockley shuffling, slip plane shuffling, and disordered shuffling. A shift from the first two ordered modes to the third disordered mode is found to be responsible for reducing or removing directionally-anisotropic mobility, especially at the highest temperatures studied.

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arXiv2020

Emergence of directionally-anisotropic mobility in a faceted $Σ$11 <110> tilt grain boundary in Cu

Faceted grain boundaries, where grain boundary area is increased in the name of producing low-energy segments, can exhibit new and unexpected migration trends. For example, several faceted $Σ$3 boundaries have demonstrated anti-thermal and thermally damped mobility. $Σ$11 <110> tilt boundaries represent another promising but relatively unexplored set of interfaces, with a (113) low-energy plane that can lead to faceting. In this study, molecular dynamics simulations are used to study grain boundary migration of an asymmetric $Σ$11 <110> grain boundary in two face centered cubic metals. Mobility of this boundary in Cu is strongly dependent on the direction of the applied driving force. The mobility anisotropy generally becomes smaller, but does not disappear completely, as temperature is increased. In contrast, the same boundary in Al demonstrates similar mobilities in either direction, illustrating that the anisotropic mobility phenomenon is material-dependent. Finally, relationships between stacking fault energy, facet junction defect content, and boundary crystallography are uncovered that may inform future studies of faceted grain boundaries.

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arXiv2020

Disconnection-mediated twin embryo growth in Mg

While deformation twinning in hexagonal close-packed metals has been widely studied due to its substantial impact on mechanical properties, an understanding of the detailed atomic processes associated with twin embryo growth is still lacking. Conducting molecular dynamics simulations on Mg, we show that the propagation of twinning disconnections emitted by basal-prismatic interfaces controls the twin boundary motion and is the rate-limiting mechanism during the initial growth of the twin embryo. The time needed for disconnection propagation is related to the distance between the twin tips, with widely spaced twin tips requiring more time for a unit twin boundary migration event to be completed. Thus, a phenomenological model, which unifies the two processes of disconnection and twin tip propagation, is proposed here to provide a quantitative analysis of twin embryo growth. The model fits the simulation data well, with two key parameters (twin tip velocity and twinning disconnection velocity) being extracted. In addition, a linear relationship between the ratio of twinning disconnection velocity to twin tip velocity and the applied shear stress is observed. Using an example of twin growth in a nanoscale single crystal from the recent literature, we find that our molecular dynamics simulations and analytical model are in good agreement with experimental data.

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arXiv2020

Solid-state dewetting instability in thermally-stable nanocrystalline binary alloys

Practical applications of nanocrystalline metallic thin films are often limited by instabilities. In addition to grain growth, the thin film itself can become unstable and collapse into islands through solid-state dewetting. Selective alloying can improve nanocrystalline stability, but the impact of this approach on dewetting is not clear. In this study, two alloys that exhibit nanocrystalline thermal stability as ball milled powders are evaluated as thin films. While both alloys demonstrated dewetting behavior following annealing, the severity decreased in more dilute compositions. Ultimately, a balance may be struck between nanocrystalline stability and thin film structural stability by tuning dopant concentration.

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arXiv2020

Nanocrystalline grain boundary engineering: Increasing $Σ$3 boundary fraction in pure Ni with thermomechanical treatments

Grain boundary networks should play a dominant role in determining the mechanical properties of nanocrystalline metals. However, these networks are difficult to characterize and their response to deformation is incompletely understood. In this work, we study the grain boundary network of nanocrystalline Ni and explore whether it can be modified by plastic deformation. Mechanical cycling at room temperature did not lead to structural evolution, but elevated temperature cycling did alter the grain boundary network. In addition to mechanically-driven grain growth, mechanical cycling at 100 $°$C led to a 48% increase in $Σ$3 boundaries, determined with transmission Kikuchi diffraction. The extent of boundary modification was a function of the number of applied loading cycles and the testing temperature, with more cycles at higher temperatures leading to more special grain boundaries. The results presented here suggest a path to grain boundary engineering in nanocrystalline materials.

