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Wentao Mao

Publications and source records attributed to Wentao Mao.

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Giant Flat Band Amplification via Inertial Anchors

In electronic materials, flat bands are associated with compact electron localization, with implications for superconductivity, ferromagnetism and strongly correlated systems. The physical significance of their counterparts in elastic media is far less charted. Here we report a strategy to achieve elastic flat bands through an inertial retrofitting of classical lattice architectures. The idea is to alter the cell geometry to realize a network of inertial anchors, effectively partitioning the lattice into an array of weakly coupled emergent resonators, whose resonances appear as flat bands in the phonon spectrum. We demonstrate flat-band conditions that combine localized and extended state attributes and induce a giant response that is spatially and temporally persistent. Laser vibrometry experiments reveal three signatures of this mechanism: amplification up to two orders of magnitude compared to pass band and band gap conditions, multi-cell activation that is agnostic to the source location, and a persistent transient response even after several excitation cycles.

cond-mat.mtrl-sci

Rubber-to-glass adhesion between a rigid sphere and a shape memory polymer substrate of finite thickness

Shape memory polymers (SMPs) are emerging as innovative smart adhesive materials with broad application potential. Compared to conventional elastomeric adhesives, SMP adhesives are distinguished by the so-called rubber-to-glass (R2G) adhesion, which involves contact in the rubbery state followed by detachment in the glassy state. This process, through a shape-locking effect, enhances adhesion strength by more than an order of magnitude compared to conventional adhesive contact. Here, we investigate the fundamental problem of a rigid sphere undergoing R2G adhesion with an SMP substrate of finite thickness through experiments, finite element (FE) simulations, and theoretical modeling. It is demonstrated that during press-in, the contact problem can be modeled as a rigid oblate spheroid contacting an infinite substrate, while the pull-off process can be described by a modified ball-and-socket model. These equivalent models yield practically useful analytical solutions for the contact radius during press-in and the R2G adhesion force during pull-off. A critical thickness-to-contact-radius ratio of around 5 is identified, below which the thickness effect becomes significant. These insights provide valuable guidance for the design and application of SMP-based smart adhesives.

cond-mat.soft