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Tommy Meier

Publications and source records attributed to Tommy Meier.

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Bistable Organic Electrochemical Transistors: Enthalpy vs. Entropy

Organic electrochemical transistors (OECTs) underpin a range of emerging technologies, from bioelectronics to neuromorphic computing, owing to their unique coupling of electronic and ionic charge carriers. In this context, various OECT systems exhibit significant hysteresis in their transfer curve, which is frequently leveraged to achieve non-volatility. Meanwhile, a general understanding of its physical origin is missing. Here, we introduce a thermodynamic framework that readily explains the emergence of bistable OECT operation via the interplay of enthalpy and entropy. We validate this model through temperature-resolved characterizations, material manipulation, and thermal imaging. Further, we reveal deviations from Boltzmann statistics for the subthreshold swing and reinterpret existing literature. Capitalizing on these findings, we finally demonstrate a single-OECT Schmitt trigger, thus compacting a multi-component circuit into a single device. These insights provide a fundamental advance for OECT physics and its application in non-conventional computing, where symmetry-breaking phenomena are pivotal to unlock new paradigms of information processing.

physics.app-ph

A Hybrid Process for Integration of Organic Electrochemical Transistors for High Uniformity & Reliability

Photolithography is believed to be a complementary technique to large-area printing, allowing for nanometer-scale integration and offering cost-efficiency. For organic electronics though, adapting photolithography is very challenging due to chemical incompatibilities. However, with the help of Alexander Zakhidov, orthogonal resins opened up the prospect of adapting the well-established process of photolithography for organic electronics. Here, we present a hybrid fabrication method for organic electrochemical transistors by combining orthogonal photolithography and inkjet printing, enabling high uniformity and reliability. We demonstrate how the resolution of each process affects the uniformity, and we explore the advantages of this process for device scaling and circuit integration.

physics.app-ph