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arXiv2020

Uncovering the influence of common nonmetal impurities on the stability and strength of a $Σ$5 (310) grain boundary in Cu

Impurities are often driven to segregate to grain boundaries, which can significantly alter a material's thermal stability and mechanical behavior. To provide a comprehensive picture of this issue, the influence of a wide variety of common nonmetal impurities (H, B, C, N, O, Si, P and S) incorporated during service or materials processing are studied using first-principles simulations, with a focus on identifying changes to the energetics and mechanical strength of a Cu $Σ$5 (310) grain boundary. Changes to the grain boundary energy are found to be closely correlated with the covalent radii of the impurities and the volumetric deformations of polyhedra at the interface. The strengthening energies of each impurity are evaluated as a function of covalent radius and electronegativity, followed by first-principles-based tensile tests on selected impurities. The strengthening of a B-doped grain boundary comes from an enhancement of the charge density among the adjacent Cu atoms, which improves the connection between the two grains. Alternatively, the detrimental effect of O results from the reduction of charge density between the Cu atoms. This work deepens the understanding of the possible beneficial and harmful effects of impurities on grain boundaries, providing a guide for materials processing studies.

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arXiv2020

Combined effects of nonmetallic impurities and planned metallic dopants on grain boundary energy and strength

Most research on nanocrystalline alloys has been focused on planned doping of metals with other metallic elements, but nonmetallic impurities are also prevalent in the real world. In this work, we report on the combined effects of metallic dopants and nonmetallic impurities on grain boundary energy and strength using first-principles calculations, with a $Σ$5 (310) grain boundary in Cu chosen as a model system. We find a clear correlation between the grain boundary energy and the change in excess free volume of doped grain boundaries. A combination of a larger substitutional dopant and an interstitial impurity can fill the excess free volume more efficiently and further reduce the grain boundary energy. We also find that the strengthening effects of dopants and impurities are dominated by the electronic interactions between the host Cu atoms and the two types of dopant elements. For example, the significant competing effects of metal dopants such as Zr, Nb, and Mo with impurities on the grain boundary strength are uncovered from the density of states of the d electrons. As a whole, this work deepens the field's understanding of the interaction between metallic dopants and nonmetallic impurities on grain boundary properties, providing a guide for improving the thermal stability of materials while avoiding embrittling effects.

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arXiv2019

Amorphous intergranular films mitigate radiation damage in nanocrystalline Cu-Zr

Nanocrystalline metals are promising radiation tolerant materials due to their large interfacial volume fraction, but irradiation-induced grain growth can eventually degrade any improvement in radiation tolerance. Therefore, methods to limit grain growth and simultaneously improve the radiation tolerance of nanocrystalline metals are needed. Amorphous intergranular films are unique grain boundary structures that are predicted to have improved sink efficiencies due to their increased thickness and amorphous structure, while also improving grain size stability. In this study, ball milled nanocrystalline Cu-Zr alloys are heat treated to either have only ordered grain boundaries or to contain amorphous intergranular films distributed within the grain boundary network, and are then subjected to in situ transmission electron microscopy irradiation and ex situ irradiation. Differences in defect density and grain growth due to grain boundary complexion type are then investigated. When amorphous intergranular films are incorporated within the material, fewer and smaller defect clusters are observed while grain growth is also limited, leading to nanocrystalline alloys with improved radiation tolerance.

