arXiv subjects

Tongyu Zhao

Publications and source records attributed to Tongyu Zhao.

5 recordsLinked to original sources

arXiv2024

Fabrication and characterization of low-loss Al/Si/Al parallel plate capacitors for superconducting quantum information applications

Increasing the density of superconducting circuits requires compact components, however, superconductor-based capacitors typically perform worse as dimensions are reduced due to loss at surfaces and interfaces. Here, parallel plate capacitors composed of aluminum-contacted, crystalline silicon fins are shown to be a promising technology for use in superconducting circuits by evaluating the performance of lumped element resonators and transmon qubits. High aspect ratio Si-fin capacitors having widths below $300nm$ with an approximate total height of 3$μ$m are fabricated using anisotropic wet etching of Si(110) substrates followed by aluminum metallization. The single-crystal Si capacitors are incorporated in lumped element resonators and transmons by shunting them with lithographically patterned aluminum inductors and conventional $Al/AlO_x/Al$ Josephson junctions respectively. Microwave characterization of these devices suggests state-of-the-art performance for superconducting parallel plate capacitors with low power internal quality factor of lumped element resonators greater than 500k and qubit $T_1$ times greater than 25$μ$s. These results suggest that Si-Fins are a promising technology for applications that require low loss, compact, superconductor-based capacitors with minimal stray capacitance.

quant-ph↗

arXiv2023

Implementing two-qubit gates at the quantum speed limit

The speed of elementary quantum gates, particularly two-qubit gates, ultimately sets the limit on the speed at which quantum circuits can operate. In this work, we experimentally demonstrate commonly used two-qubit gates at nearly the fastest possible speed allowed by the physical interaction strength between two superconducting transmon qubits. We achieve this quantum speed limit by implementing experimental gates designed using a machine learning inspired optimal control method. Importantly, our method only requires the single-qubit drive strength to be moderately larger than the interaction strength to achieve an arbitrary two-qubit gate close to its analytical speed limit with high fidelity. Thus, the method is applicable to a variety of platforms including those with comparable single-qubit and two-qubit gate speeds, or those with always-on interactions. We expect our method to offer significant speedups for non-native two-qubit gates that are typically achieved with a long sequence of single-qubit and native two-qubit gates.

quant-ph↗

arXiv2022

Towards merged-element transmons using silicon fins: the FinMET

A merged-element transmon (MET) device, based on silicon (Si) fins, is proposed and the first steps to form such a "FinMET" are demonstrated. This new application of fin technology capitalizes on the anisotropic etch of Si(111) relative to Si(110) to define atomically flat, high aspect ratio Si tunnel barriers with epitaxial superconductor contacts on the parallel side-wall surfaces. This process circumvents the challenges associated with the growth of low-loss insulating barriers on lattice matched superconductors. By implementing low-loss, intrinsic float-zone Si as the barrier material rather than commonly used, potentially lossy AlOx, the FinMET is expected to overcome problems with standard transmons by (1) reducing dielectric losses, (2) minimizing the formation of two-level system spectral features, (3) exhibiting greater control over barrier thickness and qubit frequency spread, especially when combined with commercial fin fabrication and atomic-layer digital etching; (4) potentially reducing the footprint by several orders of magnitude; and (5) allowing scalable fabrication. Here, as a first step to making such a device, the fabrication of Si fin capacitors on Si(110) substrates with shadow-deposited Al electrodes is demonstrated. These fin capacitors are then fabricated into lumped element resonator circuits and probed using low-temperature microwave measurements. Further thinning of silicon junctions towards the tunneling regime will enable the scalable fabrication of FinMET devices based on existing silicon technology, while simultaneously avoiding lossy amorphous dielectrics for the tunnel barriers.

quant-ph↗

arXiv2021

A universal quantum gate set for transmon qubits with strong ZZ interactions

High-fidelity single- and two-qubit gates are essential building blocks for a fault-tolerant quantum computer. While there has been much progress in suppressing single-qubit gate errors in superconducting qubit systems, two-qubit gates still suffer from error rates that are orders of magnitude higher. One limiting factor is the residual ZZ-interaction, which originates from a coupling between computational states and higher-energy states. While this interaction is usually viewed as a nuisance, here we experimentally demonstrate that it can be exploited to produce a universal set of fast single- and two-qubit entangling gates in a coupled transmon qubit system. To implement arbitrary single-qubit rotations, we design a new protocol called the two-axis gate that is based on a three-part composite pulse. It rotates a single qubit independently of the state of the other qubit despite the strong ZZ-coupling. We achieve single-qubit gate fidelities as high as 99.1% from randomized benchmarking measurements. We then demonstrate both a CZ gate and a CNOT gate. Because the system has a strong ZZ-interaction, a CZ gate can be achieved by letting the system freely evolve for a gate time $t_g=53.8$ ns. To design the CNOT gate, we utilize an analytical microwave pulse shape based on the SWIPHT protocol for realizing fast, low-leakage gates. We obtain fidelities of 94.6% and 97.8% for the CNOT and CZ gates respectively from quantum progress tomography.

quant-ph↗

arXiv2020

Overlap junctions for superconducting quantum electronics and amplifiers

Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated a two-layer, submicrometer-scale overlap junction fabrication process suitable for qubits with long coherence times. Here, we extend the overlap junction fabrication process to micrometer-scale junctions. This allows us to fabricate other superconducting quantum devices. For example, we demonstrate an overlap-junction-based Josephson parametric amplifier that uses only 2 layers. This efficient fabrication process yields frequency-tunable devices with negligible insertion loss and a gain of ~ 30 dB. Compared to other processes, the overlap junction allows for fabrication with minimal infrastructure, high yield, and state-of-the-art device performance.

physics.app-ph↗