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Vahid Askarpour

Publications and source records attributed to Vahid Askarpour.

7 recordsLinked to original sources

First-principles analysis of intravalley and intervalley electron-phonon scattering in thermoelectric materials

Intervalley collisions, which scatter electrons from one valley or band to another, can be detrimental to thermoelectric performance in materials with multiple valleys/bands. In this study, density functional theory is used to investigate the electron-phonon scattering characteristics of three lead chalcogenides (PbS, PbSe, PbTe) and three half-Heuslers (ScNiBi, ScPdSb, ZrNiSn), which all possess multiple equivalent conduction valleys, in order to characterize and analyze their intravalley/intervalley components. To elucidate what controls the degree of intravalley and intervalley transitions, the scattering rates are decomposed into the product of the phase space (a measure of how much scattering is possible) and the average electron-phonon coupling. To help guide the search for improved thermoelectric and high-conductivity materials, simple and approximate approaches are demonstrated that can be adopted to identify materials with reduced intervalley scattering, which circumvent the need for computationally-demanding electron-phonon scattering calculations. In addition, the benefits of selecting materials with large-energy zone-edge phonons are explored in the limit $\hbarω\gg k_BT$, and found to potentially suppress intervalley processes by up to an order of magnitude, leading to a 70% and 100% increase in conductivity and power factor, respectively.

cond-mat.mtrl-sci

A Nanometer-Thick Oxide Semiconductor Transistor with Ultra-High Drain Current

High drive current is a critical performance parameter in semiconductor devices for high-speed, low-power logic applications or high-efficiency, high-power, high-speed radio frequency (RF) analog applications. In this work, we demonstrate an In2O3 transistor grown by atomic layer deposition (ALD) at back-end-of-line (BEOL) compatible temperatures with a record high drain current exceeding 10 A/mm, the performance of which is 2-3 times better than all known transistors with semiconductor channels. A record high transconductance of 4 S/mm is also achieved among all transistors with a planar structure. It is found that a high carrier density and high electron velocity both contribute to this remarkably high on-state performance in ALD In2O3 transistors, which is made possible by the high-quality oxide/oxide interface, the metal-like charge-neutrality-level (CNL) alignment, and the high band velocities induced by the low density-of-state (DOS). Experimental Hall, I-V and split C-V measurements at room temperature confirm a high carrier density up to 6-7*10^13 /cm2 and a high velocity of about 10^7 cm/s. Ultra-thin oxide semiconductors, with a CNL located deep inside the conduction band, represent a promising new direction for the search of alternative channel materials for high-performance semiconductor devices.

cond-mat.mes-hall

A Gate-All-Around Single-Channel In2O3 Nanoribbon FET with Near 20 mA/μm Drain Current

In this work, we demonstrate atomic-layer-deposited (ALD) single-channel indium oxide (In2O3) gate-all-around (GAA) nanoribbon FETs in a back-end-of-line (BEOL) compatible process. A maximum on-state current (ION) of 19.3 mA/μm (near 20 mA/μm) is achieved in an In2O3 GAA nanoribbon FET with a channel thickness (TIO) of 3.1 nm, channel length (Lch) of 40 nm, channel width (Wch) of 30 nm and dielectric HfO2 of 5 nm. The record high drain current obtained from an In2O3 FET is about one order of magnitude higher than any conventional single-channel semiconductor FETs. This extraordinary drain current and its related on-state performance demonstrate ALD In2O3 is a promising oxide semiconductor channel with great opportunities in BEOL compatible monolithic 3D integration.

physics.app-ph

Unusual thermoelectric transport anisotropy in quasi-2D, rhombohedral GeTe

In this study, we calculate the $T$=300 K scattering and thermoelectric transport properties of rhombohedral GeTe using first-principles modeling. The room-temperature phase of GeTe has a layered structure, with cross-plane and in-plane directions oriented parallel and perpendicular to [111], respectively. Based on rigorous electron-phonon scattering, our transport calculations reveal unusual anisotropic properties; n-type GeTe has a cross-plane electrical conductivity that is roughly 3$\times$ larger than in-plane. p-type GeTe, however, displays opposite anisotropy with in-plane conducting roughly 2$\times$ more than cross-plane, as is expected in quasi-2D materials. The power factor shows the same anisotropy as the electrical conductivity, since the Seebeck coefficient is relatively isotropic. Interestingly, cross-plane n-GeTe shows the largest mobility and power factor approaching 500 cm$^2$/V-s and 32 $μ$W/cm-K$^2$, respectively. The thermoelectric figure-of-merit, $zT$, is enhanced as a result of this unusual anisotropy in n-GeTe since the lattice thermal conductivity is minimized along cross-plane. This decouples the preferred transport directions of electrons and phonons, leading to a threefold increase in $zT$ along cross-plane compared to in-plane. The n-type anisotropy results from high-velocity electron states formed by Ge p-orbitals that span across the interstitial region. This surprising behavior, that would allow the preferential conduction direction to be controlled by doping, could be observed in other quasi-2D materials and exploited to achieve higher-performance thermoelectrics.

cond-mat.mtrl-sci

Phonon transport across a Si-Ge interface: the role of inelastic bulk scattering

Understanding phonon transport across heterojunctions is important to achieve a wide range of thermal transport properties. Using the McKelvey-Shockley flux method with first-principles modeling, we theoretically investigate the phonon transport properties of a Si-Ge interface with a focus on the role of inelastic bulk phonon processes. We observe significant inelastic scattering near the interface that redistributes the heat among the phonons as a result of non-equilibrium effects driven by the junction. These effects are most pronounced when the length of the junction is comparable to the average phonon mean-free-path. What controls these inelastic processes is elucidated.

cond-mat.mes-hall

On the Calculation of Lorenz Numbers for Complex Thermoelectric Materials

A first-principles informed approach to the calculation of Lorenz numbers for complex thermoelectric materials is presented and discussed. Example calculations illustrate the importance of using accurate band structures and energy-dependent scattering times. Results obtained by assuming that the scattering rate follows the density-of-states show that in the non-degenerate limit, Lorenz numbers below the commonly assumed lower limit of 2(kB/q)^2 can occur. The physical cause of low Lorenz numbers is explained by the shape of the transport distribution. The numerical and physical issues that need to be addressed in order to produce accurate calculations of the Lorenz number are identified. The results of this study provide a general method that should contribute to the interpretation of measurements of total thermal conductivity and to the search for materials with low Lorenz numbers, which may provide improved thermoelectric figures of merit, zT.

cond-mat.mtrl-sci

Thermoelectric Band Engineering: The Role of Carrier Scattering

Complex electronic band structures, with multiple valleys or bands at the same or similar energies can be beneficial for thermoelectric performance, but the advantages can be offset by inter-valley and inter-band scattering. In this paper, we demonstrate how first-principles band structures coupled with recently developed techniques for rigorous simulation of electron-phonon scattering provide the capabilities to realistically assess the benefits and trade-offs associated with these materials. We illustrate the approach using n-type silicon as a model material and show that intervalley scattering is strong. This example shows that the convergence of valleys and bands can improve thermoelectric performance, but the magnitude of the improvement depends sensitively on the relative strengths of intra- and inter-valley electron scattering. Because anisotropy of the band structure also plays an important role, a measure of the benefit of band anisotropy in the presence of strong intervalley scattering is presented.

cond-mat.mtrl-sci