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arXiv2019

Prediction of a wide variety of linear complexions in face centered cubic alloys

Linear complexions are defect states that have been recently discovered along dislocations in body centered cubic Fe-based alloys. In this work, we use atomistic simulations to extend this concept and explore segregation-driven structural transitions at dislocations in face centered cubic alloys. We identify a variety of stable, nanoscale-size structural and chemical states, which are confined near dislocations and can be classified as linear complexions. Depending on the alloy system and thermodynamic conditions, such new states can preserve, partially modify, or completely replace the original defects they were born at. By considering different temperatures and compositions, we construct linear complexion diagrams that are similar to bulk phase diagrams, defining the important conditions for complexion formation while also specifying an expected complexion size and type. Several notable new complexion types were predicted here: (1) nanoparticle arrays comprised of L12 phases in Ni-Fe, Ni-Al, and Al-Zr, (2) replacement of stacking faults with layered complexions comprised of (111) planes from the Cu5Zr intermetallic phase in Cu-Zr, (3) platelet arrays comprised of two-dimensional Guinier-Preston zones in Al-Cu, and finally (4) coexistence of multiple linear complexions containing both Guinier-Preston zones and L12 phases in ternary Al-Cu-Zr. All of these new complexion states are expected to alter material properties and affect the stability of the dislocations themselves, offering a unique opportunity for future materials design.

cond-mat.mtrl-sci↗

arXiv2019

Thick amorphous complexion formation and extreme thermal stability in ternary nanocrystalline Cu-Zr-Hf alloys

Building on the recent discovery of tough nanocrystalline Cu-Zr alloys with amorphous intergranular films, this paper investigates ternary nanocrystalline Cu-Zr-Hf alloys with a focus on understanding how alloy composition affects the formation of disordered complexions. Binary Cu-Zr and Cu-Hf alloys with similar initial grain sizes were also fabricated for comparison. The thermal stability of the nanocrystalline alloys was evaluated by annealing at 950 °C (>95% of the solidus temperatures), followed by detailed characterization of the grain boundary structure. All of the ternary alloys exhibited exceptional thermal stability comparable to that of the binary Cu-Zr alloy, and remained nanocrystalline even after two weeks of annealing at this extremely high temperature. Despite carbide formation and growth in these alloys during milling and annealing, the thermal stability of the ternary alloys is mainly attributed to the formation of thick amorphous intergranular films at high temperatures. Our results show that ternary alloy compositions have thicker boundary films compared to the binary alloys with similar global dopant concentrations. While it is not required for amorphous complexion formation, this work shows that having at least three elements present at the interface can lead to thicker grain boundary films, which is expected to maximize the previously reported toughening effect.

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arXiv2019

Amorphous Intergranular Films Enable the Creation of Bulk Nanocrystalline Cu-Zr with Full Density

Nanocrystalline metal alloys show great potential as structural materials, but are often only available in small volumes such as thin films or powders. However, recent research has suggested that dopant segregation and grain boundary structural transitions between states known as complexions can dramatically alter grain size stability and potentially enable activated sintering. In this study, we explore strategic consolidation routes for mechanically alloyed Cu-4 at.% Zr powders to capture the effects of amorphous complexion formation on the densification of bulk nanostructured metals. We observed an increase in density of the consolidated samples which coincides with the formation of amorphous intergranular films. At the same time, the grain size is reasonably stable after exposure to these temperatures. As a result, we are able to produce a bulk nano-grained metal with a grain size of 57 nm and a density of 99.8%, which shows an impressive balance of small grain size and high density using simple consolidation techniques.

cond-mat.mtrl-sci↗

arXiv2019

Linear complexions: Metastable phase formation and coexistence at dislocations

The unique three-phase coexistence of metastable B2-FeNi with stable L10-FeNi and L12-FeNi3 is discovered near edge dislocations in body-centered cubic Fe-Ni alloys using atomistic simulations. Stable nanoscale precipitate arrays, formed along the compression side of dislocation lines and defined as linear complexions, were observed for a wide range of compositions and temperatures. By analyzing the thermodynamics associated with these phase transitions, we are able to explain the metastable phase formation and coexistence, in the process defining new research avenues for theoretical and experimental investigations.

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arXiv2018

In situ high-cycle fatigue reveals the importance of grain boundary structure in nanocrystalline Cu-Zr

Nanocrystalline metals typically have high fatigue strengths, but low resistance to crack propagation. Amorphous intergranular films are disordered grain boundary complexions that have been shown to delay crack nucleation and slow crack propagation during monotonic loading by diffusing grain boundary strain concentrations, suggesting they may also be beneficial for fatigue properties. To probe this hypothesis, in situ transmission electron microscopy fatigue cycling is performed on Cu-1 at.% Zr thin films thermally treated to have either only ordered grain boundaries or to contain amorphous intergranular films. The sample with only ordered grain boundaries experienced grain coarsening at crack initiation followed by unsteady crack propagation and extensive nanocracking, whereas the sample containing amorphous intergranular films had no grain coarsening at crack initiation followed by steady crack propagation and distributed plastic activity. Microstructural design for control of these behaviors through simple thermal treatments can allow for the improvement of nanocrystalline metal fatigue toughness.

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arXiv2018

Atomistic modeling of interfacial segregation and structural transitions in ternary alloys

Grain boundary engineering via dopant segregation can dramatically change the properties of a material. For metallic systems, most current studies concerning interfacial segregation and subsequent transitions of grain boundary structure are limited to binary alloys, yet many important alloy systems contain more than one type of dopant. In this work, hybrid Monte Carlo/molecular dynamics simulations are performed to investigate the behavior of dopants at interfaces in two model ternary alloy systems: Cu-Zr-Ag and Al-Zr-Cu. Trends in boundary segregation are studied, as well as the propensity for the grain boundary structure to become disordered at high temperature and doping concentration. For Al-Zr-Cu, we find that the two solutes prefer to occupy different sites at the grain boundary, leading to a synergistic doping effect. Alternatively, for Cu-Zr-Ag, there is site competition because the preferred segregation sites are the same. Finally, we find that thicker amorphous intergranular films can be formed in ternary systems by controlling the concentration ratio of different solute elements.

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arXiv2018

Concurrent transitions in wear rate and surface microstructure in nanocrystalline Ni-W

Nanocrystalline metals are promising materials for wear-resistant applications due to their superior strength and hardness, but prior work has shown that cyclic loading can lead to coarsening. In this study, scratch wear tests were carried out on nanocrystalline Ni-19 at.% W films with an as-deposited grain size of 3 nm, with systematic characterization performed after different wear cycles. A new gradient nanograined microstructure is observed and a direct connection between wear rate and subsurface microstructure is discovered. A second Ni-W specimen with the same composition and a 45 nm average grain size is produced by annealing the original specimen. Subsequent wear testing shows that an identical subsurface microstructure is produced in this sample, emphasizing the importance of the cross-over in deformation mechanisms for determining the steady-state grain size during wear.

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arXiv2018

Pronounced grain boundary network evolution in nanocrystalline Cu subjected to large cyclic strains

The grain boundary network of nanocrystalline Cu foils was modified by the systematic application of cyclic loadings and elevated temperatures having a range of magnitudes. Most broadly, the changes to the boundary network were directly correlated to the applied temperature and accumulated strain, including a 300% increase in the twin length fraction. By independently varying each treatment variable, a matrix of grain boundary statistics was built to check the plausibility of hypothesized mechanisms against their expected temperature and stress/strain dependences. These comparisons allow the field of candidate mechanisms to be significantly narrowed. Most importantly, the effect of temperature and strain on twin length fraction were found to be strongly synergistic, with the combined effect being ~150% that of the summed individual contributions. Looking beyond scalar metrics, an analysis of the grain boundary network showed that twin related domain formation favored larger sizes and repeated twin variant selection over the creation of many small domains with diverse variants. Taken together, the evidence indicates that shear-coupled boundary migration twinning is the most likely explanation for grain boundary engineering in nanocrystalline Cu.

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